Munich, Germany, and Barcelona, Spain – 23 February 2018 – Microelectronics connects the digital world of data with the real world of things. From sensors to security chips: Infineon Technologies AG will be presenting key components for intelligent and secure interaction in a connected world at the Mobile World Congress (MWC) in Barcelona from 26 February to 1 March 2018. You can discover them for yourself at stand 6C41 in Hall 6.
Human-machine interaction of the future
In the future, smart devices will be as normal for us as electric lighting is today: Humans and machines will then no longer communicate via a keyboard, but by means of voice, gestures and facial expressions. The number of digital assistants is growing at a rapid pace – and hence so too is the demand for high-performance electronics. Sensors enable smart devices to see, hear and “understand” their environment. Infineon shows what is possible through a combination of smart sensors, for example, XENSIV™ radar sensors can make fitness applications intelligent. Applications with additional XENSIV™ MEMS microphones allow visitors to experience how communication with intelligent machines might look in the future.
Smart home
Switch on your washing machine on the way home, order the latest gadgets from your sofa using a digital assistant, or feel more comfortable thanks to sensor-controlled air-conditioning systems. Smart homes have a growing range of devices with intelligent functions that need to be protected against manipulation and unauthorized access. Semiconductors already enable the required functionality today. Infineon will demonstrate that protection with its XENSIV™ sensors and the new OPTIGA™ Trust-X security solution.
Security on the road
Mobile devices are the heart of professional and private life. They cope with huge volumes of data and support numerous services. Infineon offers the industry’s fastest embedded secure element and a security solution that supports a large number of applications, such as identification, payment, ticketing and embedded SIMs (eSIMs). A further trending topic at MWC: Unlocking your smartphone quickly and easily by face recognition instead of a code or fingerprint. Infineon is presenting a 3D image sensor chip (time of flight) that does this more intelligently, faster and more reliably.
Faster connections
At the Olympic Games in South Korea, the new 5G mobile network standard is already reality. Infineon shows how its mmWave solutions help achieve bandwidths of up to 25 gigabits a second. Such transmission rates will be vital for many applications in the future, such as autonomous driving: These rates are 2,500 times faster than the average download speed of 4G systems and have virtually no delay times.
More information on Infineon at the Mobile World Congress 2018 is available at www.infineon.com/MWC.
