Early adopters lining up; silicon data and PDK to be delivered this summer
Bizen®, the new transistor technology that is challenging CMOS, promising to slash lead times and reduce wafer area and process layers while increasing speed, reducing power and increasing density, as a direct result of successful first silicon tests, is set to benefit from investment in new process equipment which will expedite its development. Already, one wafer run is being produced every month by manufacturing ally, Semefab, and initial analysis is very positive for both power and digital circuits.
Explains David Summerland, CEO and founder of Nottingham-based Search For The Next (SFN) which is developing the Bizen technology: “We are working closely with Semefab to get products to market as quickly as possible – ideally by the end of the year. No special fab equipment is required, but we are making strategic investments in capital equipment to ensure that the prototyping and proving processes are completed without delay.”
This aggressive timescale is only possible because one of the key attributes of Bizen is that it reduces leadtimes from 15 weeks – which is typical for CMOS – to just 12 days. Bizen also halves the number of process layers required while equalling or bettering the speed and low power capabilities offered by current CMOS devices.
Concludes Summerland: “Based on our initial results which have exceeded our expectations, we are already looking to contract with early adopters; on completion of signing, we will release the PDK to them. We expect to present comprehensive test data on initial silicon at the end of the summer together with details of our first product plans.”
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