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    Zyxel to showcase new heights of mobility and flexibility at Mobile World Congress 2017

    Providing seamless communications, indoors, outdoors and on the move will be the watchword for Zyxel’s exhibition offering in Barcelona

    New Delhi, January 19, 2017: Zyxel Communications, will showcase its Mobile Access (LTE) and In-Building Coverage solutions at this year’s Mobile World Congress in Barcelona. As the industry’s “Networking Ally,” Zyxel is refocusing its efforts on providing solutions to address the overriding concerns of network operators: how they can help their customers achieve the best mobility and flexibility in their communications.
    Featured at the show will be Zyxel’s Mobile Access (LTE) solutions, specifically targeting areas of the market where fixed broadband networking is difficult and provision is traditionally limited. Zyxel’s brand new 4G LTE-A CAT6 indoor IAD, which provides users with high-speed LTE and high-end Wi-Fi, is set to make its debut appearance at MWC 2017, proving that Zyxel is on course to revolutionize the way in which consumers can seamlessly access 4G LTE networks.
    We aim to solve the issues that operators have struggled with in the past – providing connectivity when their customers are in areas where fixed broadband is unavailable”, said Wayne Hwang, Vice President of Zyxel’s Service Provider Strategic Business Unit. “With our Mobile Access solutions, we can support operators in building strong and inclusive mobile broadband networks.”
    Also on show at MWC will be Zyxel’s In-Building Coverage solutions, designed to meet the challenge of mobile signal coverage within large buildings. Mobile users moving inside a building often find that signal strength is not as good as outdoors. Zyxel’s In-Building Coverage Solutions, Zone DAS and the MIMO Repeater, eliminate this problem and provide seamless communications even in high-demand environments such as airports, shopping malls, hotels and transport hubs.
    At MWC 2017, Zyxel will emphasize its crucial role as a solution provider of the networks of the future – a future which will become increasingly accessible and viable for all customers, no matter what previous difficulties they have faced.
    Zyxel will be exhibiting at Booth 5G10, Hall 5, at MWC 2017, which takes place at the Fira Gran Via, in Barcelona, from Monday, February 27 to Thursday, March 2, 2017.

    About Zyxel Communications:

    Focused on innovation and customer-centricity, Zyxel Communications has been connecting people to the Internet for nearly 30 years. Our ability to adapt and innovate with networking technology places us at the forefront of creating connectivity for telcos and service providers, business and home users.
    Zyxel is building the networks of tomorrow, unlocking potential, and meeting the needs of the modern workplace — powering people at work, life, and play. Zyxel, Your Networking Ally.
    -           1,500 passionate associates worldwide
    -           100 million devices creating global connections
    -           700,000 businesses working smarter with Zyxel solutions
    -           150 global markets served

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    Escalate Your Wireless Backhaul Performance To a New Level With AXILSPOT’s AIP5 Wireless Bridge

    The new AIP5 11AC wireless bridge is customised for optimum performance in harsh outdoor conditions and comes as a perfect solution for ISPs to quickly scale up broadband backhaul

    New Delhi, January 19, 2017: AXILSPOT, Further expanding its portfolio of cutting edge enterprise wireless solutions, AXILSPOT, the industry leader in enterprise WLAN solutions has rolled out its AIP5 11AC wireless bridge solution tailored to operate in adverse climatic conditions.
    AIP5 11AC is an exemplary solution for Internet Service Providers (ISPs) to amplify broadband backhaul as well as furnish wireless service in areas where fixed line resources are scarce.
    The service providers can gain a competitive edge by offering best in class wireless backhaul performance at ranges extending to up to more than 10 kilometres.
    The AIP5 features a pole-mount shape for hassle free installation and maintenance and operates at 5GHz frequency. The industry leading RF technology embedded in the solution also offers 900 Mbps RF capacity. It also incorporates 2 GE ports with the main port supporting 24V Passive POE while the sub port is capable of powering other devices.
    The AIP5 comes as a perfect solution for schools, factories, warehouses and other enterprise environments where extension of network is critical across remote structures and where Ethernet line connectivity is not possible.
    To further facilitate the installation of the solution, AXILSPOT has a local office in India and operations with local sales, support team along with a PAN India distribution network across the country which is expanding fast.

    Salient Features of AIP5:

    High Capacity RF Performance:
    The 802.11ac Gigabit Wi-Fi coupled with Gigabit Ethernet enables fast data forwarding without any congestion making it ideal for a high-bandwidth hungry scenario.
    The Proprietary TDMA (Time Division Multiple Access) technology also enhances throughput and reduces latency, concluding in higher network capacity as well as stability.
    Perfect for outdoor Harsh Environments:
    AIP5 is designed to be rugged as well as cater to the requirements of industrial applications like Enterprise, Hub, Mining, school and construction. It leverages industrial grade components as well as waterproof/ dustproof housing design for a consistent performance in extreme outdoor conditions. Its hardware structure ensures safety of components from static electricity and lightning.
    Convenient Deployment:
    The power module incorporated in the solution enables remote device reset, for an easy and flexible installation.
    Centralized Management:
    A unified management podium manages all wireless outdoor CPE and station series products, shrinking the workload of maintaining and managing large scale deployments.
    Other key features of the AIP5 solution include:·

    • Furnishes a continual coverage,  ranges from 10~20km
    • Best for uninterrupted ptp / ptmp link
    • Best for WISP solution providers
    • Eliminate interference by using 802.11ac 900 mbps 5GHz link

    About AXILSPOT:
    AXILSPOT is a new force to reckon in the global Enterprise WLAN industry with the core intellectual property rights. AXILSPOT delivers Global Quality Products with superior innovative solutions to the most critical issues we are facing today in wireless networks: how to create affordable reliability and how to overcome dramatically increasing connected needs all over the world.
    AXILSPOT is dedicated to provide the most consistent and highest-speed wireless coverage and transmission solution(s) – anywhere, everywhere, all the time.
    The company’s solutions can be widely implemented in Large Corporate Enterprises, Government, Education, Hospitality, Transportation, Manufacture, Financial, Healthcare and SMEs among other critical industry verticals.

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    Artesyn and Hyukshin Collaborate on SIL4 Rail Signaling Solutions

    HONG KONG [19 January, 2017] — Artesyn Embedded Technologies today announced a collaboration with Hyukshin Engineering Co., Ltd, a leading rail integrator in South Korea, for the development of rail signaling solutions based on Artesyn’s ControlSafe™ Platform. The two companies have signed a memorandum of understanding (MOU) for broad cooperation on the development of safety integrity level 4 (SIL4) commercial-off-the-shelf (COTS) systems for train control and rail signaling.

    Seunghyun Park, marketing director at Hyukshin Engineering, said: “The adoption of the SIL4 safety standard is a global trend in the rail industry. Throughout the 60 years of Hyukshin’s history we have been dedicated to serving our end customers with highly safe and reliable solutions without compromise. Artesyn’s ControlSafe Platform provides an application-ready, cost-effective solution that can help us substantially accelerate time-to-market for our next generation computer-based interlocking (CBI) systems. By adopting the platform as a safety computing engine, we do not have to start our development from scratch, and therefore we can focus on the differentiation and value that makes Hyukshin a leading player in the industry. More importantly, we can significantly reduce the costs and risks of the SIL4 system development and certification process, saving potentially millions of dollars and many years.”

    Linsey Miller, vice president of marketing for Artesyn Embedded Technologies, said: “Artesyn has been providing VME products for Hyukshin’s rail signaling solutions for more than 15 years, so we have a solid foundation of mutual understanding and trust. This MOU strengthens our strategic relationship to develop and promote next generation rail safety solutions based on Artesyn ControlSafe technologies. We believe that, as Hyukshin strives to expand its business in both domestic and international markets, the company’s leading market position and influence will help both companies gain market traction to capitalize on the fast-growing rail infrastructure market.”


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    ASCENTECH, LLC Exhibiting Contamination Testing and Optical Inspection Solutions at IPC/APEX 2017

    Chester, Connecticut, USA – Ascentech, LLC, the North American distributor for GEN3 Systems products and other quality lines of test and productivity solutions, will be exhibiting the latest innovative contamination testing, optical inspection, and other productivity-enhancing technology at IPC/APEX in San Diego. Ascentech will show the remarkable GEN3 CM22+, one of the company’s award-winning CM+ range of contaminometers. The CM+ Series measure the amount of ionic contamination in accordance with all existing test methods often referred to as ROSE testing as well as the new PICT test. The CM22+ is a freestanding system able to accommodate larger assemblies while maintaining a low surface area to test solution ratio.

    Gen3-CMThe Six Sigma-verified CM Series is the World's first and only combined ROSE and PICT tester. The system accurately measures the amount of ionic contamination present on a circuit board, component or assembly.

    Also shown will be HD camera inspection systems and a BGA inspection station from Optilia Instruments AB, an OEM provider of obstruction‐free, fatigue‐free High‐definition benchtop inspection for PCB assembly, and real‐time BGA inspection solutions. Ascentech, LLC is the North American Distributor for Optilia. Ascentech will also exhibit the GEN3 Solder Saver, a hand-held, compact system for separating dross from good solder.

    For more information, visit booth #3136 at IPC/APEX 2017, or visit www.ascentechllc.com.  For sales and technical information, contact Randy Allinson, Ascentech, 127 Goose Hill Rd., Chester, CT, 06412: Tel 860-526-8903, e-mail randy@ascentechllc.com, or info@ascentechllc.com.

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    Anritsu Bluetooth Test Set MT8852B Supports Bluetooth 5 for IoT Device Bluetooth RF Tests

    Anritsu-MT8852b_low-energyBangalore (India) – January19th, 2017– Anritsu Corporation will launch a new RF measurement option for its Bluetooth Test Set MT8852B supporting the latest Bluetooth5specification.

    Bluetooth 5 adds higher data rate and longer range modes of operation to the existing Bluetooth Low Energy specification.  2 Mbps operation (2LE) doubles the data rate.  Long range operation (BLR) employs a new coded transmission specification employing forward error correction to improve reliability.  From February 2017 MT8852B will support RF testing of both of these new features.

    [MT8852B Product Outline]

    The Bluetooth Test Set MT8852B is a dedicated instrument that supports the Bluetooth standards with fast and easy measurement of Basic Rate, Enhanced Data Rate (EDR) and, Bluetooth Low Energy devices.  Measurements include transmitted power, carrier frequency offset and drift, modulation characteristics and receiversensitivity. MT8852B has widespread application in Bluetooth product development, verification and manufacturing.



    Madhukar Tripathi

    Anritsu India Pvt Ltd

    Office No 18, Ground Floor,

    Stellar IT park, C25, Sect 62


    Pin Code 201 309

    Phone: +91 120 4211330-31-32


    Cell Phone : +91 9310 666 466


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    Mouser Now Offering Easy Product Search by Images

    January 18, 2017 – Mouser Electronics, Inc., constantly improving how customers can browse and search for products, announces a new way to visually find and select the right products on its industry-leading website, Mouser.com. With a few simple clicks, Mouser customers can now find product information via Images, as well as by Datasheets or by Newest Products — in addition to searching for products through the site’s parametric Product Search. The Images tab at Mouser.com is the newest gateway to Mouser’s extensive product library, containing tens of thousands of photos.


    ImageSearch“The new Images tab lets customers to browse by using any search or navigation function,” said Hayne Shumate, Mouser’s Senior Vice President of Internet Business. “Engineers and buyers can now group and fluidly browse images using the search and filter methods that they already know.”


    Customers can easily switch from a product list to an image list, filtering by specific product groups and browsing the relevant images by product category. For example, Mouser’s website has many thousands of images of connectors. With this new feature, a customer can filter to something as specific as “4-pin Circular Metric Connectors” and then click on the Images tab to see the 98 images of only these products. By clicking an image, customers can see availability, price, configuration options and more details that can greatly help when searching for an appropriate part without having a part number at the start.


    With this new expanded functionality, customers can browse products and narrow product information on their own terms in ways they’ve never been able to before. Whether searching products, product categories or product types, customers can take advantage of Mouser’s new options to easily review additional information to discover and make their selections with flexibility and speed. To watch a video on the new features, go to https://youtu.be/VYts94c7J2U.

    The additional product information on Mouser.com functions much like an enhanced digital catalog, grouping content in four easy-to-access tabs that incorporate search and display options to minimize the number of clicks. To learn about the new ways to browse and search products and product information, including Mouser’s industry-first datasheet grouping, visit http://www.mouser.com/search-options.

    With its broad product line and unsurpassed customer service, Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Mouser stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.


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    Melexis Announces Chipset and Evaluation Kit for ToF 3D Vision in Challenging Environments

    TOF sensor solution with leading sunlight robustness, extended temperature range, enabling fast design of compact and robust 3D ToF cameras.

    Tessenderlo, Belgium, 18 January 2017 – Melexis, the global microelectronics company enabling future innovation through a philosophy of inspired engineering, has announced a chipset and its evaluation kit that simplify and speed the implementation of robust, time‐of‐flight (ToF) 3D vision solutions for the most challenging environments. With this newest addition Melexis continues to strengthen its expertise and know-how in the area of ToF solutions for automotive and beyond.

    Melexis-TOF-sensor-solutionRepresenting a complete ToF sensor and control solution, the chipset supports QVGA resolution and offers unsurpassed sunlight robustness and up to -40°C to +105°C temperature range operation. Using the evaluation kit, designers can test this automotive-qualified chipset and start developing their own custom hardware and application software.

    The Melexis chipset brings together the company’s MLX75023 1/3-inch optical format ToF sensor and the MLX75123, a companion IC that controls the sensor and illumination unit and delivers data to a host processor. Together the devices can minimize the component count and reduce the size of 3D ToF cameras. Designed for maximum flexibility, the modular EVK75123 QVGA evaluation kit combines a sensor board featuring the chipset, an illumination module, an interface board and a processor module.

    The MLX75023 sensor has QVGA (320 x 240 pixel) resolution and industry-leading background light rejection capabilities of up to 120klux. This IC can provide raw data output in less than 1.5 ms, giving it unsurpassed capacity to track rapid movement. The MLX75123 control chip has 12‐bit parallel camera interface and I2C connectivity and 4 integrated high-speed analog-to-digital converters (ADC). Integrated functions include powerful diagnostics and support for region‐of‐interest, configurable timing, image flipping, statistics and switching modulation frequencies.

    As the MLX75023 and MLX75123 have respective footprints of just 7mm x 7mm and 6.6mm x 5.5mm, they require minimal board real estate. The operational robustness of this chipset makes it highly suited to designs for automotive, surveillance and smart buildings, as well as industrial applications including machine vision, robotics and factory automation. Operating temperature range is ‐20°C to +85°C as standard, with an elevated -40°C to +105°C option also available. High-temperature capabilities mean that, unlike alternative solutions, the need for active cooling can be minimized. This leads to a reduction in noise, as well as enabling further cost and space savings in relation to thermal management.

    Consisting of four vertically stacked PCBs - sensor board, illumination board, interface board and processor board - the EVK75123 evaluation kit has an 80mm x 50mm x 35mm form factor and features an NXP i.MX6 multi-core processor. Its illumination unit has 4 VCSELs, with a choice of either 60° field-of-view (FoV) or a wider 110° option for acquiring imaging data from a broader area. Thanks to a modular construction, engineers can choose which elements are needed. For example, they can combine the sensor board (containing the ToF chipset) with the other hardware elements, or simply use it as a standalone module. The processing board can be located away from the sensor and illumination boards as necessary.

    “Through our long-term expertise in both sensor and sensor interface technologies, we are able to provide the advanced silicon needed to implement a 3D imaging system that exhibits superior sunlight robustness and that can deal with elevated temperatures,” states Gualtiero Bagnuoli, Marketing Manager for Optical Sensors at Melexis. “The new chipset, and accompanying evaluation kit provide a comprehensive, fully-integrated, off-the-shelf solution for rapidly developing next-generation ToF 3D camera designs.”

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    GIGABYTE Demonstrates Its Latest Unique Gaming Products and Systems

    The event witnessed a significant gathering of gaming enthusiasts, reviewing the new graphic intensive machines

    New Delhi, January 18, 2017: GIGABYTE India recently organised a special event to give professionals a chance to see its latest unique gaming products and systems. These systems are designed to pack a punch, delivering full gaming MB,CPU,RGB Fusion, Smart Fan 5, in one equally powerful machine in the category.

    GIGABYTE-Motherboards7thGen Intel® Core™ Processors Powered Motherboards

    The AORUS Gaming Motherboards fully support the new Intel 7th Gen Core processors and is also compatible with previous 6th Gen Core Processors. With the new 7th Gen platform, AORUS Gaming Motherboards offer

    increased performance, rich & immersive experiences and versatile and fast I/O.

    AORUS GA-Z270X-Gaming 9, the best high-end levelof Gaming Motherboards.

    • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
    • Intel® USB 3.1 Gen 2 with USB Type-C™ and Type-A
    • 4-Way Graphics Support with Dual Armor and Ultra Durable™ Design
    • EKWB G-Frost Hybrid Water Block
    • Triple NVMePCIe SSDs in RAID 0 Support
    • Dual NVMePCIe Gen3 x4 U.2 Connectors
    • Dual Ultra-Fast M.2 with PCIe Gen3 x4 & SATA interface
    • Intel® Optane™ Memory Ready
    • Creative Sound Blaster certified ZxRi 120dB+ Audio
    • Killer DoubleShot-X3™ Pro for the best networking experience possible
    • RGB FUSION with Multi-Zone LED Light Show design
    • Smart Fan 5 features Multiple Temperature Sensors and Hybrid Fan Headers


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