ASM opens up new possibilities in high-volume solder paste printing
As part of its “Release Summer 2020” event, technology leader ASM has presented additional functions for its high-volume DEK TQ printer, which sets new records in terms of speed, floor space performance and wet-printing accuracy. With its perfectly matched combination of print head, paste dispenser and innovative understencil cleaning system, the DEK TQ can operate for up to 8 hours without an operator assist. With its new hardware and software options, the printer features even more capabilities now. The innovations comprise its offline programming, the DEK TQ V1 operating software, the High Flow Vacuum board support system, and the intelligent and flexible verification and traceability functions.
With new options and software enhancements presented at the Release 2020 event, technology leader ASM further improves the operability and capabilities of its DEK TQ stencil printer. The High Flow Vacuum function, for example, provides an affordable and highly efficient board support solution for the high-volume production of small and highly complex PCBs.
The new and highly flexible and intelligent verification function allows the verification of all printer materials either by means of the ASM OIB, with an interface to a higher-level MES (ideal for testing and releasing the solder paste) or individually selectable against a reference on the DEK TQ for supports, squeegees, etc.
Together with the sophisticated traceability functions, this provides an ideal connection of the DEK TQ to the Smart Factory.
New software
The DEK V1 station software and SIPLACE Pro have been revised from the ground up. With ASM Printer Programming and its integration into SIPLACE Pro, central program management is being raised to a new level. Printing programs are now administered across lines, printing and placement programs downloaded jointly to SMT lines, and each printer’s features are verified automatically before a program is executed.
DEK TQ – the standard for high-volume production
The DEK TQ sets new standards in performance, efficiency and precision. In a footprint of only 1.3 by 1.0 meters, the high-volume printer achieves a core cycle time of as little as five seconds for maximum throughput. With its use of precise linear drives, off-belt printing, innovative clamping systems and an advanced print head, the DEK TQ achieves a wet-printing accuracy of ±17.5 µm @ 2 Cpk – more than enough to reliably print the pads for 0201 metric components and modern ultra-fine-pitch applications. Each machine comes with an external capability certification. Open interfaces like IPC-Hermes-9852, Closed-Loop-to-SPI, ASM OIB and IPC CFX make it easy to integrate the DEK TQ into a smart integrated factory. They also deliver additional investment protection. With its highly efficient understencil cleaning system featuring an extra-large fabric roll and additional tanks as well as its automatic print head and dispenser system, the printer can run for up to 8 hours with no operator assist.
For more information about the DEK TQ, visit https://www.asm-smt.com/en/products/printing-solutions/dek-tq/ .
Illustrations for downloading
Source: ASM
The following printable illustrations are available for downloading:
http://www.htcm.de/kk/asm
The DEK TQ stands for maximum precision and industry-leading performance. With its Release Summer 2020, ASM extends the function spectrum of its high-end high-volume printers even further.
Source: ASM
The SMT Solutions segment within the ASM Pacific Technology Group
The mission of the SMT Solutions segment within the AMS Pacific Technology Group (ASMPT) is to implement and support the smart SMT factory at electronics manufacturers worldwide.
ASM solutions such as SIPLACE placement systems and DEK printing systems support the networking, automation and optimization of central workflows with hardware, software and services that enable electronics manufacturers to transition to the smart SMT factory in stages and enjoy dramatic improvements in productivity, flexibility and quality.
Since maintaining close relationships with customers and partners is a central component of ASM’s strategy, the company has established the SMT Smart Network as a global forum for the active exchange of information between and with smart champions. In addition to being a founding member of the ADAMOS joint venture for the development of an IIoT platform for manufacturing companies, ASM is establishing together with other SMT manufacturers the open HERMES standard as a successor to the SMEMA standard for M2M communication in SMT lines.
For more information about ASM, visit www.asm-smt.com.
