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Bangalore, 27 April 2017, Premier Farnell, the Development Distributor, is today announcing a new global franchise agreement with Dialog Semiconductor. The agreement further enhances Premier Farnell’s semiconductor power management and wireless product ranges.
Dialog Semiconductor products offer high performance power saving solutions, particularly for smartphones, power adapters, solid state lighting and emerging IoT applications. They bring decades of experience to the rapid development of ICs while providing flexible and dynamic support in key product areas such as power management, power conversion and connectivity.
The addition of Dialog Semiconductor ranges broadens Premier Farnell’s offering for electronic design engineers developing products for home appliances, networking, smart home, smart lighting and smart meter markets.
Simon Meadmore, Global Head of Semiconductors, Premier Farnell, said: “As the Development Distributor, we are committed to working with our customers to understand their design requirements and helping them to develop their products and businesses. One way we do this is by providing a wide product range together with leading technical expertise. This new agreement expands our product range, and coupled with Dialog Semiconductor’s advanced system-level knowhow, deep portfolio of intellectual property and mixed signal innovation, further enables us to provide a full service solution for customers. We have extensive experience in supporting our customers from design to initial production, and now, as part of the Avnet group, we can guide our customers as they take their products to high volume production, providing a true end-to-end solution.”
Tom Sandoval, Senior Vice President Worldwide Sales, Dialog Semiconductor, said: “We are excited about our new partnership with Premier Farnell and the associated synergies with Avnet, our exclusive WW broad channel distributor. This agreement enables a wider community of customers a true prototype to production channel for Dialog’s leading products and technologies.”
Open interface standard also developed to encourage further application development across the embedded industry
Sydney, Australia: 4D Systems today introduced the modules-on-the-go (MOTG) series, which provides a simple plug-and-play interface to the 4D Systems gen4 range of DIABLO16 and PICASO intelligent display modules. Responding to demand for additional display-module interface and communication capabilities, the MOTG series has been designed specifically to satisfy customer need. In providing this connectivity 4D Systems has developed the Universal MOTG Interface (UMI), which is published as an open standard.
Initially the MOTG range comprises four modules, providing WiFi, Bluetooth (BLE), RS232 or RS485 connectivity. The modules plug into an interface board that also links to either a gen4 DIABLO16 or PICASO display. A fifth MOTG module adds MP3 playback functionality.
The MOTG-WiFi-ESP module provides WiFi connectivity through an Expressif ESP8266 WiFi SoC and suits use in IoT/Industrial IoT applications.
Providing Bluetooth 4.0 / 4.2 / low energy connectivity is the MOTG-Bluetooth module, which incorporates a Microchip BM70BLES1FC2 device.
Serial communication is accommodated with either the MOTG-RS232 or MOTG-RS485 (differential) modules.
In addition to the MOTG connectivity modules, the MOTG-MP3 provides MP3 playback capability using a 16-bit MCU audio decoder.
Connection to the gen4 DIABLO16 display module is via the MOTG-AC1 – a one-slot interface board, or the two-slot MOTG-AC2. The PICASO display module uses the MOTG-AC3 one-slot interface board.
The MOTG approach provides an extremely quick and convenient method of adding a host of low-profile connectivity options to the gen4 series of display modules. It also opens up the use of the display modules in a broad range of embedded applications. By developing the UMI as an open standard, 4D Systems encourages developers to implement it in any design. Making this approach accessible to any embedded design is the MOTG-BREADTOOTH prototyping board, which allows the use of any MOTG module with virtually any host.
Full details on the MOTG series can be found here: http://www.4dsystems.com.au/pr
More technical details on the modules including the UMI specification can be found within the MOTG series data sheet: http://www.4dsystems.com.au/pr
A short video introduction to the MOTG series can be found here: https://www.youtube.com/watch?
The MOTG series is now available to order from authorized distributors or via the 4D Systems website.
The MOTG-Wifi-ESP module is priced at $26.00, the MOTG-Bluetooth $29 and the MOTG-RS232 $14.
Broad product range; IP65, IP67, IP68/NEMA 6P and IP69K compliant; suits all industry sectors including food & beverage
April 2017… Aerco, the distributor and stockist of electrical and electronic components servicing hi-rel markets, announces it has added Alpha Connect high-performance products for industrial connectivity from leading manufacturer Alpha Wire to its cord sets and accessories portfolio. Alpha Connect addresses the rapidly growing industrial automation market and provides an end-to-end solution for connecting sensors and actuators on the factory floor, ensuring reliable and safe communications that increase productivity and reduce downtime.
Alpha Connect’s product offering includes M8, M12, M23, MINI and RJ45 cordsets; M8 and M12 passive distribution boxes, splitters; M8, M12 and MINI field attachables and receptacles. As the Alpha Connect system offers environmental sealing and products are IP65, IP67, IP68/NEMA 6P and IP69K compliant, no additional enclosures are needed for protection. Exceptional environmental and mechanical ruggedness means Alpha Connect is suitable for use in all industrial environments, including wash down areas, conveyor systems, pick and place systems and many more. Stainless steel models with IP69K protection and washdown capabilities are also suitable for food and beverage applications, as they offer protection against corrosion and aggressive chemical and cleaning agents.
Aerco’s Cable, Wire & Accessories Sales Manager, Nicki Setterfield comments: “We are delighted to be able to offer the new Alpha Connect product line to our customers with no minimum order quantities on standard products. Cordsets are available in 0.6m, 1m, 3m, 5m, 10m, 15m and 20m standard putup lengths and we also offer custom designs utilizing the proven and trusted Alpha wire and cable products.”
Amphenol Advanced Sensors provide highly-accurate battery temperature sensing for enhanced battery performance – now at TTI
Suits EV/HEV automotive applications and industrial portable power applications
April 2017 - A new comprehensive range of battery temperature sensing products from Amphenol Advanced Sensors for use in electric and hybrid electric vehicles and industrial portable power applications can now be sourced in Europe through TTI, Inc., a world leading specialist distributor of electronic components. The range offers reliable and accurate temperature measurement, an issue that is critical to long-term battery performance. Products include negative temperature coefficient (NTC) thermistors that combine high accuracy and temperature stability to set the industry performance standard.
The accuracy, reliability and flexibility of this Amphenol Advanced Sensors range means it is used extensively in various guises for a wide range of applications. It is ideal for measuring the surface temperature in battery cells, cases and packs, particularly where space is limited. In addition, thin-film, flexible versions that conform to differing geometric shapes and sealed versions for insertion directly into coolants are also available.
The Amphenol range of automotive temperature sensors offers products with a proven, robust quality record for both engine management and battery temperature monitoring. Products for heating and ventilation systems for both automotive and heavy-duty truck applications are also available. The range is also used in marine and bike applications. For industrial applications, Amphenol offers one of the most comprehensive ranges of products available today that include high temperature thermistors, gauge drivers, sensors and elements. These provide reliable temperature sensing for many segments of the industrial market including the medical and telecommunication industries.
Customised versions can be designed to meet bespoke applications and a version is supplied that forms a remote data bridge for communication from battery management systems to Cloud- based control systems.Read more
· Net revenues of $1.82 billion, up 12.9% year-over-year on growth across all product groups
· Gross margin of 37.6%, up 420 basis points year-over-year
· Net income of $108 million, year-over-year improvement of $149 million
· Cash dividend of $0.24 per common share payable in equal quarterly installments to be proposed to the 2017 Annual General Meeting of Shareholders
Geneva, April 27, 2017 - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, reported financial results for the first quarter ended April 1, 2017.
First quarter net revenues totaled $1.82 billion, gross margin was 37.6%, and net income was $108 million, or $0.12 per share.
“The positive momentum we have had over the last quarters has continued entering 2017,” commented Carlo Bozotti, STMicroelectronics President and Chief Executive Officer.
“In the first quarter, both revenues and gross margin were better than the mid-point of the guidance. Year-over-year, revenues increased 12.9%, with a synchronized and well-balanced growth across product groups, regions and sales channels. Both operating and net income significantly improved year-over-year, increasing to $129 million and $108 million, respectively, in the first quarter. Free cash flow, during a quarter of higher capital spending to support our growth plans, doubled to $62 million on a year-over-year basis.
“Our objective for 2017 is to achieve sustainable revenue growth and margin expansion through our strategic focus on Internet of Things and Smart Driving. Our results in this first quarter are putting us on the right trajectory.”
First Quarter Review
First quarter net revenues decreased 2.1% sequentially; a better than seasonal performance and 30 basis points better than the midpoint of the Company’s guidance. On a sequential basis, both Analog and MEMS Group (AMG) and Automotive and Discrete Group (ADG) performed better than the Company average, with AMG revenues up by 1.6% and ADG down by 1.2%. On a sequential basis, Microcontrollers and Digital ICs Group (MDG) revenues decreased by 2.8% due to lower sales of discontinued businesses partially offset by growth in general purpose microcontrollers. As expected, Imaging Product Division revenues, reported in Others, decreased sequentially reflecting seasonality.
On a year-over-year basis, first quarter net revenues increased by 12.9% on solid growth across all product families. Analog and MEMS Group (AMG) revenues increased 19.9% compared to the year-ago period driven by strong growth in MEMS and analog products. Microcontrollers and Digital ICs Group (MDG) revenues increased year-over-year by 11.4%, or 14.6% excluding discontinued businesses, mainly due to strong growth in general purpose microcontrollers and growth in digital products. Automotive and Discrete Group (ADG) revenues increased year-over-year by 5.6% reflecting growth in automotive and strong growth in power discrete products. Imaging Product Division revenues in the first quarter more than doubled compared to the year-ago quarter driven by ST’s Time-of-Flight technology.
By region of shipment, Asia Pacific, EMEA, and the Americas grew on a year-over-year basis 17.4%, 8.0%, and 5.7%, respectively.
First quarter gross profit was $685 million and gross margin was 37.6%, 60 basis points above the midpoint of the Company’s guidance. On a sequential basis, gross margin increased 10 basis points, above normal seasonality, mainly benefiting from favorable product mix, improved manufacturing efficiencies, and lower unused capacity charges partially offset by normal beginning of year pricing changes for major customers. Gross margin improved 420 basis points year-over-year, benefiting from strongly improved manufacturing efficiencies, favorable product mix, lower unused capacity charges and favorable currency effects, net of hedging partially offset principally by normal price pressure.
Combined R&D and SG&A expenses in the first quarter were $568 million compared to $570 million and $571 million in the sequential and year-ago quarter, respectively.
First quarter other income and expenses, net, registered income of $17 million compared to $25 million and $28 million in the prior and year-ago quarter, respectively, mainly due to lower R&D funding.
Impairment and restructuring charges in the first quarter were $5 million compared to $24 million and $28 million in the prior and year-ago quarter, respectively, mostly related to the set-top box restructuring plan announced in January 2016. The Company continued to make progress on its restructuring of the set-top box business. Exiting the first quarter of 2017, the restructuring plan was on track and achieved a run-rate of about $126 million of the total $170 million of targeted annualized savings expected upon completion.
Operating income in the first quarter of $129 million was stable in comparison to the prior quarter and increased by $162 million on a year-over-year basis.
First quarter operating income before impairment and restructuring charges(1) was $134 million, equivalent to 7.4% of net revenues, decreasing from $153 million, or 8.2% of net revenues in the 2016 fourth quarter mainly due to lower revenues. On a year-over-year basis, operating income before impairment and restructuring charges(1) improved by $139 million reflecting higher revenues, improved product mix, manufacturing efficiencies, better fab loading and benefits from the set-top box restructuring plan.
First quarter net income was $108 million, equivalent to $0.12 per share, compared to a net income of $112 million, equivalent to $0.13 per share, in the prior quarter. On a year-over-year basis, net income improved by $149 million from the net loss of $41 million in the year-ago quarter.
Cash Flow and Balance Sheet Highlights
Capital expenditure payments, net of proceeds from sales, were $219 million during the first quarter of 2017 compared to $100 million in the year-ago quarter.
Inventory was $1.20 billion at quarter end, up 2.5% from the prior quarter. Inventory in the first quarter of 2017 was at 3.8 turns or 95 days.
In the first quarter, the Company paid cash dividends totaling $53 million. Today, ST’s Supervisory Board has proposed to the 2017 Annual General Meeting of Shareholders to declare a cash dividend of US$0.24 per outstanding share of the Company’s common stock, to be distributed in quarterly installments of $0.06 in each of the second, third and fourth quarter of 2017 and first quarter of 2018 to shareholders of record in the month of each quarterly payment.
ST’s net financial position(1) was $518 million at April 1, 2017 compared to $513 million at December 31, 2016. ST’s financial resources equaled $1.98 billion and total debt was $1.46 billion at April 1, 2017.
Total equity, including non-controlling interest, was $4.77 billion at quarter end.
(1) Non-U.S. GAAP measure. See Appendix for additional information and reconciliation to U.S. GAAP.
Second Quarter 2017 Business Outlook
Mr. Bozotti commented, “Entering the second quarter, we continue to see healthy demand, with strong booking trends across all our product groups and regions.
“As a result, we expect second quarter revenues to increase about 5.0% on a sequential basis, representing year-over-year growth of about 12.3% at the mid-point of our guidance range. We anticipate another quarter of margin expansion with second quarter gross margin of about 38.1% at the mid-point, leading to strong year-over-year improvement in operating and net income”.
The Company expects second quarter 2017 revenues to increase about 5.0% on a sequential basis, plus or minus 3.5 percentage points. Gross margin in the second quarter is expected to be about 38.1% plus or minus 2.0 percentage points.
This outlook is based on an assumed effective currency exchange rate of approximately $1.08 = €1.00 for the 2017 second quarter and includes the impact of existing hedging contracts. The second quarter will close on July 1, 2017.
Use of Supplemental Non-U.S. GAAP Financial Information
This press release contains supplemental non-U.S. GAAP financial information, including operating income (loss) before impairment and restructuring charges, operating margin before impairment and restructuring charges, adjusted net earnings per share, free cash flow and net financial position.
Readers are cautioned that these measures are unaudited and not prepared in accordance with U.S. GAAP and should not be considered as a substitute for U.S. GAAP financial measures. In addition, such non-U.S. GAAP financial measures may not be comparable to similarly titled information from other companies.
See the Appendix of this press release for a reconciliation of the Company’s non-U.S. GAAP financial measures to their corresponding U.S. GAAP financial measures. To compensate for these limitations, the supplemental non-U.S. GAAP financial information should not be read in isolation, but only in conjunction with the Company’s consolidated financial statements prepared in accordance with U.S. GAAP.
Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance, or events to differ materially from those anticipated by such statements, due to, among other factors:
· Uncertain macro-economic and industry trends, which may impact end-market demand for our products;
· Customer demand that differs from projections;
· The ability to design, manufacture and sell innovative products in a rapidly changing technological environment;
· Unanticipated events or circumstances, which may impact our ability to execute the planned reductions in our net operating expenses and / or meet the objectives of our R&D Programs, which benefit from public funding;
· Changes in economic, social, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macro-economic or regional events, military conflicts, social unrest, labor actions, or terrorist activities;
· The Brexit vote and the perceptions as to the impact of the withdrawal of the U.K. may adversely affect business activity, political stability and economic conditions in the U.K., the Eurozone, the EU and elsewhere. While we do not have material operations in the U.K. and have not experienced any material impact from Brexit on our underlying business to date, we cannot predict its future implications;
· Financial difficulties with any of our major distributors or significant curtailment of purchases by key customers;
· The loading, product mix, and manufacturing performance of our production facilities;
· The functionalities and performance of our IT systems, which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers or suppliers;
· Variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations;
· The impact of intellectual property (“IP”) claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions;
· The ability to successfully restructure underperforming business lines and associated restructuring charges and cost savings that differ in amount or timing from our estimates;
· Changes in our overall tax position as a result of changes in tax laws, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets;
· The outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant;
· Product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts;
· Natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, health risks and epidemics in locations where we, our customers or our suppliers operate;
· Availability and costs of raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations; and
· Industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers.
Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward looking terminology, such as “believes,” “expects,” “may,” “are expected to,” “should,” “would be,” “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions.
Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2016, as filed with the SEC on March 3, 2017. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this release as anticipated, believed, or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.
STMicroelectronics Conference Call and Webcast Information
On April 27, 2017, the management of STMicroelectronics will conduct a live webcast of its conference call to discuss the Company’s operating performance for the first quarter of 2017.
The conference call will be held at 9:30 a.m. CET / 8:30 a.m. BST / 3:30 a.m. U.S. Eastern Time (ET) / 12:30 a.m. U.S. Pacific Time (PT). The live webcast and presentation materials will be available by accessing http://investors.st.com. Those accessing the webcast should go to the Web site at least 15 minutes prior to the call, in order to register, download and install any necessary audio software. The webcast will be available until May 12, 2017.Read more
April 26, 2017 - Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the CC3120 SimpleLink™ Wi-Fi network processor from Texas Instruments (TI). Part of TI's SimpleLink microcontroller platform, the CC3120 Wi-Fi Internet-on-a chip™ device is comprised of a wireless network processor and power management subsystems, featuring a dedicated ARM® Cortex®-M3 microcontroller. The device allows for optimal network flexibility and maximum connectivity for Internet of Things (IoT) solutions for a multitude of microcontroller applications.
The TI CC3120 SimpleLink Wi-Fi network processor, available from Mouser Electronics, allows designers to run Wi-Fi and Internet protocols implemented in the ROM, which in turn runs its dedicated on-chip ARM Cortex-M3 network processor to significantly offload the host microcontroller and simplify system integration. The on-chip microcontroller helps to completely offload Wi-Fi and Internet protocols from the application microcontroller, handling all the details of Wi-Fi connectivity — including identity, data and code security — without requiring any host processor resources. To simplify the integration and development of networking applications, the CC3120 is supplied with a slim and user-friendly host driver that can be easily ported to most platforms and operating systems. This flexibility essentially enables a designer to connect to just about any microcontroller to the IoT cloud using the CC3120.
The CC3120 is supported by TI's SimpleLink Developers Ecosystem, which enables designers to reuse code and add any combination of the portfolio's devices into their design using a common development environment, core software development kit (SDK), and rich tool set. For development, Mouser is also stocking three development tools: the CC3120 BoosterPack™ Plug-in-Module, the CC31XXEMUBOOST Advanced Emulation BoosterPack, and CC3220SF LaunchPad™ Development Kit.
Target IoT applications for the CC3120 include cloud connectivity, Internet gateways, home and building automation, appliances, access control, security systems, smart energy, industrial control, smart plug and metering, wireless audio, IP network sensor nodes, asset tracking and medical devices.
To learn more about the CC3120 processor and associated development tools, visit http://www.mouser.com/new/
With its broad product line and unsurpassed customer service, Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Mouser stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.Read more
SAN CARLOS, Calif. — April 26, 2017— Alliance Memory today introduced a new 1Gb high-speed CMOS double data rate synchronous DRAM (DDR SDRAM) in the 66-pin TSOP II package. Offered in an industrial temperature range from -40°C to +85°C, the AS4C128M8D1-6TIN features a hard-to-find internal configuration of four banks of 32M word x 8 bits.
With a clock frequency up to 166 MHz for fast data transfer rates, the device released today provides a reliable drop-in, pin-to-pin compatible replacement for a number of similar solutions in industrial, medical, communications, and military products requiring high memory bandwidth. The DDR SDRAM operates from a single +2.5V (±0.2V) power supply, features a power down mode to lower power consumption, and offers a data mask for write control.
The AS4C128M8D1-6TIN supports sequential and interleave burst types with read or write burst lengths of 2, 4, or 8. Operating the device's four banks in an interleaved fashion allows random access operation to occur at a higher rate than standard DRAMs, while a sequential and gapless data rate is possible depending on burst length, CAS latency, and speed grade. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh.
Alliance Memory offers an extensive lineup of DDR SDRAMs featuring densities of 64Mb, 128Mb, 256Mb, 512Mb, and 1Gb. For the company's customers, these devices eliminate costly redesigns by providing long-term support for products that have been end-of-lifed (EOLed) by other suppliers.
Samples and production quantities of the AS4C128M8D1-6TIN are available now, with lead times of four to eight weeks.Read more
New Vishay Intertechnology AEC-Q200 Qualified Inductor Is Industry's First With 125 A Continuous Current Rating
Device Features 190 A Saturation Current for 20 % Inductance Reduction and Continuous High Temperature Operation to +155 °C
MALVERN, Pa. — April 26, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new AEC-Q200 qualified inductor that is the industry's first to offer a continuous current rating of 125 A. For automotive and industrial applications, the Vishay Dale IHXL-2000VZ-5A features a 190 A saturation current for 20 % inductance reduction and continuous high temperature operation to +155 °C. Mounting options for the device include through-hole, solder, welded, or bolt-on.
The device released today is optimized for electric vehicles (EV), hybrid electric vehicles (HEV), solar, and wind power applications. With dimensions of 50.8 mm by 50.8 mm by 21.5 mm, the IHXL-2000VZ-5A's 2000 case size is the largest available for a composite inductor. The inductor features an effective filtering frequency range up to SRF (13.1 MHz for 2.2 µH), very low DCR down to 0.21 mΩ typical, and nominal inductance of 2.2 µH, with additional inductance values to be offered in the future.
The IHXL-2000VZ-5A handles high transient current spikes without hard saturation. Packaged in a 100 % lead (Pb)-free shielded, composite construction that reduces buzz noise to ultra low levels, the inductor is specified for an operating temperature range of -55 °C to +155 °C, with high resistance to thermal shock, moisture, and mechanical shock. The device is RoHS-compliant, halogen-free, and Vishay Green.
Samples and production quantities of the IHXL-2000VZ-5A are available now, with lead times of 12 to 14 weeks for large orders.Read more