Demonstrations to show range of applications for hot bar soldering and heat seal bonding processes used during electronics manufacturing
See Nordson DIMA at IPC APEX Booth 1841
Deurne, The Netherlands – 08 March 2016 – Nordson DIMA, a division of Nordson, will demonstrate its hot bar soldering and heat seal bonding equipment at IPC APEX EXPO 2016, in the booth of sister company, Nordson ASYMTEK, in the South Hall, Booth #1841. Show visitors can learn best practices in hot bar soldering and heat seal bonding processes and find solutions to their challenging assembly applications, like flex-to-flex, flex-to-PCB, and wire-to-PCB assembly, as well as rework.
In hot bar soldering, since the heat from the hot bar (thermode) is transferred by direct contact, sensitive areas or components that are immediately adjacent to the joint are unaffected in the process. Programmable temperature profiles, forces, and time spans lead to a repeatable and reliable hot bar process. Nordson DIMA’s product demonstrations include a desktop soldering system.
This year’s exhibition will be held at the Las Vegas Convention Center, Las Vegas, Nevada, USA from March 13-15, 2016. The IPC APEX EXPO 2016 is an event in the printed circuit board and electronics manufacturing industry where professionals from around the world come together to participate in the technical conference, exhibition, and professional development, standards development, and certification programs.
