NASHVILLE — February 2016 —KYZEN announces plans to exhibit in Booth #E1.1216at productronica China, scheduled to take place March 15-17, 2016, at the Shanghai New International Expo Centre. KYZEN will discuss recent research that points to ways to improve stencil printing reliability. The research strongly supports the need for a wet wipe with an engineered solvent that matches to the flux composition.
The evidence from the study concludes that reliable and acceptable assemblies start with a clean print. In addition, clean prints are more achievable on a reliable basis with engineered solutions, such as CYBERSOLV® C8882 than they are with standard IPA. In addition to sharing the results of the stencil reliability research findings, visitors to the KYZEN boothcan acquire custom technical support to help reduce misprints and increase production yields at no cost.
CYBERSOLV® C8882 will be featured in the KYZEN booth. C8882 isa fast-acting stencil cleaning solvent designed for the under-stencil on printer wipe cleaning process. The solvent dries quickly, eliminating the streaking and smearing experienced with traditional cleaning solvents.
With more than 25 years’ experience and more than 50 industry awards,KYZEN connects leading science with care to create the most effective cleaning solutions for each customer’s unique manufacturing process or problem.
You can request the technical paper entitled, “Understencil Wipe Cleaning Yield Improvements” from the KYZEN E-Knowledge center at www.kyzen.com.
KYZEN® and CYBERSOLV®are registered trademarks in the United States and other countries.
