Electronics news & updates

Microchip launches six variants targeting high-growth motor drive, data center and sustainability applications

September 17, 2025 — The growing need for compact, efficient and reliable power solutions is driving demand for power management devices that provide higher power density and simplify system design. Microchip Technology (Nasdaq: MCHP) today announces a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology available in six variants at 1200V and 1700V with high-current ranging from 300–900A. The new DP3 power modules are designed to address the growing demand for compact, cost-effective and simplified power converter solutions.

These modules use the latest IGBT7 technology, engineered to reduce power losses by up to 15–20% compared to IGBT4 devices and operate reliably at higher temperatures up to 175°C during overload. DP3 modules enhance protection and control during high-voltage switching, making them suitable for maximizing power density, reliability and ease of use in industrial drives, renewables, traction, energy storage and agricultural vehicles.

Available in a phase-leg configuration, the DP3 power modules in a compact footprint of approximately 152 mm × 62 mm × 20 mm, enable a frame size jump for increased power output. This type of advanced power packaging eliminates the need for paralleling multiple modules and helps reduce system complexity and Bill of Materials (BOM) costs. Additionally, DP3 modules provide a second-source option to industry-standard EconoDUAL™ packages for greater flexibility and supply chain security for customers.

“Our new DualPack 3 modules with IGBT7 technology can reduce design complexity and lower system costs while maintaining high performance,” said Leon Gross, corporate vice president of Microchip’s high-reliability and RF business unit. “To further streamline the design process, our power modules can be integrated as part of a comprehensive system solution alongside Microchip’s microcontrollers, microprocessors, security, connectivity and other components to accelerate development and time to market.”

The DualPack 3 power modules are well-suited for general-purpose motor drive applications and address common challenges such as dv/dt, complexity in driving, higher conduction losses and no overload capability.

Microchip offers a broad portfolio of power management solutions that includes analog devices, Silicon (Si) and Silicon Carbide (SiC) power technologies, dsPIC® Digital Signal Controllers (DSCs) and standard, modified and custom power modules. For more information about Microchip’s power management products, visit the web page.

Pricing and Availability

The DualPack 3 power modules are now available in production quantities. You can purchase directly from Microchip or contact a Microchip sales representative or authorized worldwide distributor.

Resources

High-res images available through Flickr or editorial contact (feel free to publish): Application image:www.flickr.com/photos/microchiptechnology/54729936654/sizes/l

Munich, Germany – 16 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its XENSIV™ MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones designed for exceptional audio performance, energy efficiency, and robustness. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57), making them suitable for use in demanding environments.

 
The IM72D128V is distinguished by its top-tier Signal-to-Noise Ratio (SNR) of 71.5 dB(A), making it particularly suited for applications requiring precise low-noise audio pick-up. It operates at ultra-low power consumption, with 430 µA in high-performance mode and 
160 µA in low-power mode, which makes it ideal for energy-efficient, battery-powered devices such as high-end headphones. With a footprint of 4 x 3 x 1.2 mm³, it is still small enough to fit most space constraint consumer devices.
 
The IM69D129F is tailored for compact design, with a footprint of 3.5 x 2.65 x 0.98 mm³, which makes it ideal for space-constrained devices. It achieves reliable audio performance with an SNR of 69 dB(A) and features low power consumption, operating at 450 µA in high-performance mode and 170 µA in low-power mode, contributing to extended battery life in portable devices ensuring extended battery life. Its small size makes it particularly suited for multi-microphone designs in compact systems. The devices can be used in Active Noise Cancellation (ANC) headphones and earbuds, as well as high-quality audio capturing in laptops, tablets, conference systems, and cameras. 
 
The IM72D128V and IM69D129F are part of Infineon’s XENSIV MEMS microphone family, offering exceptional audio quality, low power consumption, and high durability. They also support Voice User Interface (VUI) applications in smart speakers, automotive infotainment, IoT devices, and home and industrial automation. Furthermore, both microphones can be used in industrial or home monitoring applications that require audio pattern detection, such as industrial monitoring and home security systems.
 
In addition, the IM72D128V and IM69D129F are equipped with a low-noise preamplifier and a sigma-delta ADC, providing digital PDM output for seamless integration into modern audio systems. Their shared features include an 11 Hz flat frequency response for precise sound reproduction and a ±1 dB sensitivity tolerance, making them ideal for multi-microphone arrays. Whether used for far-field audio pick-up or portable devices, these microphones enable high-quality audio capturing in challenging environments while enhancing energy efficiency and reliability. Both microphones comply with IEC (60747, 60749) and JEDEC (47/20/22) standards, ensuring reliability and robustness for consumer and industrial applications.
 
Availability
The IM72D128V and IM69D129F are now available for order, and customer samples can be provided upon request. More information is available at www.infineon.com/mems

Quantum is quickly moving from research to real-world relevance across telecom. From quantum-safe security to AI-assisted computing, operators are laying the groundwork for a range of applications. While quantum computing is often seen as a threat to encryption, it also promises major advances in areas like network optimization, secure communications, and large-scale simulations. Investments are underway across multiple fronts, including quantum communications, quantum-safe security, hybrid computing, and the convergence of quantum and AI.

As research deepens and investments grow, quantum may be approaching its own breakout moment. Understanding the intersecting tracks and timelines is key to shaping a successful quantum strategy.

Quantum Communications

Quantum communications is a broad topic that addresses how quantum capabilities can benefit areas such as transmission protocols, link security, and connected networks. Next-generation transport protocols use quantum physics principles to incorporate secure and enhanced communication protocols into the transport layer. Quantum key distribution (QKD), the most prominent quantum application, securely distributes encryption keys using quantum mechanics principles. QKD creates provably secure links for backhaul, data center interconnect, and critical infrastructure. QKD research is also addressing satellite communications, a likely requirement for 6G backhaul.

Quantum networks connect quantum processors or nodes that enable distributed quantum computing and secure communication. Quantum channels, often built on top of existing telecom fiber infrastructure, transmit qubits (i.e., the fundamental unit of information in quantum computing and analogous to the bit in classical computing). Quantum repeaters are essential components to extend communication over long distances because qubits cannot be copied or amplified like classical signals.

Quantum-safe Security

A key reason operators are investing in quantum is the risk it poses to existing encryption. Once quantum computers reach sufficient power, they could quickly break widely used encryption methods, putting today’s data at risk of future exposure. Post-quantum cryptography (PQC) is the new generation of cryptographic algorithms built to withstand future attacks by quantum computers. The first algorithms have been released by NIST and telecom operators and suppliers are starting to audit the network and prepare a multi-year rollout plan. Many telecom operators intend to apply powerful QKD encryption to critical links while relying on PQC for broader coverage, enabling a layered, software-upgradable defense.

Quantum and Hybrid Computing

Telcos are exploring how quantum computing can squeeze value out of existing networks. This effort focuses on utilizing quantum computers and algorithms to generate significant improvements in network efficiency and stability. One area of interest is optimizing network lifecycle management, including cell site planning, radio resource utilization, and energy-efficient network routing. Operators could also monetize quantum by positioning networks as secure gateways to public quantum clouds and offering future as-a-service offerings such as entropy-as-a-service.

How AI supports Quantum advancements

AI will play a key role in advancing telecom’s quantum research by improving the capabilities of quantum technologies and speeding their integration into telecom networks for tasks like security, optimization, and long-term AI-quantum collaboration. Here are some of the ways AI is being explored by telecoms to make quantum practical and impactful:

• Improving quantum algorithm reliability by predicting and correcting errors caused by noise, using models like transformers to mitigate issues before computations begin
• Automating the calibration of quantum computers, making them easier to use and maintain, reducing operational complexity and enhancing device stability
• Contributing to the design of quantum chips optimized for telecom needs, improving hardware efficiency and integration with existing telecom infrastructure
• Guiding quantum algorithms to solve complex telecom optimization problems such as tower placement and traffic routing, helping improve throughput, reduce latency, and enhance service quality

Telecom + Quantum: where we stand today

The multiple quantum R&D tracks operators are pursuing suggests a steadily increasing pace of advancement. Quantum’s “AI moment” could be upon us before we know it as signs point to an impending shift that could trigger broader investment and industry focus.

Prototype quantum communication networks have been deployed in cities using existing fiber infrastructure, demonstrating multi-node QKD without trusted nodes. Researchers have achieved quantum entanglement over urban distances and have demonstrated quantum teleportation between multiple locations, marking steps toward a scalable quantum internet. The first PQC algorithms are now available, and vendors are working to incorporate them.

Some telcos are already demonstrating using AI-supported quantum computing to optimize network traffic and more efficiently plan 5G cell site deployment. Quantum repeater research and development is accelerating with the first commercial solutions expected in the next few years. Quantum receiver sub-components (i.e., single photon detectors and quantum sensors) are now commercially available, paving the way for integrated quantum receiver systems in the near term.

Soon, telcos will initially access quantum computing through cloud-based services or hybrid systems that combine classical and quantum processors. Full integration of fault-tolerant, large-scale quantum computers into on-premises infrastructure is expected to take longer, likely unfolding over the next decade.

Microchip supports new school infrastructure projects in India, driving innovation through makerspaces and vocational training

National, 11th September 2025: Microchip Technology (Nasdaq: MCHP), a leading provider of smart, connected and secure embedded control and processing solutions, has strengthened its Corporate Social Responsibility (CSR) initiatives in India. Through ongoing investments in education, skills-based development and community programs, the company continues to demonstrate its long-term commitment to youth development and educational advancement. Microchip has a legacy of community involvement, and its India-focused CSR programs are designed to align with national priorities and regulatory frameworks.

Microchip India’s CSR program focuses on advancing education and workforce readiness in alignment with India’s CSR regulation. Through initiatives that promote STEM learning such as vocational training, Microchip aims to expand access to quality education in underserved communities to help prepare youth for future careers.

Microchip has helped reconstruct various schools near Bengaluru’s rural districts, undertaken road improvement projects leading to the schools and is now constructing two new schools in Karnataka to expand access to foundational education. In Tamil Nadu, the company inaugurated an upgraded Centre of Excellence in 2022 to benefit children from Krishnagiri and has helped reconstruct the schools and hostels in the area. Additionally, Microchip leads a monthly school clean-up initiative in Chennai, actively engaging employees and their families in community service.

Similarly, in Hyderabad, Microchip partners with the Telangana Social Impact Group (T-SIG), Youth-Hub (Y-Hub), and Inqui-Lab Foundation to support innovation aligned with the United Nations’ Sustainable Development Goals. Together, they have launched an innovation space at a Telangana Social Welfare Residential Educational Institutions Society. This all-girls’ high school in Maheshwaram offers students access to hands-on learning through prototyping kits, maker tools and teacher training. The initiative is overseen by Microchip’s local CSR committee to ensure sustained impact.

“At Microchip, we believe that meaningful innovation begins with empowering communities and creating opportunities for all,” said Srikanth Settikere, vice president and managing director of Microchip’s India Development Center. “Our CSR programs in India reflect our deep commitment to shared growth, particularly through education and vocational training. We hope to foster resilient communities and contribute to a more sustainable future for all."

Microchip India’s CSR efforts also extend to environmental stewardship, social and healthcare responsibility, as well as broader community engagement, reflecting a holistic approach to corporate citizenship. The company remains committed to scaling its impact in India through continued collaboration with local partners and stakeholders.

Microchip’s commitment to corporate social responsibility and sustainability is embedded across its operations. The company fosters a culture that empowers employees to drive continuous improvements, ensuring sustainability practices are integrated into business processes. Through its Sustainability Megatrend team, Microchip also develops solutions that help customers reduce resource consumption, such as energy and water, by leveraging its broad portfolio of high-efficiency products. This approach strengthens Microchip’s ability to innovate responsibly and deliver sustainable value to its stakeholders.

The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures

National, 11th September 2025: As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases. Deca Technologies and Silicon Storage Technology® (SST®), a subsidiary of Microchip Technology Inc., announced today that they have entered into a strategic agreement to innovate a comprehensive non-volatile memory (NVM) chiplet package to facilitate customer adoption of modular, multi-die systems.

This collaboration combines Deca’s M-Series™ fan-out and Adaptive Patterning® technologies with SST’s industry-leading SuperFlash® embedded flash technology.  The companies are applying their system-level integration expertise to deliver a bundled offering that empowers customers to design, verify and commercialize NVM chiplets. By enabling greater architectural flexibility, the solution offers both technical and commercial advantages over traditional monolithic integration.

The collaborative solution provides a modular, memory-centric foundation for advanced multi-die architectures by combining the strengths of both companies. The chiplet package leverages SST’s SuperFlash technology, along with the interface logic and physical design elements required to function as a self-contained chiplet. This is paired with Adaptive Patterning-based redistribution layer (RDL) design rules, simulation flows, test strategies and manufacturing paths through Deca’s ecosystem of qualified partners.

Building on this foundation, Deca and SST will jointly support customers from early design through qualification and prototype manufacturing. By streamlining integration and accelerating design cycles, the companies aim to enable broader adoption of heterogeneous integration, engaging with customers globally to bring chiplet solutions to market.

“Chiplet integration is reshaping how the industry thinks about performance, scalability and time to market,” said Robin Davis, VP of Strategic Engagements & Applications at Deca. “Our partnership with SST empowers customers to develop a chiplet solution that combines different chips, process nodes, sizes and even die from multiple foundries delivering more efficient and cost-effective products.”

Chiplet technology offers significant advantages in semiconductor design and manufacturing by enabling a more-than-Moore approach. Designers can go beyond traditional scaling to deliver enhanced functionality and performance and get products to market faster. Chiplets allow the reuse of existing IP and can facilitate the mixing of advanced process nodes with less expensive legacy geometries. By utilizing the most appropriate die technology for a particular function, chiplets provide a versatile, efficient and economical pathway for advanced semiconductor innovation.

“As our customers push the boundaries of Moore’s Law, they are expressing greater interest in chiplet- based solutions,” said Mark Reiten, Vice President of Microchip’s licensing business unit. “This partnership aims to deliver a comprehensive package of IP, simulation tools and advanced assembly and engineering services necessary for successful chiplet development and productization.”

Pricing and Availability

Customers interested in SST’s SuperFlash technology should access the SST website or contact a regional SST sales executive for more information and details of our NVM chiplet solutions. Those interested in Deca’s technology and offerings should visit the Deca website or reach out to Deca’s marketing contact.

Bangalore - September 11, 2025 – VIAVI Solutions today announced a partnership with CrowdStrike to integrate the VIAVI Observer network observability platform with CrowdStrike Falcon Next-Gen SIEM. VIAVI brings end-user experience insights with network and service performance intelligence into Falcon Next-Gen SIEM, providing joint customers with deeper visibility across their security and IT operations.

According to VIAVI's 2025/2026 State of the Network Study, while 79% of organizations are transitioning from siloed network and security operations to converged NetSecOps, only 27% have completed the process. The partnership between VIAVI and CrowdStrike empowers customers to accelerate their NetSecOps journey by combining VIAVI’s network performance intelligence with CrowdStrike’s industry-leading threat intelligence and AI-driven automation. By collecting and retaining high-fidelity forensic data, the Observer platform provides additional insights into how security events impact critical business services, giving customers greater visibility into cybersecurity threats within their performance management workflows.

"As data volumes increase, many vendors have adopted a metadata-based approach to network and security operations convergence, or NetSecOps. Beyond extensive use of metadata, VIAVI also provides high-fidelity forensic data with long-term packet capture and enriched flows,” said Chris Labac, Vice President and General Manager, Network Performance Management and Threat Solutions, VIAVI. “This approach gives a deeper and more accurate understanding of network events compared to what can be achieved with metadata alone."

“Falcon Next-Gen SIEM is the engine of the modern SOC, unifying customers’ broader security ecosystem with CrowdStrike’s first-party data, native threat intelligence, and AI-powered threat detection and response,” said Michael Rogers, Vice President, Global Alliances, CrowdStrike. “With our announcement to acquire real-time data pipeline platform Onum, we will supercharge Falcon Next-Gen SIEM, enriching, filtering, and starting detection before data even enters Falcon, reducing costs while boosting performance. By integrating the VIAVI Observer platform with Falcon Next-Gen SIEM, we’re helping organizations unify NetOps and SecOps – delivering true convergence, faster detection and response, and the visibility they need to operate with speed, resilience, and confidence.”

The Observer platform integration with Falcon Next-Gen SIEM will be demonstrated at CrowdStrike's flagship conference Fal.Con in the U.S. and Europe, along with other events throughout the year.

In-plane Hall-effect switch from TI can replace incumbent position sensors that are more expensive and difficult to manufacture

What’s new

Texas Instruments (TI) today introduced the industry’s most sensitive in-plane Hall-effect switch for position sensing, offering engineers a cost-effective, user-friendly alternative to magnetoresistive sensors. TI’s TMAG5134 Hall-effect switch features an integrated a magnetic concentrator, enabling it to detect magnetic fields as weak as 1mT in applications such as door and window sensors, personal electronics, home appliances, and more. This level of sensitivity allows for the use of smaller magnets, further reducing system-level costs. Additionally, the TMAG5134’s in-plane sensing capability enables it to detect magnetic fields parallel or horizontal to a printed circuit board, giving engineers greater design flexibility.

Why it matters

Engineers seeking high sensitivity levels in low-power, compact position-sensing designs today rely on reed switches or tunnel magnetoresistive (TMR), anisotropic magnetoresistive (AMR) or giant magnetoresistive (GMR) sensors. However, these technologies often come with high costs and manufacturing complexities because they require specialized materials and fabrication techniques. In contrast, Hall-effect technology eliminates the need for specialized manufacturing and enables engineers to significantly reduce design costs and speed time to market.

Historically, designers have not considered Hall-effect switches as viable replacements for TMR, AMR, GMR or reed switches because of their limited sensitivity. The introduction of TI’s TMAG5134 represents a fundamental shift for the position sensing market; engineers can now achieve greater sensitivity than traditional Hall-effect sensors without the additional cost and complexity of magnetoresistive sensors.

“The electronics we interact with in our daily lives, from our laptops to our smart home systems, use sensors to help make decisions based on the world around them,” said Jason Cole, vice president and general manager, Sensing Products at TI. “For decades, TI’s sensing portfolio has enabled engineers to achieve greater accuracy, power efficiency and reliability in their designs. The TMAG5134 Hall-effect switch builds on these years of innovation, delivering a simplified, cost-effective solution that creates new possibilities for design engineers across industries.”

For more information, read the technical article, “The Hall effect: How an in-plane switch increases sensitivity and lowers design cost.”

More details

The TMAG5134 Hall-effect switch helps extend battery life in sensing applications by consuming just 0.6µA on average. Its integrated magnetic concentrator technology amplifies the sensor signal, eliminating the need to bias the device with as much current.

TI’s magnetic sensing portfolio offers engineers a variety of switches, latches, and single- and multiaxis linear and angle sensors to fit their design needs. With devices such as the TMAG5134 Hall-effect switch and comprehensive development resources, the portfolio aims to make designing with high-performance sensing technology simpler and more accessible.

Availability

Manufactured internally at TI’s 300mm fabs, the TMAG5134 is available on TI.com in production quantities. Engineers can accelerate development with TI’s comprehensive support resources, including an evaluation module and the free Texas Instruments Magnetic Sense Simulator (TIMSS) tool. With this tool, designers can quickly simulate magnetic field behavior and sensor outputs based on specific sensor-magnet configurations in their designs.

• SPC58 family of 7 product lines to be available until at least 2038-2041, strengthening assurance for new automotive-system design starts
• Devices target communication-gateway and powertrain, chassis, and body applications

STMicroelectronics has extended the ongoing longevity program for its widely deployed SPC58 automotive microcontrollers (MCUs) from 15 years to 20 years, ensuring availability of general-purpose and high-performance product lines until at least 2038. Among the general-purpose lines, the SPC58 H series that contains up to 10MB non-volatile memory (NVM) for code and data storage will be available until at least 2041.

“Our long-term commitment to supporting the SPC58 family for automotive customers globally lets system designers confidently start new projects and continue to leverage their investments in device validations, software, and tooling,” said Luca Rodeschini, Group Vice President and General Purpose and Automotive Microcontrollers Division General Manager, STMicroelectronics. “The MCUs enable a flexible, platform-based approach and future-proof scalability, presenting a broad selection of device variants that support evolving automotive electrical architectures.”

The complete portfolio comprises five general-purpose lines that are featured for smart gateways and body applications such as lighting and door locking, with communication, analog, and security peripherals. The high-performance SPC58 E and SPC58 N lines are also available and target powertrain-electrification and chassis-safety use cases. These provide additional special features including multiple types of timers and FlexPWM to address complex motor-control challenges.

Customers can now extend the lifetime of their successful products and continue to count on SPC58 automotive microcontrollers for new designs. The Company’s in-house manufacturing model ensures control over all aspects of device design, support, and production at its own semiconductor fabrication plants. ST similarly extended its longevity commitment to the SPC56 family of general-purpose and performance automotive microcontrollers in 2021.

Comprising seven product lines, the SPC58 family delivers:

• MCUs with up to three e200z4 32-bit Power Architecture^® cores and from 1MB to 10MB on-chip NVM, manufactured on ST’s 40nm embedded flash process.
• Extensive support for popular communication protocols including multiple ISO CAN-FD compliant modular controller area network (MCAN) modules that support multi-drop connectivity.
• An IEEE 802.3 10/100 Ethernet controller that supports IEEE 802.1Q virtual LAN to facilitate traffic management and segmentation.
• Hardware security module (HSM) with independent core and memory to isolate security-sensitive processes and data, enabling users to build EVITA^®-compliant systems. Hardware-based mechanisms that facilitate system functional-safety certification up to ISO 26262 ASIL-B.
• Devices in the high-performance SPC58 E and SPC58 N lines are featured for systems targeting ASIL-D, the highest specified safety-integrity level.

The SPC58 family comprises over 40 variants, from SPC58 2B devices in the economical and compact 10mm x 10mm eTQFP64 to SPC58 H MCUs in 19mm x 19mm FPBGA386. Local ST sales offices can provide pricing options and sample requests.

For more information, please go to SPC5 32-bit automotive MCUs