Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at ICEPT 2015, August 11-14 in Changsha, China.
Dr. Lee’s first presentation, Partially-Dried No-Clean Flux At Under-Component Terminations: Risks and Solutions, will discuss a new halogen-free no-clean SnAgCu solder paste that has been developed to address the reliability issues caused by insufficiently dried or burnt-off flux residue that can affect reliability.
Achieving High Reliability Via Pressureless Sintering of Nano-Ag Paste for Die-Attach reveals the results of developing a nano-Ag sintering paste designed for a pressureless sintering process under air. The paste was tested in different sintering temperatures and evaluated for porosity and effects of thermal aging.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
ICEPT 2015 is a four-day event featuring the latest technological developments in electronics packaging, manufacturing and packaging equipment, and emerging research and development trends. For information, visit www.icept.org.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
