BANNOCKBURN, Ill., USA, June 20, 2013 — IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance. Produced by IPC together with co-host Amkor Technology, the event will take place September 10–12, 2013, at the Hilton Phoenix Chandler in Chandler, Ariz.
“There’s tremendous pressure to innovate at the component level, and that’s driving the research behind new approaches to design, materials and processes,” says Ron Huemoeller, senior vice president, advanced product development, Amkor Technology, Inc. “This event provides access to the experts who are behind the latest advancements in IC-to-board-level interconnections.”
The event begins Tuesday, September 10, with two workshops. Phil Marcoux, PPM Associates, will present a half-day workshop on “Design and Fabrication of Semiconductor Package Interposers and Substrates for Today’s Demanding Applications”; the afternoon workshop, presented by Nozad Karim, Amkor Technology, addresses “System Integration and Design Challenges.”
Wednesday, September 11, opens with a keynote, “What is Happening at the Package/System Integration Level?” featuring Ron Huemoeller. Technical conference sessions for the rest of the day cover: trends in advanced circuit board technologies, presented by Hayao Nakahara, N.T. Information Ltd.; advancements in silicon interposers and alternatives, presented by Linda Matthews, TechSearch International Inc.; the impact of different interposers on power saving for memory modules, presented by Nozad Karim; techniques in copper plating and etching, presented by Lynn Michaelson, Technic, Inc.; next generation packaging, presented by Mark Poliks, Endicott Interconnect Technologies; sintering pastes, featuring Jim Haley, Ormet Circuits; copper foils in low-loss and high-speed and the IC packaging process, presented by Rocky Hilburn, Insulectro; and designing high-performance DIMM-in-a-package on-board memory modules, presented by Zhuowen Sun, Invensas.
Thursday, September 12 includes sessions on I/O optimization with Humair Mandavia, Zuken, Inc.; trends in PCB and IC packaging substrates with Brandon Prior, Prismark Partners, LLC; next generation OSP technology with Michael Carano, OMG Electronic Chemicals; polymer challenges in 3-D integration, featuring Jeff Gotro, InnoCentrix; and the future of packaging for computing electronics, presented by Ram Viswanath, Intel.
For more information about IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, or to register, go to www.ipc.org/chip. Information about sponsorship and tabletop exhibit opportunities is available from Maria Labriola, IPC sales manager, at +1 847-597-2866 or MariaLabriola@ipc.org.
