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Microsemi to Demonstrate Industry-Leading Semiconductor and System Solutions for Customers, Partners and Media at Electronica 2016

Electronics Maker by Electronics Maker
November 3, 2016
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Trade Show Takes Place Nov. 8-11, 2016 at Messe München

WHAT:   Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will be participating in Electronica 2016 Nov. 8-11, 2016 at Messe München in Munich, Germany.
Microsemi will be exhibiting in Hall A4, booth #207, where the company’s experts will be on hand to discuss and demonstrate leading-edge solutions for aerospace and defense, communications, data center and industrial markets.
Live technology demonstrations will include:
•       Microsemi’s SmartFusion™2 system-on-chip (SoC) field programmable gate array (FPGA) EtherCAT demonstration in partnership with Trinamic
•       An interactive demonstration comparing the thermally friendly RDS(on) of Silicon Carbide (SiC) 700-volt (V) MOSFET against 650V CoolMOS
•       Power core module (PCM) operation with electrical motor
•       Microsemi’s Flashtec™ NVRAM storage solution
•       Ocelot Ethernet switch reference design demonstration with IStaX software and Power-over-Ethernet (PoE) solutions

Product and technology displays will include:
•       Facebook’s flexible Lightning platform incorporating Microsemi’s Switchtec peripheral component interconnect express (PCIe) storage switches
•       Microsemi’s SmartFusion2 SoC FPGA and Timberwolf™ audio processor development board with Arrow Electronics
•       Microsemi Adaptec storage boards (SAS/SATA adapters and expander cards)
•       Microsemi’s storage integrated circuits (Flashtec NVMe controllers and Switchtec PCIe storage switches)
•       Comprehensive solutions for Ethernet switches and PHYs
•       Power discretes and modules as well as radio frequency (RF), microwave and millimeter wave products
•       A customer showcase of products based on Microsemi’s Timberwolf audio processors and ultra-low power radios

On Wednesday, Nov. 9 from 10:30-11 a.m. Amr Elashmawi, corporate vice president, vertical marketing at Microsemi, will share his expertise in a presentation titled, “Which Wireless Medium is Best for Your Secure IIoT Application?” at Electronica’s Industrial Internet of Things forum. For more information, click here.
WHY:    From components to systems, applications and services, the range of exhibits at Electronica covers technologies, products and solutions from the entire electronics industry. Microsemi will be hosting in-booth meetings with key customers and demonstrating industry-leading solutions.
WHERE:  Microsemi’s booth #207 is located in Hall A4 at Messe München located at Messegelande 81823 in Munich, Germany.
WHEN:   Microsemi will be showcasing its products Tuesday, Nov. 8 through Friday, Nov. 11, 2016. Elashmawi’s presentation will take place at the Internet of Things forum on Wednesday, Nov. 9 from 10:30-11:00 in Hall A3.

To schedule a meeting onsite at the Microsemi booth, visit http://www.microsemi.com/electronica2016.

Tags: Semiconductor & IC
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