Packaging Advancements Critical to Power Processing and Delivery Performance
Packaging for power electronics has evolved from simple metal bending to advanced materials and thermo-mechanical design, and from freestanding supply ...
Read more
Tag: Semiconductor & IC
Xilinx Showcases Smarter Solutions for Data Center Efficiency at Intel Developers Forum 2014
Bangalore, Sept 4, 2014 – Xilinx, Inc. announced it will showcase smarter solutions for data center efficiency at the Intel ...
Read moreTSMC Adopts Cadence Solutions for 16nm FinFET Library Characterization
Virtuoso Liberate Characterization Solution and Spectre Circuit Simulator together double the speed of characterization for 16nm FinFET libraries Highlights: Output ...
Read more
Analog Devices Introduces High-Temperature MEMS Gyro for Oil and Gas Drilling Equipment
Specified to 175-degree Celsius operation, the ±2,000°/sec ADXRS645 MEMS gyroscope replaces magnetometers in down-hole drilling applications as a reliable method ...
Read moreInfineon Ready to Appeal European Commission Decision in Antitrust Inves-tigations against Smart Card Chip Producers; Among Other Companies EC Fined Infineon Euro 82.8 Million
Neubiberg, Germany: Today, the European Commission adopted a decision in its antitrust investigation against four semiconductor companies active in the ...
Read moreAltera receives Fuji Xerox Premier Partner Award
This is the Second Consecutive Year Award for Meeting Rigorous Quality, Cost and Delivery Standards Hong Kong, September 3, 2014 ...
Read more
DLP® LightCrafter™ developer tool from TI
TI announces first DLP® LightCrafter™ evaluation module for video and data display applications features smallest, brightest and most efficient DLP® ...
Read more
It is a professionally managed electronics print media with highly skilled staff having experience of this respective field.
