Electronics Maker
  • Home
  • Electronics News
  • Articles
  • Magazine
  • Events
  • Interview
  • Electronics Projects
No Result
View All Result
  • Home
  • Electronics News
  • Articles
  • Magazine
  • Events
  • Interview
  • Electronics Projects
No Result
View All Result
Electronics Maker
No Result
View All Result
Home Electronics News

STMicroelectronics Drives G3-PLC Hybrid Connectivity into Smart Devices with ST8500 Development Ecosystem

Electronics Maker by Electronics Maker
March 11, 2021
in Electronics News
0
0
SHARES
119
VIEWS
Share on FacebookShare on Twitter

Mar 11, 2021: To accelerate G3-PLC Hybrid connectivity in smart-grid and IoT devices, STMicroelectronics has revealed a development ecosystem for its ST8500 programmable power-line communication (PLC) modem chipset.

Comprising two evaluation boards targeting 868MHz and 915MHz license-free RF bands, with documented firmware, the ecosystem helps users quickly build and test nodes that comply with G3-PLC Hybrid, the industry’s first published standard for dual PLC & RF connectivity.

Equipment such as smart meters, environmental monitors, lighting controllers, and industrial sensors containing the ST8500 chipset, which supports G3-PLC Hybrid, can select the powerline or wireless channel autonomously and change dynamically to ensure the most reliable connection.

Launched in 2019, the chipset combines the ST8500 protocol controller System-on-Chip (SoC), which runs ST’s G3-PLC Hybrid firmware, with the STLD1 powerline communication (PLC) line driver and S2-LP sub-GHz radio. Devices containing the chipset are backward-compatible and interoperable with any G3-PLC network.

ST’s hybrid protocol stack is based on G3-PLC, IEEE 802.15.4, 6LowPAN and IPv6 open standards. By embedding support for RF Mesh at the physical (PHY) and data-link layers, the ST8500 combines the strengths of powerline and wireless mesh networking for communication between smart nodes and data collectors. Unlike simple point-to-point links, hybrid mesh networking interconnects nodes extensively to improve reliability, strengthen fault-tolerant connections, and extend communication distance.

The two new hardware development kits handle PLC & RF connectivity as well as application processing. The EVLKST8500GH868 kit is configured for 868MHz RF operation as recommended in the EU, while the EVLKST8500GH915 kit operates in the 915MHz band used throughout the Americas and Asia. Each kit comes with the STSW-ST8500GH software framework and documentation.

Ready to combine with an STM32 Nucleo board for scalable application processing and compatible with ST’s large portfolio of X-NUCLEO expansion boards for convenient function extension, the kits provide a platform for developing a wide range of smart-grid and IoT applications.

The EVLKST8500GH868 and EVLKST8500GH915 are available now from ST and distributors, for $250.

For more information please go to www.st.com/st8500-pr

Tags: SoC
Electronics Maker

Electronics Maker

Subscribe Newsletter

Subscribe to our mailing list to receives daily updates direct to your inbox!

*we hate spam as much as you do

Electronics Maker

It is a professionally managed electronics print media with highly skilled staff having experience of this respective field.

Subscribe Newsletter

Subscribe to our mailing list to receives daily updates direct to your inbox!

*we hate spam as much as you do

Quick Links

  • »   Electronics News
  • »   Articles
  • »   Magazine
  • »   Events
  • »   Interview
  • »   About Us
  • »   Contact Us

Contact Us

EM Media LLP
  210, II nd Floor, Sager Plaza – 1, Road No-44,, Plot No-16, Pitampura, New Delhi - 110034
  01145629941
  info@electronicsmaker.com
  www.electronicsmaker.com

  • Advertise with Us
  • Careers
  • Terms Of Use
  • Privacy Policy
  • Disclaimer
  • Cookie Policy

© 2020 Electronics Maker. All rights reserved.

No Result
View All Result
  • Home
  • Electronics News
  • Articles
  • Magazine
  • Events
  • Interview
  • Electronics Projects

© 2020 Electronics Maker. All rights reserved.