Indium Corporation’s Jeffrey Len, Technical Support Engineer, will share his expertise at the SMTA Southeast Asia Technical Conference on Electronics Assembly on Tuesday, May 22, at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia.
Len will present Impact of Stencil Quality on Solder Paste Printing Performance. Noting the increasing packaging and board level assembly miniaturization trends, Len will examine how stencil quality impacts the screen printing process.
Len has extensive experience in improving customer processes and developing close customer relationships to understand and service individual needs. He has comprehensive technical knowledge in the selection, use, and application of Indium Corporation’s entire range of products. Len earned his bachelor’s degree in pure chemistry from Universti Sains Malaysia in Penang, Malaysia.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
