Indium Corporation will feature its precisionmaterialsfor high-reliability 5G communicationsduring theInternational Microwave Symposium (IMS) virtual exhibition from Aug. 4-6.
Indium Corporation provides a suite of leading-edge materials and technology expertise to solve the evolving challenges of 5G communication applications. This includes AuLTRA®ThInFORMS™—0.00035” thick (0.00889mm or 8.89μm) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers commonly used in 5G communication infrastructure.
AuLTRA®ThInFORMS™ help combat common issues, such as:
- Shorting—reduced solder volume inhibits wicking up the
die, minimizing the risk of shorting
- Poor thermal transfer—the ultra-thin 0.00035” preform
reduces bond-line thickness (BLT), thus improving thermal
transfer and increasing the longevity and performance of the
device
Indium Corporation also offers off-eutectic AuSn alloy options. These materials are designed to control wetting and voiding, yielding a high-reliability solder joint for critical high-power, high-frequency applications.
The IMS virtual exhibition will facilitate the benefits of a face-to-face trade show on a digital platform. For information on this topic or to chat with our experts, visit Indium Corporation’s virtual booth.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier
to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
