SST’s patented HARDSIL® technology and GLOBALFOUNDRIES’ CMOS manufacturing expertise combine to extend the limits of today’s ruggedized designs and applications.
SST, an industry innovator in high-temp and rad-hard embedded system solutions, announced today the company has partnered with GLOBALFOUNDRIES to build commercial-ready products for extreme environments and applications.
SST’s patented HARDSIL technology is tested and proven to operate in high-temperature environments — at 250C for more than 1,250 hours, and in high-radiation environments — with a TID performance of > 300 Krads. This is the first time any CMOS process has met these unique and extreme characteristics. This technology advancement also represents a huge milestone in extending reliability, performance and operating lifetimes, while simultaneously simplifying design complexity and reducing Size, Weight and Power (SWaP).
“We have been collaborating with GLOBALFOUNDRIES since 2012,” said Wes Morris, president and chief executive officer of SST. “The result is that SST and GLOBALFOUNDRIES have a qualified CMOS process that SST is already using to develop a family of ARM®-based System-on-Chip (SoC) processors and memories which represent a paradigm shift for the high-temp and rad-hard markets.”
“Our partnership with SST will enable us to produce a disruptive technology in the marketplace for ruggedized applications,” said Gregg Bartlett, senior vice president of the Product Management Group at GLOBALFOUNDRIES. “Now that HARDSIL is implemented and qualified in our foundry, we believe opportunities exist for it to be adopted across a wide-range of high-temp and rad-hard products and market segments.”
