Electronics news & updates

Munich, Germany – 10 July 2025 – Leveraging its expertise in magnetic position sensors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the third generation of the XENSIV™ 3D magnetic Hall-effect sensor family, comprising three product series: TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8. Developed in accordance with ISO26262, the sensor family provides integrated diagnostic functions to support functional safety applications up to ASIL-B. Due to their high flexibility, the devices are ideal for a wide range of industrial, consumer, and automotive applications, such as long-stroke linear position measurement, angular position measurement, automotive controls, and pedal or valve position sensing. In automotive applications, they enable control in the interior and under the hood, leveraging three-dimensional measurement functions and high-temperature resistance.

The new sensor family measures the magnetic field in three orthogonal dimensions and operates as an I²C or SPI bus slave. The devices offer enhanced magnetic performance and accuracy, with very low deviation over their lifetime (X/Y < 1.7% X-Y/Z = 6.75%). The 3D magnetic measurement principle and platform adaptability enabled by the device's configurability allow for a reduction in the number of required components. Additionally, the system's power consumption is very low due to its wake-up mode. The TLE493D-X3XX supports a supply voltage of 3.3 V and 5 V and offers 3D magnetic field measurement ranges of ±50 mT, ±100 mT, and ±160 mT. With these linear magnetic range options, the sensors are well-suited for controlling elements in infotainment and navigation systems and multifunction steering wheels. Furthermore, the devices operate reliably in a temperature range of -40°C to 150°C.

Availability

The XENSIV™ magnetic 3D sensors TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8 are available now. More information is available at https://www.infineon.com/cms/en/product/sensor/magnetic-sensors/magnetic-position-sensors/3d-magnetics.

Munich, Germany – 9 July 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its offering for universal serial bus (USB) tokens, dongles, security keys, and other hardware authenticators with the introduction of the new Infineon ID Key family. The newest member, the ID Key S USB is a highly secured and versatile product designed for a wide range of USB- and USB/NFC-token devices and applications. It combines the security, performance, and reliability of the Infineon SLC38 security controller with a USB bridge controller in one single package. It is a unique system-in-package solution that enables high flexibility and simplifies complex application deployments while reducing the bill of materials and related costs. Certified to highest security levels, it supports a range of use cases, including certificate-based authentication, Fast Identity Online (FIDO) authentication with device-bound passkeys, digital signatures, encryption, access control, software protection, and cryptocurrency hardware wallets.

The increasing need for secured online transactions and the growing threat of cyber-attacks have created a surge in demand for secured and hardware-backed authentication solutions. "As the market shifts towards more secured and convenient authentication methods, we see a growing trend towards the adoption of advanced security solutions," said Maurizio Skerlj, Senior Vice President and Product Line Head Authentication & Identity Solutions at Infineon's Connected Secure Systems Division. "With the ID Key S USB, we are well-positioned to address this trend and provide our customers with a robust solution that meets their needs."

The ID Key S USB offers a range of key features that support its secured and versatile design and boasts a comprehensive array of features. Its high-performance capabilities are driven by a 32-bit CPU clocked at 100 MHz and a large 24 kB RAM, enabling ultra-fast and secured execution of applications and delivering excellent operating system performance for a wide range of use cases. The device also offers sufficient memory, with non-volatile memory sizes of up to 800 kB providing ample storage for large amounts of data, cryptographic keys, software, and multiple applications. Furthermore, the ID Key S USB has achieved highest security levels, with certification to CC EAL 6+ (high) and compliance with FIPS 140-3 hardware requirements, allowing customers to apply for FIPS 140-3 certification for their product. The ID Key S USB features a compact footprint of 4 x 4 x 0.85 mm, making it ideal for integration into space-critical token devices.

Availability

The Infineon ID Key S USB is now available for early access customers. Further information can be found on the  webpage .

National, July 09, 2025:  Texas Instruments (TI) has wrapped up the fourth edition of its month-long Women in Semiconductors and Hardware (WiSH) program. WiSH is TI’s flagship mentorship initiative aimed at inspiring and empowering second-year female engineering students across India to pursue impactful careers in core engineering, with a focus on semiconductors and hardware. Built on the previous three editions’ success, the 2025 program attracted over 1,500 registrations and more than 190 participants, reflecting a growing interest in the initiative over the years. 

“The semiconductor industry is evolving rapidly, and the need for skilled talent is greater than ever,” said Santhosh Kumar, Managing Director, Texas Instruments India. “With women representing less than 20% of the people in technical roles in the industry the WiSH program expands access, builds confidence, and fosters engineering capabilities among aspiring women engineers in India. By investing in this next generation of talent, we are helping shape a stronger semiconductor ecosystem.”

This year’s WiSH program participants gained hands-on experience through simulation projects, lab visits, technical deep dives, and networking sessions with TI leaders. The program included three weeks of virtual mentoring, culminating in an immersive, in-person week at TI’s Bengaluru campus. During this phase, students engaged directly with mentors, industry experts, and women leaders from TI. 

“The WiSH program provided me the right platform to go beyond classroom learning. We had access to labs where we gained hands-on experience in simulation and circuit design,” said Poornima Kulkarni, Analog Engineer at TI India and a previous WiSH participant. “What makes it unique is the mentorship by subject matter experts to guide aspiring engineers through the course of the program.”

Texas Instruments remains committed to fostering diversity and inclusion within the technology sector. Through initiatives such as WiSH, TI helps to bridge the gender gap in STEM fields and empower the next generation of engineers to lead and innovate in the semiconductor industry.

Taking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao’an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities.

Featuring an ever-expanding showcase of automation equipment and technologies, the show empowers you to optimize your supply chain, reduce costs, and ensure quality and yield — all driving sustained growth in the electronics manufacturing industry.

Hundreds of New Product Launches

NEPCON ASIA 2025 will showcase hundreds of new products and solutions across SMT, testing and measurement, soldering, dispensing, semiconductor packaging, and automation. The show will feature over 600 leading exhibitors, including Yamaha, Hanwha, Fuji, Kurtz Ersa, Rehm, Tamura, Koh Young, TRI, ALEADER, Unicomp, Anda, and Axxon, connecting them with millions of buyers from high-growth sectors such as automotive electronics, semiconductors, and new energy.

The event aims to engage more than 2,000 buyers from emerging fields like low-altitude flight, embodied robotics, and AI, offering exhibitors invaluable exposure to new sectors.

Breakthrough Areas Driving Innovation

Several standout themed areas will debut, integrating industry resources and cutting-edge technologies, while showcasing packaging, testing, flexible manufacturing, assembly, and key components.

Key themed areas include:

• AI Smart Glasses Disassembly Area
• Flexible Manufacturing and Intelligent Transport System Area
• Low-Altitude Flight Components Disassembly Area
• Embodied Intelligence Robot Core Parts Disassembly Area
• Electronic Finished Products Automated Packaging Demonstration Area
• IGBT & SiC Packaging and Testing Demo Line

Conferences Empowering Industry Growth

NEPCON ASIA 2025 will host 40 high-level conferences covering advanced manufacturing, semiconductors, power electronics, robotics, and AI, empowering businesses to explore future technologies and seize new growth opportunities.

The SMTA South China High-Tech Workshop will feature global experts from China, the US, Japan, and Thailand, providing forward-looking insights for businesses.

Connecting Global Markets

As China’s technology and manufacturing hub, Shenzhen offers a complete electronics ecosystem and unmatched supply chain advantages, providing exhibitors and visitors with opportunities to access its thriving industry cluster.

Through collaborations with overseas industry associations across Southeast Asia, the event will organize factory tours, business matchmaking and overseas networking salons, fostering deeper integration between Chinese and global electronics manufacturers.

Visitor pre-registration is now open! Join NEPCON ASIA 2025 to capture new opportunities, explore emerging markets, and enhance global competitiveness.

For visiting inquiries:
Walden Li | Email: walden.li@rxglobal.com

For exhibiting inquiries:

Julia Gu | Email: julia.gu@rxglobal.com

Pre-registration link：https://ali2.infosalons.com.cn/reg/NEPCON25SZ/registeren/login?type=Z0AR7L

For more information, please visit NEPCON ASIA - Six Electronics Trade Shows Under One Roof.

Facebook: @NEPCONASIA

LinkedIn: @NEPCON ASIA

Bangalore - July 03, 2025 – VIAVI Solutions today announced that it has added colocation capability to its VIAVI Automated Lab-as-a-Service for Open RAN (VALOR) facility to address the increased demand for comprehensive testing from Open RAN customers. Based in Chandler, Arizona, VALOR is funded by the U.S. National Telecommunications and Information Administration (NTIA) Public Wireless Supply Chain Innovation Fund (PWSCIF).

As an alternative to its on-demand customer labs, VALOR’s colocation model offers more flexibility and capacity. Customers can access the lab for a longer period and conduct comprehensive testing throughout the product lifecycle with a semi-permanent setup. Network data in the lab is segregated using VLANs to ensure secure, isolated environments for each customer’s testing requirements, ensuring optimal performance and data integrity across various testing scenarios.

“We’re excited to introduce this new colocation offering at VALOR. With two available engagement models, VALOR can now service both vendors who are looking for specific tests during the development and pre-certification process, as well as those seeking longer-term, comprehensive end-to-end and scalable testing,” said Erik Probstfield, Senior Director, VALOR, VIAVI.

“This colocation framework builds upon the NTIA PWSCIF model. Focused on wireless infrastructure, PWSCIF acts as a force multiplier where federal spending is a catalyst drawing additional investment from private industry. Ultimately, this accelerates the development of open, secure wireless ecosystems with industry-wide investment value significantly greater than the base federal funding. We look forward to providing this expanded service offering to our customers in alignment with the mission and objectives of the NTIA and PWSCIF.”

The VALOR Lab offers a highly automated, open and impartial Lab-as-a-Service / Test-as-a-Service suite for Open RAN interoperability, performance and security. In addition to the colocation lab and two on-demand labs, customers can also access a state-of-the-art RF chamber for Massive MIMO and beamforming over-the-air (OTA) validation, including system-level Massive MIMO performance testing for up to 16 parallel spatial layers.

Leveraging VIAVI’s industry-leading NITRO Wireless Open RAN Test Suite, the VAMOS unified framework for hybrid physical and cloud-based testing, reference O-RUs, O-DUs and O-CUs, as well as a knowledgeable support team, the VALOR Lab enables emerging Open RAN technology vendors to test their products without significant upfront investment. Risks associated with building in-house Open RAN testing capabilities are offloaded to VIAVI, resulting in quicker time to market and more flexible deployment.

Built on Proven SuperGaN Technology, 650-V Gen IV Plus Devices Deliver Robust Performance with Superior Thermal Efficiency and Ultra-Low Power Loss

TOKYO, Japan, July 1, 2025 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced three new high-voltage 650V GaN FETs for AI data centers and server power supply systems including the new 800V HVDC architecture, E-mobility charging, UPS battery backup devices, battery energy storage and solar inverters. Designed for multi-kilowatt-class applications, these 4th-generation plus (Gen IV Plus) devices combine high-efficiency GaN technology with a silicon-compatible gate drive input, significantly reducing switching power loss while retaining the operating simplicity of silicon FETs. Offered in TOLT, TO-247 and TOLL package options, the devices give engineers the flexibility to customize their thermal management and board design for specific power architectures. 

The new TP65H030G4PRS, TP65H030G4PWS and TP65H030G4PQS devices leverage the robust SuperGaN® platform, a field-proven depletion mode (d-mode) normally-off architecture pioneered by Transphorm, which was acquired by Renesas in June 2024. Based on low-loss d-mode technology, the devices offer superior efficiency over silicon, silicon carbide (SiC), and other GaN offerings. Moreover, they minimize power loss with lower gate charge, output capacitance, crossover loss, and dynamic resistance impact, with a higher 4V threshold voltage, which is not achievable with today’s enhancement mode (e-mode) GaN devices.

Built on a die that is 14 percent smaller than the previous Gen IV platform, the new Gen IV Plus products achieve a lower RDS(on) of 30 milliohms (mΩ), reducing on-resistance by 14 percent and delivering a 20 percent improvement in on-resistance output-capacitance-product figure of merit (FOM). The smaller die size reduces system costs and lowers output capacitance, which results in higher efficiency and power density. These advantages make the Gen IV Plus devices ideal for cost-conscious, thermally demanding applications where high performance, efficiency and small footprint are critical. They are fully compatible with existing designs for easy upgrades, while preserving existing engineering investments.    

Available in compact TOLT, TO-247 and TOLL packages, they provide one of the broadest packaging options to accommodate thermal performance and layout optimization for power systems ranging from 1kW to 10kW, and even higher with paralleling. The new surface-mount packages include bottom side (TOLL) and top-side (TOLT) thermal conduction paths for cooler case temperatures, allowing easier device paralleling when higher conduction currents are needed. Further, the commonly used TO-247 package provides customers with higher thermal capability to achieve higher power.

“The rollout of Gen IV Plus GaN devices marks the first major new product milestone since Renesas’ acquisition of Transphorm last year,” said Primit Parikh, Vice President of the GaN Business Division at Renesas. “Future versions will combine the field-proven SuperGaN technology with our drivers and controllers to deliver complete power solutions. Whether used as standalone FETs or integrated into complete system solution designs with Renesas controllers or drivers, these devices will provide a clear path to designing products with higher power density, reduced footprint and better efficiency at a lower total system cost.”

Unique d-mode Normally-off Design for Reliability and Easy Integration

Like previous d-mode GaN products, the new Renesas devices use an integrated low-voltage silicon MOSFET – a unique configuration that achieves seamless normally-off operation while fully capturing the low loss, high efficiency switching benefits of the high- voltage GaN. As they use silicon FETs for the input stage, the SuperGaN FETs are easy to drive with standard off-the-shelf gate drivers rather than specialized drivers that are normally required for e-mode GaN. This compatibility simplifies design and lowers the barrier to GaN adaptation for system developers.

GaN-based switching devices are quickly growing as key technologies for next-generation power semiconductors, fueled by demand from electric vehicles (EVs), inverters, AI data center servers, renewable energy, and industrial power conversion. Compared to SiC and silicon-based semiconductor switching devices, they provide superior efficiency, higher switching frequency and smaller footprints.

Renesas is uniquely positioned in the GaN market with its comprehensive solutions, offering both high- and low-power GaN FETs, unlike many providers whose success in the field has been primarily limited to lower power devices. This diverse portfolio enables Renesas to serve a broader range of applications and customer needs. To date, Renesas has shipped over 20 million GaN devices for high- and low-power applications, representing more than 300 billion hours of field usage.

Availability

The TP65H030G4PRS, TP65H030G4PWS and TP65H030G4PQS are available today, along with the 4.2kW Totem-pole PFC GaN Evaluation Platform (RTDTTP4200W066A-KIT). More information about Renesas’ GaN solutions is available at: renesas.com/gan-fets.

Get Powered by Renesas

Driven by innovation, quality and reliability, Renesas leads the way in power electronics, shipping more than four billion parts per year from our portfolio of power management ICs, discrete and wide-bandgap GaN products, computing power devices and many more. These products span all major segments including automotive, IoT, infrastructure and industrial applications. Our power portfolio seamlessly attaches to our leading MCU, MPU, SoC and analog solutions, simplifying and accelerating the design process with hundreds of engineering-vetted Winning Combinations and innovative tools such as PowerCompass™ and PowerNavigator™ design software. Find out more at renesas.com/power.

Single- and Dual-Core MCUs Combine Arm Cortex-M85 and M33 Cores with Arm Ethos-U55 NPU to Deliver Superior AI Performance up to 256 GOPs

• Unprecedented 7300+ CoreMarks[1] with Dual Arm CPU coresTSMC 22ULL Process Delivers High Performance and Low Power Consumption

• Embedded MRAM with Faster Write Speeds and Higher Endurance and Retention

• Dedicated Peripherals Optimized for Vision and Voice AI plus Real-Time Analytics

• New AI Software Framework Eases Development and Enables Easy Migration with MPUs Leading-Edge Security Features Ensure Data Privacy

TOKYO, Japan, July 1, 2025 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8P1 microcontroller (MCU) Group targeted at Artificial Intelligence (AI) and Machine Learning (ML) applications, as well as real-time analytics. The new MCUs establish a new performance level for MCUs by combining 1GHz Arm® Cortex®-M85 and 250MHz Cortex-M33 CPU cores with the Arm Ethos™-U55 Neural Processing Unit (NPU). This combination delivers the highest CPU performance of over 7300 CoreMarks and AI performance of 256 GOPS at 500 MHz.

Designed for Edge/Endpoint AI

The RA8P1 is optimized for edge and endpoint AI applications, using the Ethos-U55 NPU to offload the CPU for compute intensive operations in Convolutional and Recurrent Neural Networks (CNNs and RNNs) to deliver up to 256 MACs per cycle that yield 256 GOPS performance at 500 MHz. The new NPU supports most commonly used networks, including DS-CNN, ResNet, Mobilenet TinyYolo and more. Depending on the neural network used, the Ethos-U55 provides up to 35x more inferences per second than the Cortex-M85 processor on its own.

Advanced Technology

The RA8P1 MCUs are manufactured on the 22ULL (22nm ultra-low leakage) process from TSMC, enabling ultra-high performance with very low power consumption. This process also enables the use of embedded Magnetoresistive RAM (MRAM) in the new MCUs. MRAM offers faster write speeds along with higher endurance and retention compared with Flash.

“There is explosive growth in demand for high-performance edge AIoT applications. We are thrilled to introduce what we believe are the best MCUs to address this trend,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “The RA8P1 devices showcase our technology and market expertise and highlight the strong partnerships we have built across the industry. Customers are eager to employ these new MCUs in multiple AI applications.”

“The pace of innovation in the age of AI is faster than ever, and new edge use cases demand ever-improving performance and machine learning on-device,” said Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm. “By building on the advanced AI capabilities of the Arm compute platform, Renesas’ RA8P1 MCUs meet the demands of next generation voice and vision applications, helping to scale intelligent, context-aware AI experiences.”

“It is gratifying to see Renesas harness the performance and reliability of TSMC 22ULL embedded MRAM technology to deliver outstanding results for its RA8P1 devices,” said Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC. “As TSMC continues to advance our embedded non-volatile memory (eNVM) technologies, we look forward to strengthening our long-standing collaboration with Renesas to drive innovation in future groundbreaking devices.”

Robust, Optimized Peripheral Set for AI

Renesas has integrated dedicated peripherals, ample memory and advanced security to address Voice and Vision AI and Real-time Analytics applications. For vision AI, a 16-bit camera interface (CEU) is included that supports sensors up to 5 megapixels, enabling camera and demanding Vision AI applications. A separate MIPI CSI-2 interface offers a low pin-count interface with two lanes, each up to 720Mbps. In addition, multiple audio interfaces including I2S and PDM support microphone inputs for voice AI applications.

The RA8P1 offers both on-chip and external memory options for efficient, low latency neural network processing. The MCU includes 2MB SRAM for storing intermediate activations or graphics framebuffers. 1MB of on-chip MRAM is also available for application code and storage of model weights or graphics assets. High-speed external memory interfaces are available for larger models. SIP options with 4 or 8 MB of external flash in a single package are also available for more demanding AI applications.

New RUHMI Framework

Along with the RA8P1 MCUs, Renesas has introduced RUHMI (Renesas Unified Heterogenous Model Integration), a comprehensive framework for MCUs and MPUs. RUHMI offers efficient AI deployment of the latest neural network models in a framework agnostic manner. It enables model optimization, quantization, graph compilation and conversion, and generates efficient source code. RUHMI provides native support for machine-learning AI frameworks such as TensorFlow Lite, Pytorch & ONNX. It also provides the necessary tools, APIs, code-generator, and runtime needed to deploy a pre-trained neural network, including ready-to-use application examples and models optimized for RA8P1. RUHMI is integrated with Renesas’s own e2 Studio IDE to allow seamless AI development. This integration will facilitate a common development platform for MCUs and MPUs.

Advanced Security Features

The RA8P1 MCUs provide leading-edge security for critical applications. The new Renesas Security IP (RSIP-E50D) includes numerous cryptographic accelerators, including CHACHA20, Ed25519, NIST ECC curves up to 521 bits, enhanced RSA up to 4K, SHA2 and SHA3. In concert with Arm TrustZone®, this provides a comprehensive and fully integrated secure element-like functionality. The new MCUs also provides strong hardware Root-of-Trust and Secure Boot with First Stage Bootloader (FSBL) in immutable storage. XSPI interfaces with decryption-on-the-fly (DOTF) allow encrypted code images to be stored in external flash and decrypted on the fly as it is securely transferred to the MCU for execution.

Ready to Use Solutions

Renesas provides a wide range of easy-to-use tools and solutions for the RA8P1 MCUs, including the Flexible Software Package (FSP), evaluation kits and development tools. FreeRTOS and Azure RTOS are supported, as is Zephyr. Several Renesas software example projects and application notes are available to enable faster time to market. In addition, numerous partner solutions are available to support development with the RA8P1 MCUs, including a driver monitoring solution from Nota.AI and a traffic/pedestrian monitoring solution from Irida Labs. Other solutions can be found at the Renesas RA Partner Ecosystem Solutions Page.

Key Features of the RA8P1 MCUs

Processors: 1GHz Arm Cortex-M85, 500MHz Ethos-U55, 250 MHz Arm Cortex-M33 (Optional)Memory: 1MB/512KB On-chip MRAM, 4MB/8MB External Flash SIP Options, 2MB SRAM fully ECC protected, 32KB I/D caches per core

Graphics Peripherals: Graphics LCD controller supporting resolutions up to WXGA (1280x800), parallel RGB and MIPI-DSI display interfaces, powerful 2D Drawing engine, parallel 16bit CEU and MIPI CSI-2 camera interfaces, 32bit external memory bus (SDRAM and CSC) interface

Other Peripherals: Gigabit Ethernet and TSN Switch, XSPI (Octal SPI) with XIP and DOTF, SPI, I2C/I3C, SDHI, USBFS/HS, CAN-FD, PDM and SSI audio interfaces, 16bit ADC with S/H circuits, DAC, comparators, temperature sensor, timersSecurity: Advanced RSIP-E50D cryptographic engine, TrustZone, Immutable storage, secure boot, tamper resistance, DPA/SPA attack protection, secure debug, secure factory programming, Device Lifecycle management

Packages: 224BGA, 289BGA

Winning Combinations

Renesas has combined the new RA8P1 MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Video Conferencing Camera with AI Capabilities, AI Drawing Robot Arm and AI-Enabled Surveillance Camera. These designs are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

Availability

The RA8P1 MCUs are available now. Renesas is also shipping an RA8P1 Evaluation Kit. More information is available at renesas.com/RA8P1. Samples and kits can be ordered either on the Renesas website or through distributors.

Renesas MCU Leadership A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit renesas.com/MCUs.

Cambridge, UK – 1^st July 2025 – Pico Technology, a leader in PC-based test and measurement instruments, is proud to announce the extension of its PicoScope 9400A Series of high-bandwidth sampling oscilloscopes. The products are engineered to meet the demanding needs of high-speed electronics, communications, semiconductor research and high-energy physics applications.

The PicoScope 9400A Series is built on Pico’s SXRTO technology and, with this launch, adds three models to the previously announced 25 GHz version, giving users a choice of 6 GHz, 16 GHz, 25 GHz and a flagship 33 GHz bandwidthmodel. Designed for accuracy and performance, the 33 GHz model achieves rise and fall times of under 12 picoseconds, enabling precise analysis of ultra-fast signals. All models in the range feature four channels with 12-bit voltage resolution and an industry-leading jitter specification of less than 1.5 picoseconds RMS, critical for time-domain precision in advanced research environments.

An optional clock recovery function is available across the range to generate a trigger from a received data signal where a separate trigger signal is not readily available.

The products come with PicoSample 4 Windows software that delivers rich visualization and extensive waveform measurements and analysis, including clock and data pulse and eye diagram measurements of RZ, NRZ and PAM4 encoded data.

“The new sampling oscilloscope series reflects Pico Technology’s commitment to delivering powerful, accessible and cost-effective solutions for engineers and researchers working at the forefront of technology,” said Trevor Smith, Product Manager at Pico Technology. “We’ve combined exceptional performance with ease of use, making these instruments ideal for lab environments where flexibility, space and budget are often at a premium.”

These new oscilloscopes are particularly well-suited to professionals in semiconductor and materials research, high-speed communications and high-energy physics, where accurate waveform capture and signal integrity (SI) analysis are critical. The compact, PC-connected design also facilitates easy integration into automated test setups or shared lab environments.

The full sampling oscilloscope series is available immediately from Pico Technology and its distribution partners worldwide.

https://www.picotech.com/products/oscilloscope/picoscope-9000-series/picoscope-9400a-series-sampler-extended-real-time-oscilloscope