PF606-P245 to solve HoP issues, Improve ICT Testability at SMTAI Exhibition: September 19-20, 2017 booth # 534 Donald Stephens Convention Center, Rosemont, IL SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability…
The high art of efficient enamelled-copper wire soldering

For more than 20 years, EUTECT GmbH has been developing and manufacturing selective soldering modules for processing copper wire. Tightening thermal requirements imposed between copper wire and connectors, for instance in the products of the automotive supply and consumer goods…
QFN Center Pads on PCB Boards

The QFN (quad flat pack, no leads) package can no longer be considered exotic. It was about a decade ago, but not any more. In fact, with the wafer scale BGA, it’s one of the more common packages for new…

Indium Corporation has published 35 technical articles, 24 blog posts, and 14 videos to help members of the global electronics assembly industry solve voiding challenges. “Voiding is one of the most prevalent challenges facing electronics manufacturers today,” said Christopher Bastecki,…