Kennesaw, Georgia, USA – Yamaha IM America, in partnership with Trans-Tec Worldwide, will exhibit dynamic new SMT assembly technology in booth #813 at the upcoming SMTAI International Conference and Exhibition which takes place September 27-28 at the Donald Stephens Convention Center in Rosemont, IL.
On exhibit will be the YAMAHA YSM20 Modular Mounter and the YCP10 High-Performance Compact Printer. The Z:LEX YSM20 High-Efficiency Modular Mounter effectively accommodates a wide range of production processes while offering the world’s fastest placement performance in its class, 90,000 CPH / 63,500 CPH (IPC9850). It features large component handling capability, 03015mm to 55x100x28mm, large PCB handling up to L 810 x W 490 mm (dual stage, 1-board conveyor, single lane) or two boards up to L 810 x W 230 mm (dual lane). The YSM20 offers a maximum feeder count of 140 types. It features a high-speed head (10 nozzles) and a flexible multi-purpose head (5 nozzles) and is available in 2 different beam variations selectable from 1-beam or 2-beam configurations. Enhanced algorithms for automatic component data generation such as Yamaha’s e‐Vision, help prevent pickup and recognition errors, additionally contributing to decreased machine stoppage losses.
The YCP10 features an easily-controllable operation system and is supplied standard with a user-friendly, easy to operate touch panel, including multiple language options. A wide range of optional features includes a remaining solder detection function that monitors the remaining solder on the stencil to enhance printing quality, and a printing inspection function that carries out accurate and effective solder printing inspections using a purpose-designed high-performance optical camera. The YCP10 complies with CE safety design standards, enabling the equipment to be sold worldwide.
Trans-Tec and YAMAHA will also demonstrate the YSiV via the offline software. The YSi-V 5M is equipped with industry-standard 5 Megapixel Cameras, getting the inspection job done for all current SMT devices while keeping the cost affordable. But the YSi-V 5M is also field upgradable, so that at a later date, if greater defect analysis is needed, the system can be upgraded to 3D and 4D capability. This enables customers to buy the technology they need today, while knowing that additional features can be added later if they are required.
Show visitors can stop by the booth to set up appointments for individual equipment demonstrations.
