Minneapolis, Minnesota— 06 January 2015 — CyberOptics® Corporation (NASDAQ: CYBE) announces that it will exhibit its latest lineup of SPI and AOI systems at its representative TOYO Corporation’s booth #E6-002 at NEPCON Japan, scheduled to take place January 14-16, 2015 at the Tokyo Big Sight in Japan.
The SE600™ 3D SPI system delivers ‘true’ volume measurement and world-class usability. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility – even on the smallest paste deposits. The award-winning SPIv5 series software offers full touch screen capability and world-class user experience for easy, flawless inspection.
The QX150i™ AOI system offers high value, flexible inspection for all applications and is ideally suited for pre-reflow and selective solder inspection. With higher sensor resolution (12µm) and enhanced illumination, QX150i™ offers crisp images for accurate inspection with lowest false call rates. Also, the system is designed to provide easy wedge-in replacement of existing conveyors.
The QX100™ redefines tabletop inspection by combining the performance of an in-line inspection system with the flexibility of a tabletop system. The system features CyberOptics’ unique image acquisition technology, the Strobed Inspection Module (SIM), and is capable of inspecting component sizes down to 01005.
All CyberOptics’ AOI systems are powered by AI2 (Autonomous Image Interpretation), giving you the power to inspect ‘ANYTHING’ without having to anticipate defects or predefine variance. AI2 offers precise discrimination even with excessive variance and delivers accurate results with just one example. All this means lowest false calls, zero escapes and minimal tuning.
