Indium Corporation will feature its LV1000 flux-coated solder preforms for 5G infrastructure at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, in Boston, Massachusetts.
Indium Corporation’s LV1000 answers the demands of 5G wireless infrastructure by delivering superior reliability and performance. LV1000 produces lower voiding as compared to conventional solders, especially for bottom termination components (BTCs), which do not allow for proper outgassing of volatized flux. Its glossy, uniform flux coating eliminates the fluxing step. Combined with its durability, LV1000 can be integrated easily into automated assembly processes.
LV1000 technology consists of both a unique flux formulation and a coating process to produce flux-coated solder preforms that meet the tightest tolerances for flatness. This minimizes defects by ensuring that electronic components solder correctly.
For more information about LV1000, visit www.indium.com/LV1000.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
