Saki Demonstrates 3D SPI, AOI, AXI, and 2D Bottom-side AOI at IPC APEX Expo Booth 1407
See Saki's M2M communication in action at the Fuji booth 1317 and Hermes/CFX production line Fremont, CA - 22 January...
No Open Vias in or Near PCB Pads
By Duane Benson, Chief Technology Champion at Screaming Circuits The term "via" probably comes from the Latin word meaning "road."...
MACOM Introduces Broadband, Multistage GaN-on-Si Power Amplifier Module
10W fully-matched, two-stage PA covers the 225 – 2600 MHz frequency range Top-side and bottom-side mounting flexibility streamlines designs for smaller, lighter...
2019 Small Motor Industry Development and Technology Forum
INVITATION --The 17th Shenzhen (China) International Small Motor, Electric Machinery & Magnetic Materials Exhibition Organizers: National Engineering Research Center for...
MaxLinear’s G.hn Wave-2 Platform, Now at Mouser, Offers High-Speed Wired Connectivity on Legacy Mediums
January 21, 2019 – Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now...
Haptik launches voice bots, builds first automated voice ordering bots for KFC
This is the first automated voice ordering bots for QSR industry in India Customers can ask for the delivery menu,...
Bel Introduces the USB 2.0 Combination MagJack ® ICMs
Bel Magnetic Solutions, a Bel group company (NASDAQ: BELFA and BELFB) and global leader in design and manufacturing of MagJack...
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