Multidimensional inspection and dynamic embedded board test: At the 2016 SMT/Hybrid/Packaging exhibition, GOEPEL electronic presents exceptional and innovative test solutions from the fields of automated inspection (AOI/AXI/SPI) and JTAG/Boundary Scan. At booth 111 in Hall 7A, the latest technologies for optical and electrical test and measurement will be shown.
VarioLine is a compact AOI system which includes a 4 camera angled-view module with 360° inspection and multispectral illumination. Optionally, it can be equipped with the measuring module 3D EyeZ. This results in an increase of test speed while optimizing cost for the overall system. Automated Inspection of THT components with component clearance of up to 130 mm is possible with the THT-Line. This AOI system can be flexibly integrated into individual production processes and provides numerous configuration options for specific applications and reliable inspection. The inline X-ray inspection system X-Line 3D allows automatic high coverage 3D X-ray inspection of highly complex assemblies. Even higher fault detection is possible with the combined AOI option. The latest solder paste inspection system SPI-Line 3D guarantees full flexibility at top speed. Due to a large z-axis measurement range, even the smallest vertical dimensions, such as with sintering paste, can be precisely measured. The universal user interface, PILOT Connect, links all inspection data of automatic optical, solder paste and X-ray inspection. The operational parameters and inspection results for all systems connected can be centrally collected and administered in one verification and repair station.
Innovative embedded board test and in-system programming solutions for lab and production are supported by JEDOS, the strategy for production test of IoT devices. The winner of this year’s Embedded Award allows execution and automatic calibration of RAM tests and flash programming via high-speed interfaces. PCIe, USB 3.0 and GBit Ethernet interfaces can be tested and evaluated by Bit-Error-Rate-Test (BERT) via ChipVORX FXT-32/HSIO4 Module. Test coverage and test depth for production can be adapted freely to the needs of the user. The new JULIET Series2 is the latest generation of Boundary Scan production testers. The compact benchtop instrument is particularly suitable for production test in the low to mid volume range as well as for repair applications. The inline programmer RAPIDO RPS910 can be easily integrated into the production line and ensures reliable programming and test at line speeds. The system has been specifically designed for complex assemblies with compact design elements such as BGAs, which are difficult to contact and require little time in the test sequence.
