Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany.
The Indium8.9HF Series is specifically formulated to Avoid the Void™ while delivering high transfer efficiency with low variability.
In addition to outstanding print transfer efficiency and response-to-pause, these no-clean solder pastes also provide a number of other benefits, including excellent pin-in-paste solderability and hole-fill, robust reflow capability, and a wide process window.
The Indium8.9HF Series includes pastes perfectly suited for a variety of applications, especially automotive, due to a unique oxidation barrier technology.
The Indium8.9HF solder paste series is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void™. For more information about Indium8.9HF, visit Indium Corporation at stand 7-331, email askus@indium.com or visit www.indium.com/indium8.9series
