Rehm seminar in Mexico scheduled for mid-February
What are the causes of soldering defects? And what methods can be used to avoid precisely such soldering defects? Answers to these questions will be provided at a two-day Rehm seminar to be held at the Rehm Technology Centre in Guadalajara, Mexico on February 13 and 14.
Luis Garcia, Managing Director of Rehm Mexico, will present the most important news as well as Rehm’s portfolio and innovations to the seminar participants. The first seminar day, dedicated entirely to reflow profiling, will then begin. Dr. Hans Bell, Head of R&D at Rehm Thermal Systems, will present the reflow profiling basics: standards, guidelines, measurement options, and factors affecting the reflow profile. The effect of process-related factors on soldering quality, such as wetting, will be examined in the afternoon.
Defect management in electronics production will be the main topic on the second day of the seminar. Dr. Hans Bell will take a look at reflow soldering defects such as solder balling/spatter or solder beading – while explaining the causes of voids and strategies to prevent these. Both seminar days will offer enough discussion time for participants to exchange specialist information.
The seminar still has free places. If you are interested, please contact Karina Pelayo (Tel: +52 (33) 3855-5671 or send an e-mail to karina.pelayo@rehmgroup.com).
Attached is a picture of Dr. Hans Bell, who will conduct the seminar.
