Renesas Electronics’ R-Car Virtualization Software Package Paves Way for Integrated Cockpit and Connected Car Devices with Hypervisor for R-Car System-on-Chip

TOKYO, Japan, June 28, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the “R-Car virtualization support package” that enables easier development of hypervisors for the R-Car automotive system-on-chip (SoC). The R-Car virtualization…
Polymer capacitors offer improved performance over MLCC types

Swindon, UK – 20 June 2018 – Available from Rutronik, Panasonic polymer capacitors not only overcome the current shortage and very long lead time problems associated with multi-layer ceramic capacitors (MLCCs) but offer significant performance improvements in many areas too.…