DELAWARE, OH ― January 2016 ― Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3010 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
DF-3010 is available in other thickness formats from 5 to 50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3010 film is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. It is hydrophobic in nature, providing for chemical and moisture resistance. DF-3010 is compatible with and can be used in contact with the EMS line of spin coatable photoresists.
DF-3010 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.
For more information about the DF-3010 negative photo resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
