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Renesas Expands Satellite Communications Portfolio with Industry’s First Commercial Dual-Beam Active Beamforming IC Lineup

Electronics Maker by Electronics Maker
November 16, 2021
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New F61xx ICs Deliver Low-Power, High-Integration for Phased Array Antennas in Satcom, Radar, and Point-to-Point Communications Systems

Dual-Beam Active Beamforming ICs for Phased Array Antennas

November 16, 2021

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its portfolio of mmWave LNAs and Tx BFICs with the introduction of three new dual-beam active beamforming ICs:

• F6121 for Ku-band Satcom

• F6122 for Ka-band Satcom and

• F6123 for Ku-band radar and line-of-sight communications

Featuring best-in-class power consumption, noise figure, compact size and ease of integration, these new ICs are a critical enabler of next-generation, low-latency electronically steered antennas for in-flight connectivity (IFC), maritime, satcom-on-the-move, and low earth orbit (LEO) ground terminals.

The new F61xx Rx devices are the first commercial products to feature dual-beam capability for make-before-break or simultaneous multi-satellite, multi-orbit operation over the full Ku and Ka Satcom bands. The F61xx offers OEMs the flexibility of LNA selection and placement for improved noise figure and system G/T performance. Taking advantage of these features, the ICs have already been designed-in by major satcom solution providers and OEMs for half- and full-duplex systems, with anticipated production ramps starting in 2022.

“Our customers face three main challenges as they migrate from mechanical antennas to electronically steered antennas: Thermal management, physical integration and affordability,” said Naveen Yanduru, Vice President of RF Communications Product Division at Renesas. “The new dual-beam F61xx devices deliver the cost-effective, power-efficient, low noise and compact size combination the industry needs for next-generation low-latency Satcom, radar and communications systems that will connect more people in more places.”

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