Infineon Technologies AG announced that it supplies the embedded Secure Element (eSE) chip for the new premium smartphones Samsung Galaxy S6 and S6 edge. Infineon’s SLE 97 is a SOLID FLASH™-based eSE chip which can safeguard the functionalities of the mobile device as well as transactions where users’ sensitive data such as payment credentials are concerned.
“We are proud that the SLE 97 has been selected by our customer Oberthur Technologies to secure Samsung’s new flagship smartphones Galaxy S6 and
S6 edge,” says Stefan Hofschen, President of the Chip Card & Security Segment of Infineon Technologies. “Our embedded Secure Element chips can protect the device as well as user data and are therefore essential for a seamless and secure customer experience in an increasingly connected world.”
The Samsung Galaxy S6 and S6 edge are Samsung’s new premium smartphones introduced at the “Unpacked 2015” in Barcelona.
Infineon at Mobile World Congress
Infineon will exhibit its comprehensive portfolio for performance and security in the connected world at the Mobile World Congress 2015 in Barcelona, Spain (Hall 6, Booth 6B62). Further information is available at: www.infineon.com/mobile or twitter.com/Infineon
