Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, May 16-18, in Nuremberg, Germany.
Indium Corporation is redefining solder with its InFORMS solder preforms. InFORMS are a composite preform consisting of solder and a reinforcing matrix that, together, increase lateral strength and bondline co-planarity while improving thermal cycling reliability.
When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed:
4x improved thermal cycling reliability compared to a solder preform-only approach
2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
Reduced voiding (<1%)
Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment
For more information about InFORMS, visit www.indium.com/informs or see Indium Corporation at booth 7-315.
