Electronics news & updates

This agreement leverages Microchip’s mSiC™ technology and Delta’s smart energy-saving solutions to accelerate the development of sustainable applications

National, 18th July 2025: The growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability. Microchip Technology (Nasdaq: MCHP) today announces that under a new partnership agreement with Delta Electronics, Inc. (later referred to as “Delta Electronics”), a global leader in power management and smart green solutions, the companies will collaborate to use Microchip’s mSiC™ products and technology in Delta’s designs. The synergies between the companies aim to accelerate the development of innovative SiC solutions, energy-saving products and systems that enable a more sustainable future.

“SiC is increasingly important in sustainable power solutions because of its wide-bandgap properties, which enable smaller and more efficient designs for high-voltage, high-power applications at a lower system cost,” said Clayton Pillion, vice president of Microchip’s high-power solutions business unit. “We look forward to forging an impactful path with Delta Electronics on innovating SiC solutions to meet the rising demand of the electrification of everything.”

As a global leader in power management, Delta advances its core competence in high-efficiency power electronics and continuously evaluates and leverages next-generation technologies to enhance the energy efficiency of its products and solutions. Delta intends to leverage Microchip’s abundant experience and advanced technology in SiC and digital control to accelerate time to market of its solutions for high-growth market segments such as AI, mobility, automation and infrastructure.

This agreement prioritizes the companies’ resources to validate Microchip’s mSiC solutions to fast-track implementation in Delta’s designs and programs. Other key advantages of the agreement are top-tier design support to include technical training, insight into R&D activities and early access to product samples.  

With over 20 years of experience in the development, design, manufacturing and support of SiC devices and power solutions, Microchip helps customers adopt SiC with ease, speed and confidence. Microchip’s mSiC products include SiC MOSFETS, diodes and gate drivers with standard, modified and custom options. To learn more about Microchip’s mSiC solutions, visit the web page.

For more information about Delta Electronics, visit the company’s website.

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• New license agreement enabling the proliferation of metasurface optics across high-volume consumer, automotive and industrial markets: from smartphone applications like biometrics, LIDAR and camera assist, to robotics, gesture recognition, or object detection.
• The agreement broadens ST’s capability to use Metalenz IP to produce advanced metasurface optics while leveraging ST’s unique technology and manufacturing platform combining 300mm semiconductor and optics production, test and qualification.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and Metalenz, the pioneer of metasurface optics, announced a new license agreement. The agreement broadens ST’s capability to use Metalenz IP to produce advanced metasurface optics while leveraging ST’s unique technology and manufacturing platform combining 300mm semiconductor and optics production, test and qualification.

“STMicroelectronics is the unique supplier on the market offering a groundbreaking combination of optics and semiconductor technology. Since 2022, we have shipped well over 140 million metasurface optics and FlightSense™ modules using Metalenz IP. The new license agreement with Metalenz bolsters our technology leadership in consumer, industrial and automotive segments, and will enable new opportunities from smartphone applications like biometrics, LIDAR and camera assist, to robotics, gesture recognition, or object detection,” underlined Alexandre Balmefrezol, Executive Vice President and General Manager of STMicroelectronics’s Imaging Sub-Group. “Our unique model, processing optical technology in our 300mm semiconductor fab, ensures high precision, cost-effectiveness, and scalability to meet the requests of our customers for high-volume, complex applications.”

“Our agreement with STMicroelectronics has the potential to further fast-track the adoption of metasurfaces from their origins at Harvard to adoption by market leading consumer electronics companies,” said Rob Devlin, co-founder and CEO of Metalenz. “By enabling the shift of optics production into semiconductor manufacturing, this agreement has the possibility to further redefine the sensing ecosystem. As use cases for 3D sensing continue to expand, ST’s technology leadership in the market together with our IP leadership solidifies ST and Metalenz as the dominant forces in the emergent metasurface market we created.”

The new license agreement aims to address the growing market opportunity for metasurface optics projected to experience significant growth to reach $2B by 2029*; largely driven by the industry’s role in emerging display and imaging applications. (*Yole Group, Optical Metasurfaces, 2024 report)

Note to editors
In 2022, metasurface technology from Metalenz, which spun out of Harvard and holds the exclusive license rights to the foundational Harvard metasurface patent portfolio, debuted with ST’s market leading direct Time-of-Flight (dToF) FlightSense modules.

Replacing the traditional lens stacks and shifting to metasurface optics instead has improved the optical performance and temperature stability of the FlightSense modules while reducing their size and complexity.

The use of 300mm wafers ensures high precision and performance in optical applications, as well as the inherent scalability and robustness advantage of semiconductor manufacturing process.

Latest achievements highlight over 60 years of space heritage and commitment to high-reliability, radiation-tolerant technology for next-generation satellite and avionics systems.

National, 11th July 2025:Continuing to support the evolving needs of space system developers, Microchip Technology (Nasdaq: MCHP) has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFireSystem-on-Chip (SoC) FPGA. These achievements underscore the company’s more than 60 years of spaceflight heritage and its commitment to delivering highly reliable, low-power solutions for the most demanding space applications.

MIL-STD-883 Class B and Qualified Manufacturers List (QML) Class Q are industry standards that define rigorous testing and qualification processes for microelectronic components used in high-reliability applications, such as space and defense. MIL-STD-883, developed by the U.S. Department of Defense, outlines methods for environmental, mechanical and electrical testing to ensure device reliability under extreme conditions. QML Class Q, managed by the Defense Logistics Agency (DLA), certifies that manufacturers consistently produce components meeting these stringent requirements.

Unlike traditional SRAM-based FPGAs, RT PolarFire devices utilize nonvolatile technology, making them immune to configuration memory upsets caused by radiation. This eliminates the need for external mitigation measures, helping reduce system complexity and overall cost. RT PolarFire FPGAs consume up to 50% less power than mid-range SRAM-based alternatives, enabling satellite designers to optimize Size, Weightand Power (SWaP) without compromising mission-critical reliability.The PolarFire RTPF500ZT FPGA advances the family’s capabilities, offering enhanced Single Event Latch-up (SEL) radiation performance and increased robustness for inflight programming compared to the original RTPF500T.

"Microchip Technology has a proven track record of supporting critical space missions, spanning low Earth orbit, satellite platforms and deep space exploration," said Shakeel Peera, vice president of marketing and strategy for Microchip’s FPGA business unit. "Our commitment to stringent quality standards, compliance with international regulations and long-term product reliability has solidified Microchip’s reputation as a trusted provider of aerospace hardware. As the industry demands higher performance, increased logic density and robust security, we remain dedicated to innovating solutions that address the evolving needs of modern space systems."

Engineering samples of the RT PolarFire SoC FPGA further strengthen Microchip’s portfolio of space-qualified solutions. This SoC integrates a real-time, Linux®-capable, RISC-V®-based microprocessor subsystem with a flight-proven FPGA architecture, enabling both flexible software support and deterministic real-time performance. With a roadmap to QMLClass V and Class Y, the RT PolarFire SoC FPGA is wellsuited for central satellite processing, avionics and payload control where high reliability is essential.

RT PolarFire devices are supported by the Libero® SoC Design Suite, a comprehensive IP library, reference designs and solution stacks tailored for space applications. RT PolarFire SoC FPGAs also integrate with Microchip’s Mi-V ecosystem for RISC-V development. Additionally, development kits and hardware platforms are available to facilitate rapid prototyping, hardware validationand system integration, enabling engineers to efficiently bring mission-critical space systems from concept to deployment.

Microchip’s latest milestones in radiation-tolerant FPGA technology reflect ongoing progress in addressing the stringent requirements of contemporary space missions. With a focus on continuous improvement and industry collaboration, the company is well positioned to support the next generation of satellite, avionicsand deep space systems. Additional information, technical documentation, and development resources can be found on the Microchip radiation-tolerant FPGA website.

Pricing and Availability

Purchase directly from Microchip or contact a Microchip sales representative or authorized worldwide distributor.

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Bengaluru, July 16, 2025 — Keysight Technologies held its flagship Keysight World Tech Day India on July 8, 2025, at The Leela Palace, Bengaluru, bringing together CXOs, engineers, researchers, and innovators from the electronics and high-tech sectors. The event showcased key technologies shaping the future across multiple industries including telecom, AI, and automotive, offering attendees expert-led sessions, live demonstrations, and in-depth technical tracks designed to accelerate innovation and market readiness in a rapidly evolving technology landscape.

The event also highlighted four key domains shaping the future of technology: 6G and Wireless, AI Infrastructure, Automotive, and AI Networks. Industry experts joined Keysight to explore AI-native 6G networks, THz communication, non-terrestrial networks (NTN), and digital twin-based design for ultra-fast, intelligent connectivity. Experts also discussed advancements in AI infrastructure highlighting compute fabrics, chiplets, optical interconnects, memory, and PCIe® Gen7, which are critical enablers of next-gen AI. The automotive segment covered EV battery testing, V2X, autonomous driving, and cybersecurity for smarter mobility and finally AI Networks focused on network emulation, multi-cloud testing, and cybersecurity validation.

The event featured industry leaders and experts from Keysight including:

•  Sudhir Singh, Country Sales Manager, India at Keysight

•  Mombasawala Mohmedsaeed, General Manager-New Technologies Initiatives, Keysight

•  Manoj Gurnani, Chief Technology Officer at Nokia Bell Labs

•  Vivek Shenoy, VP Engineering at Tejas Networks

•  Anindya Saha, VP R & D at Tejas Networks

•  Ravi Emani, Practice Head-Connectivity at Wipro

•  Satish Kanugovi, Head of APAC Standardization at Nokia

•  Akshay Aggarwal, Senior Director of Engineering at Mediatek

•  Nitesh Gupta, Principal Director, Systems Engineering at Microsoft

•  Navneeth Jayaraj, Principal Hardware Engineer at Microsoft

•  Jeykishan Kumar, Engineering Officer at Central Power Research Institute

•  Shashidhara Basavegowda, Associate Vice President at Tejas Networks

•  Girish Baliga, General Manager-Industry Marketing at Keysight

 Keysight World Tech Day India 2025 also brought together professionals from companies working on deep tech—offering a unique platform for networking, knowledge sharing, and experiencing next-gen innovations that empower the electronics and high-tech community to stay ahead in a complex ecosystem.

Munich, Germany – 10 July 2025 – Leveraging its expertise in magnetic position sensors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the third generation of the XENSIV™ 3D magnetic Hall-effect sensor family, comprising three product series: TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8. Developed in accordance with ISO26262, the sensor family provides integrated diagnostic functions to support functional safety applications up to ASIL-B. Due to their high flexibility, the devices are ideal for a wide range of industrial, consumer, and automotive applications, such as long-stroke linear position measurement, angular position measurement, automotive controls, and pedal or valve position sensing. In automotive applications, they enable control in the interior and under the hood, leveraging three-dimensional measurement functions and high-temperature resistance.

The new sensor family measures the magnetic field in three orthogonal dimensions and operates as an I²C or SPI bus slave. The devices offer enhanced magnetic performance and accuracy, with very low deviation over their lifetime (X/Y < 1.7% X-Y/Z = 6.75%). The 3D magnetic measurement principle and platform adaptability enabled by the device's configurability allow for a reduction in the number of required components. Additionally, the system's power consumption is very low due to its wake-up mode. The TLE493D-X3XX supports a supply voltage of 3.3 V and 5 V and offers 3D magnetic field measurement ranges of ±50 mT, ±100 mT, and ±160 mT. With these linear magnetic range options, the sensors are well-suited for controlling elements in infotainment and navigation systems and multifunction steering wheels. Furthermore, the devices operate reliably in a temperature range of -40°C to 150°C.

Availability

The XENSIV™ magnetic 3D sensors TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8 are available now. More information is available at https://www.infineon.com/cms/en/product/sensor/magnetic-sensors/magnetic-position-sensors/3d-magnetics.

Munich, Germany – 9 July 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its offering for universal serial bus (USB) tokens, dongles, security keys, and other hardware authenticators with the introduction of the new Infineon ID Key family. The newest member, the ID Key S USB is a highly secured and versatile product designed for a wide range of USB- and USB/NFC-token devices and applications. It combines the security, performance, and reliability of the Infineon SLC38 security controller with a USB bridge controller in one single package. It is a unique system-in-package solution that enables high flexibility and simplifies complex application deployments while reducing the bill of materials and related costs. Certified to highest security levels, it supports a range of use cases, including certificate-based authentication, Fast Identity Online (FIDO) authentication with device-bound passkeys, digital signatures, encryption, access control, software protection, and cryptocurrency hardware wallets.

The increasing need for secured online transactions and the growing threat of cyber-attacks have created a surge in demand for secured and hardware-backed authentication solutions. "As the market shifts towards more secured and convenient authentication methods, we see a growing trend towards the adoption of advanced security solutions," said Maurizio Skerlj, Senior Vice President and Product Line Head Authentication & Identity Solutions at Infineon's Connected Secure Systems Division. "With the ID Key S USB, we are well-positioned to address this trend and provide our customers with a robust solution that meets their needs."

The ID Key S USB offers a range of key features that support its secured and versatile design and boasts a comprehensive array of features. Its high-performance capabilities are driven by a 32-bit CPU clocked at 100 MHz and a large 24 kB RAM, enabling ultra-fast and secured execution of applications and delivering excellent operating system performance for a wide range of use cases. The device also offers sufficient memory, with non-volatile memory sizes of up to 800 kB providing ample storage for large amounts of data, cryptographic keys, software, and multiple applications. Furthermore, the ID Key S USB has achieved highest security levels, with certification to CC EAL 6+ (high) and compliance with FIPS 140-3 hardware requirements, allowing customers to apply for FIPS 140-3 certification for their product. The ID Key S USB features a compact footprint of 4 x 4 x 0.85 mm, making it ideal for integration into space-critical token devices.

Availability

The Infineon ID Key S USB is now available for early access customers. Further information can be found on the  webpage .

National, July 09, 2025:  Texas Instruments (TI) has wrapped up the fourth edition of its month-long Women in Semiconductors and Hardware (WiSH) program. WiSH is TI’s flagship mentorship initiative aimed at inspiring and empowering second-year female engineering students across India to pursue impactful careers in core engineering, with a focus on semiconductors and hardware. Built on the previous three editions’ success, the 2025 program attracted over 1,500 registrations and more than 190 participants, reflecting a growing interest in the initiative over the years. 

“The semiconductor industry is evolving rapidly, and the need for skilled talent is greater than ever,” said Santhosh Kumar, Managing Director, Texas Instruments India. “With women representing less than 20% of the people in technical roles in the industry the WiSH program expands access, builds confidence, and fosters engineering capabilities among aspiring women engineers in India. By investing in this next generation of talent, we are helping shape a stronger semiconductor ecosystem.”

This year’s WiSH program participants gained hands-on experience through simulation projects, lab visits, technical deep dives, and networking sessions with TI leaders. The program included three weeks of virtual mentoring, culminating in an immersive, in-person week at TI’s Bengaluru campus. During this phase, students engaged directly with mentors, industry experts, and women leaders from TI. 

“The WiSH program provided me the right platform to go beyond classroom learning. We had access to labs where we gained hands-on experience in simulation and circuit design,” said Poornima Kulkarni, Analog Engineer at TI India and a previous WiSH participant. “What makes it unique is the mentorship by subject matter experts to guide aspiring engineers through the course of the program.”

Texas Instruments remains committed to fostering diversity and inclusion within the technology sector. Through initiatives such as WiSH, TI helps to bridge the gender gap in STEM fields and empower the next generation of engineers to lead and innovate in the semiconductor industry.

Taking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao’an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities.

Featuring an ever-expanding showcase of automation equipment and technologies, the show empowers you to optimize your supply chain, reduce costs, and ensure quality and yield — all driving sustained growth in the electronics manufacturing industry.

Hundreds of New Product Launches

NEPCON ASIA 2025 will showcase hundreds of new products and solutions across SMT, testing and measurement, soldering, dispensing, semiconductor packaging, and automation. The show will feature over 600 leading exhibitors, including Yamaha, Hanwha, Fuji, Kurtz Ersa, Rehm, Tamura, Koh Young, TRI, ALEADER, Unicomp, Anda, and Axxon, connecting them with millions of buyers from high-growth sectors such as automotive electronics, semiconductors, and new energy.

The event aims to engage more than 2,000 buyers from emerging fields like low-altitude flight, embodied robotics, and AI, offering exhibitors invaluable exposure to new sectors.

Breakthrough Areas Driving Innovation

Several standout themed areas will debut, integrating industry resources and cutting-edge technologies, while showcasing packaging, testing, flexible manufacturing, assembly, and key components.

Key themed areas include:

• AI Smart Glasses Disassembly Area
• Flexible Manufacturing and Intelligent Transport System Area
• Low-Altitude Flight Components Disassembly Area
• Embodied Intelligence Robot Core Parts Disassembly Area
• Electronic Finished Products Automated Packaging Demonstration Area
• IGBT & SiC Packaging and Testing Demo Line

Conferences Empowering Industry Growth

NEPCON ASIA 2025 will host 40 high-level conferences covering advanced manufacturing, semiconductors, power electronics, robotics, and AI, empowering businesses to explore future technologies and seize new growth opportunities.

The SMTA South China High-Tech Workshop will feature global experts from China, the US, Japan, and Thailand, providing forward-looking insights for businesses.

Connecting Global Markets

As China’s technology and manufacturing hub, Shenzhen offers a complete electronics ecosystem and unmatched supply chain advantages, providing exhibitors and visitors with opportunities to access its thriving industry cluster.

Through collaborations with overseas industry associations across Southeast Asia, the event will organize factory tours, business matchmaking and overseas networking salons, fostering deeper integration between Chinese and global electronics manufacturers.

Visitor pre-registration is now open! Join NEPCON ASIA 2025 to capture new opportunities, explore emerging markets, and enhance global competitiveness.

For visiting inquiries:
Walden Li | Email: walden.li@rxglobal.com

For exhibiting inquiries:

Julia Gu | Email: julia.gu@rxglobal.com

Pre-registration link：https://ali2.infosalons.com.cn/reg/NEPCON25SZ/registeren/login?type=Z0AR7L

For more information, please visit NEPCON ASIA - Six Electronics Trade Shows Under One Roof.

Facebook: @NEPCONASIA

LinkedIn: @NEPCON ASIA