Irvine California, USA – TopLine will exhibit its unique CCGA Column Grid Array technology in the USA Pavilion at the Electronica trade fair and conference in Munich, Germany, Nov 13-16, 2018. The exhibit will be in Booth B6-458.
TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. Many people, according to TopLine CEO Martin Hart, are still unaware of the benefits that solder columns provide to reduce stress caused by CTE mismatch when interconnecting area array packages and the PC board. CCGA technology increases life for FPGA (Field Programmable Gate Arrays). CCGAs are better than BGAs for rugged operating environments.
For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html. For more information about Electronica, visit https://electronica.de/.
