Electronics news & updates

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    Hammond’s popular C2 19” rack rated for 1000 lb load in extreme SDC E seismic environments

    C2-19”-rackIndependent testing has confirmed that Hammond Manufacturing’s welded frame construction C2 19” rack, hammfg.com/dci/products/cabinet-systems/c2, available as standard in sizes from 20U high, 23” wide and 23.62” deep to 49U high, 23” wide and 36” deep is suitable for use in all USA locations including the highest Seismic Design Category, SDC, E, which covers most of the western seaboard. Typical applications include broadcast, test equipment, cabling cabinets, systems and general electronics.

    The C2 19” rack is rated to carry a 1000 lb load when installed in building sited on Soil Groups A, hard rock, down to D, stiff soil. To conform, the centre of mass of the load must be below the height centerline of the rack and the rack must be bolted to the floor of the building. The doors and panels are not structural elements, so the seismic rating applies to both open and clad racks.

    The C2 19” rack is constructed from a 14-gauge steel fully welded frame, fitted with 16-gauge steel doors and side panels and for 19” equipment mounting, there is a choice of either 10-gauge steel tapped mounting rails or 12-gauge steel square hole mounting rails. The mounting rails are fully adjustable front to back within the rack to accommodate differing equipment depths. A choice of top panels include Solid, Vented, Solid with Fan cutouts or Solid with Pre-installed Fans up to 550 CFM. A comprehensive range of dedicated accessories ensure that the great majority of projects and applications can be satisfied by configuring the rack from standard products. The C2 19” rack can be easily and quickly factory modified if required.

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    Arrow Electronics to Showcase Everest Board for Microsemi’s New PolarFire Lowest Power Cost-Optimized Mid-Range FPGAs at Embedded World

    Show Attendees Who Sign Up to Receive Free Training Can Pre-Order Arrow’s PolarFire Evaluation Board at Significant Discount

    ALISO VIEJO, Calif.—Feb. 21, 2017—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and Arrow Electronics today announced Arrow’s upcoming training sessions for the new Everest Evaluation Board designed specifically for Microsemi’s recently launched PolarFire™ mid-range field programmable gate arrays (FPGAs). Arrow’s booth (4A-340) at Embedded World, the international trade show for embedded systems being held March 14-16 in Nuremberg, Germany, will showcase the lowest power mid-range FPGAs from Microsemi as well as details on how the devices work with Arrow’s Everest Evaluation Board.
    Microsemi FPGA technical experts and system architects will provide insight into the differentiated features of PolarFire FPGAs as well as the new Everest Evaluation Board from Arrow. In addition, Embedded World attendees will receive ordering codes and can be the first to receive an Everest PolarFire Evaluation Board at the lowest cost. Only engineers who attend a training session at the show will be able to pre-order the development kit for only $299 compared to the regular price of $499.
    “We are excited for Embedded World attendees to see first-hand the unique features of our cost-effective, lowest power, highly secure and reliable mid-range PolarFire FPGAs,” said Ted Marena, director of SoC FPGA marketing at Microsemi. “Arrow’s Everest PolarFire Development Board will enable customers to take advantage of these unique devices and begin designing for applications within a wide range of markets.”
    As Embedded World focuses on embedded systems, PolarFire FPGA applications for industry 4.0 as well as those for the broader industrial market will be highlighted at the trade show, including factory automation, industrial Ethernet switches, video and image processing, machine vision, programmable logic controllers, portable test equipment and medical. The devices can also be leveraged within the communications, defense, aerospace and Internet of Things (IoT) markets.
    In addition to reducing operational and capital expenditure spend, PolarFire FPGAs can reduce customers’ thermal and carbon footprint. The combination of the new FPGAs and Microsemi’s Libero SoC Design Suite enable a wide range of embedded applications. The low power and security of the FPGAs provide an ideal architecture for customers seeking to protect their intellectual property (IP) and ensure long-term support for their designs. They also feature integrated Athena TeraFire EXP5200B Crypto Co-processors (Suite B capable) and a Cryptography Research Incorporated (CRI) differential power analysis (DPA) countermeasures pass-through license.
    “Arrow’s close collaboration with Microsemi enabled our FPGA expert team, utilizing Libero SoC Design Suite, to design and develop the PolarFire Everest Evaluation Board,” said David Spragg, vice president of engineering at Arrow. “We look forward to introducing the board details at Embedded World to help support early adopters of Microsemi’s Polarfire FPGAs.”
    To sign up for a PolarFire FPGA training session in Arrow’s booth, 4A-340, at Embedded World, visit https://www.microsemi.com/industry-events/embedded-world-2017/.

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    Mouser Receives Top Distribution Award from Amphenol SV Microwave

    February 21, 2017 – Mouser Electronics Inc., the authorized global distributor with the newest semiconductors and electronic components, has been honored with the 2016 Business Development Award by Amphenol SV Microwave, a leader in the radio frequency (RF) microwave industry. Mouser carries a full line of Amphenol SV Microwave RF connectors, cable assemblies and passive components.

    The Business Development Award recognizes Mouser for identifying and pursuing new markets, customers and distribution opportunities for Amphenol SV Microwave products. The award is based on customer reach, continued growth, and increased mindshare and engagement efforts among other factors.

    “Amphenol SV Microwave considers Mouser Electronics not only an outstanding distributor but also our strategic partner, and we are very pleased to recognize the Mouser team for its stellar efforts on behalf of our products,” said Andrew Dinsdale, Director of Marketing, Amphenol SV Microwave.

    “We at Mouser are very grateful to be recognized with this important award from a company with the status and reputation of Amphenol SV Microwave,” said Krystal Jackson, Mouser Vice President of Corporate Supplier Management. “Amphenol SV Microwave is a valued partner, and we look forward to many years of very productive partnership.”

    This is one of many awards that Mouser has received in the past five years from Amphenol Corporation and its subsidiaries. In 2015, Mouser received the corporation’s Best Global Performance Award in conjunction with TTI as well as the Distributor of the Year Award from Amphenol Industrial, after being honored with Amphenol Corporation’s Global Excellence Award in 2014. In 2013, Mouser was recognized globally with the Amphenol Corporation Global Partnership Award for Distributor Excellence and was named the 2013 Distributor of the Year by Amphenol Industrial.

    With its broad product line and unsurpassed customer service, Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Mouser stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

     

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    New Era of End-to End Security Assured by Avnet Silica’s Game-Changing IoT Reference Design

    Superior protection enabled through further extension of popular Visible Things offering

    Poing, Germany, 21 February 2017 – Avnet Silica, an Avnet company, continues to tackle the subject of Internet of Things (IoT) security head on, with the introduction of a complete security reference design to accompany its flexible, multi-faceted Visible Things development platform.
    Inherent to IoT is the transfer of data over numerous different networks (WLAN, WAN, IP core, the cloud, etc.), each with their own distinctive protocol stacks and security mechanisms. Generally IoT-enabled devices (sensors, robots, etc.) need to connect to industrial networks using low power wireless connectivity technologies (like Bluetooth, 802.11, Z-Wave, etc.). It is, however, likely to be another 5 to 6 years before these will have IP capabilities. Standard transport layer security (TLS), which relies on IP, therefore cannot be applied.
    Thanks to its partnership with embedded software specialist Ubiquios, plus related firmware support from Trusted Objects, Avnet Silica is ensuring that non-IP network vulnerability is fully addressed. A streamlined microcontroller stack has been developed through this cooperation, which forms the basis of the new IoT security reference design. The reference design is X509 certificate compliant, but this aspect has been rationalised, so that it respects the power and data limitations of Bluetooth 4.1 and other non-IP wireless protocols, while simultaneously being able to maintain the highest degrees of system security.
    In addition, the reference design simplifies the provisioning of devices in the field (whether it is within an IP or non-IP context), making the procedure dramatically quicker to complete. This increases the operative’s production, as more devices can be dealt with in a day. It also means that the operative does not need such a high level of training in order to complete the task. Furthermore, as the end device can be identified directly from the server, it is straightforward to renew the local key remotely. This avoids having to send an operative back out into the field to renew that key manually (which in reality rarely happens, due to the costs involved, thereby undermining protection provided over time).
    “The more assets that a company has connected to the Internet, the greater their exposure will be to potential security threats. Though covering everything from the server down to the gateway may not prove to be a major problem, there are serious challenges for engineers at the network edge,” stated John Jones, Director of Innovation at Avnet Silica. “As our new security reference design is not restricted to IP nodes managed by the standard TLS process, IoT devices can thus be connected to IP-based infrastructure without security being compromised. By delivering an X509 certificate compliant solution, it is completely aligned with what IT directors expect, but in a stripped down format that is practical for low power wireless connectivity. The microcontroller stack design dispenses with the need for high performance microcontrollers at gateways. This makes the system more cost effective and energy efficient, as well as being much easier to implement.”

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    Diodes Incorporated’s Power Switcher with HV Transistor Improves Efficiency of Line-Powered Chargers

    AP3984Plano, Texas – February 21st, 2017 – Offering a cutting-edge solution for consumer and industrial applications with its unique integrated high-voltage (HV) start-up circuit, the AP3984 introduced by Diodes Incorporated is a high-performance power switcher for line-powered chargers and adaptors. Delivering increased conversion efficiency with better voltage and current accuracy, the AP3984 also features ultra-low power consumption and improved protection functions.
    Designed as a primary-side controller, the AP3984 realizes excellent transient characteristics when combined with secondary-side ICs such as the AP4341/2, supplying outputs above 4.3V. This is achieved with current and voltage tolerances of just ±5%. The built-in start-up circuit with integrated 700V bipolar junction transistor also eliminates external resistors, simplifying system design and allowing the AP3984 to directly switch the line input. The AP3984 also has a programmable line voltage drop-compensation function.
    With protection features such as over-voltage, open- and short-circuit protection, and over-temperature protection (OTP) with auto-restart, the AP3984 provides a high- performance, highly integrated and cost-effective solution that also meets Energy Star 6.0 efficiency criteria with a standby power of less than 10mW. Multiple PWM/PFM switching modes combined with a frequency dithering function further aid efficiency while improving EMC performance and reducing audible noise.

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    ETL Systems RF equipment selected by EMCALI for Colombian power project

    Madley, UK. 21 February 2017: ETL Systems, a global designer and manufacturer of RF signal distribution equipment for satellite communications, has been chosen by Colombian telecommunications, water and electricity services provider, EMCALI, to provide RF equipment for its Cali teleport expansion project.

    EMCALI required a 32 input x 128 output L-band matrix system that could be used to manage L-band signal necessary to improve operation and performance of video and data traffic. This in turn would improve the quality of service to end-customers and offer a more robust operation, allowing power to be provided to several low-noise block (LNB) downconverters and compensate for loss individually on each channel. ETL’s Vortex L-band Matrix VTX-10 system, commonly used for many high resilience high performance applications, and the Piranha PRN-10 LNB powering system – which is highly energy efficient and is populated with variable voltage – was selected by EMCALI to fulfil these requirements.

    “EMCALI needed a system that could control and monitor all incoming traffic and distribute into all receivers,” said Hugo Murillo, Teleport Engineer at EMCALI. “Such an important project requires quality, flexibility and absolute attention to detail, and so we chose to partner with ETL because of the company’s expertise and experience in providing custom-made solutions.”

    ETL designed a system that easily expands into a 32x192 L-band matrix system to adhere to EMCALI’s future requirements whilst minimising downtime, allowing the company to provide enhanced communications without affecting the traffic running through the system at the time.

    “We are delighted to be chosen by EMCALI for this exciting project, as this demonstrates the flexibility of our LNB and RF equipment,” said Rafael Zamora, International Sales Manager, Latin America at ETL Systems. “This project increases ETL Systems position in the Colombian and Latin America market, demonstrating the cutting-edge technology that ETL Systems offer.”

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    Infineon and IESA joined hands to nurture promising start-ups in the Electropreneur Park

    Supporting India’s ambition to become a global start-up hub and leveraging on India’s creativity and talent to co-develop innovative solutions

    Bengaluru,India - Feb 21, 2017 - Infineon Technologies Indiaentered into an agreement with India Electronics and Semiconductor Association (IESA) to support the Electropreneur Park (EP), giving a major boost to the ‘Make in India’ and Start-up India initiatives. Infineon will work with start-ups incubated by EP, offering business and technical consultation and mentoring. The agreement was signed by Vinay Shenoy, Managing Director, Infineon Technologies India and K Krishnamoorthy, Chairman, IESA in the presence of Andrew Chong, President, Infineon Technologies Asia Pacific andin the presence of MN Vidyashankar, President, IESA.

    Speaking on the occasion, Andrew Chong said,“India is fast emerging as an important market for Infineon in the Asia Pacific region and also a promising location to develop innovative products and solutions for our global needs.”

    Vinay Shenoy added, “The Start-up India initiative by the government of India taps into a vast talent pool and creativity available in India.We are glad to work with EP to explore potential collaborations in hardware and software or systems product development.”

    Commenting on the partnership, K Krishnamoorthysaid,“India’s electronics system design and manufacturing (ESDM) market is expected to see rapid growth by 2020. With EP, weare building an ecosystem that fosters entrepreneurship and promotes innovationand growth.The support of Infineon through their CSR funds and International class of mentorship will have a multiplier effect on the incubatees thereby helping EP succeed.”

    Sanjeev Chopra, CEO, Electropreneur Park said: “I appreciate the initiative taken by Infineon in supporting the incubation center for ESDM start-ups.  This initiative will take forward the support given by MNC's to start-up ecosystem in India”

    Infineon and IESA jointly agreed to collaborate strategically in support of the incubator initiatives in the EP organised by IESA. Infineon will support and contribute to the initiatives led by IESA through the sharing of semiconductor industry experience, knowledge and network with the start-up companies.Infineon will also provide an undisclosed amount of financial grant to IESA over a period of three years.

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    India’s ESDM sector to optimistically reach US$228 billion by 2020 says IESA and EY report announced at Vision Summit 2017

    -          “Design led manufacturing to amplify growth of India’s ESDM industry” said IESA
    -          The IESA Technovation Sarabhai Award went to Dr. Kiran Kumar, Chairman - Indian Space Research Organisation (ISRO)

     

    Bangalore, India: February 21, 2017: India Electronics and Semiconductor Association (IESA), the premier trade body, representing the Indian electronic system design and manufacturing (ESDM) today commenced IESA Vision Summit 2017. This is the 12th edition of Vision Summit focused on the central theme of Design led Manufacturing- Redefining the future of India’s ESDM. This edition will feature large and medium sized IT companies as well as the starts ups. IESA is working along with the Central/State Government in developing policies and taking measures to scale up indigenous production in India to meet the rising demand for electronics.

    The riveting inauguration of the summit was addressed by Sh. Rajiv Bansal, Joint Secretary, MeitY, Govt. of India, Ravi Gururaj, President, TiE Bangalore and K Krishna Moorthy, Chairman, IESA.

    The Summit attracted thought provoking keynotes, panel sessions and workshops from CXO’s of global majors like Cypress Semiconductors, Rambus, Qualcomm, IBM, Tessolve, Seagate, Western Digital, MediaTek, Applied Materials and IMEC, Lam Research, Soitec and many others. The event also attracted delegations from Japan, Scotland, Taiwan and Philippines, France, Belgium and USA. The workshops on “Designing with Fully Depleted Silicon-on-Insulator (FDSOI) technology for IOT products, Creating ESDM Product Innovation Hubs on Campus” and “India Digital Broadcast” was also well received by the attendees of Vision Summit 2017

    The Summit also marked the announcement of IESA - EY executive summary report highlights which stated India’s ESDM sector to optimistically reach about US$228 billion by 2020. It also added that, the $100+ billion opportunity in 2016-17 will grow further at a CAGR of 16- 23%. Apart from sector specific drivers, the forecasts are based upon overall GDP growth of India, currency movement, inflation, existing trade agreements, consumer sentiments, potential government consumption, existing government policies, investments (foreign and domestic), manufacturing entities (existing Indian players, foreign players, Indian conglomerates, start-ups) and type of value addition in India.

    Other highlights pointed out that, the domestic manufacturing for Electronic Products has been growing at a CAGR of 17% which is expected to increase further over next 5 years. Electronic Manufacturing Services segment has seen a huge growth over the past two years and has grown from $0.5bn. in 2013 to $1.0 bn. in 2015. Indian EMS market is estimated to witness exponential growth of 42-68% over the next five years to reach US$6-13.2 billion.

    Many IESA Member companies highlighted their commitment to Make in India through investments as a part of M-SIPS approvals. The total combined investment is envisaged to be more than Rs. 1,700 crores.

    Senior officials from the state governments of Karnataka, Kerala, West Bengal, Chhattisgarh and Jharkhand highlighted the formulation and implementation of ESDM policies in their respective states.

    In a glittering Technovation awards event in the evening Sh. Umesh Prasad Sah, Director - IT, Govt. of Jharkhand, Sh. Shailendra Kumar Tyagi, Director, STPI – Bangalore, Sh. S V Rasal, Managing Director, Institute for Design of Electrical Measuring Instruments (IDEMI) , Sh. Santosh Kumar, President & MD, Texas Instruments and Shri K Krishna Moorthy, Chairman IESA presented the prestigious IESA Technovation Awards 2016 for excellence in Electronics System Design and Manufacturing across various categories.  The Prestigious IESA Technovation Sarabhai Award went to Dr. Kiran Kumar, Chairman - Indian Space Research Organisation.

    In his inaugural speech, K. Krishna Moorthy, Chairman, IESA said “We see the year ahead as a year where the ESDM industry will scale up in value addition and value proposition. With the ongoing digital revolution in the country and the thrust from the government to use technology to improve governance delivery to the people, the requirement for developing new and better innovative products and solutions are growing by the day. This has opened up a number of opportunities to promote both product and solutions development and manufacturing them in our country. IESA believes in an integrated approach which is sustainable over a long period of time and hence are focusing on Design and IP ownership as a significant component in our efforts to boost and sustain the manufacturing eco system. Our efforts in recent years to make India grow in different spheres of the ESDM eco system has brought out the need for a continuous development of four key aspects namely- Start up growth, Talent development, Technology exposure and design ownership. Our efforts in the recent years have been to set these pillars of growth and create sustainable growth engine in ESDM. Our close association with the central and state governments as well as prominent institutions and industry members have encouraged us to become future ready.”

    Highlighting the involvement of various state governments in the conclave, Mr. M. N. Vidyashankar, President, IESA said, “We are a trusted advisory to the Government of India, and have been advocating India’s stance as an ESDM powerhouse. We believe that designing is a crucial component for the development of a successful innovation. At Vision 2017, we are not only promoting local manufacturing but also focusing on the relevance of design led manufacturing and its contribution towards the growth of India’s ESDM sector. With the allocation and incentives of schemes like M-SIPS and EDF to Rs745 crore in this year’s budget, we strongly believe that India will be the next manufacturing powerhouse of the globe.”

    IESA Vision Summit 2017 included a workshop on Designing with Fully Depleted Silicon-on-Insulator (FDSOI) technology for IOT products. It was led by Paul Boudre, Chairman of the Board & CEO, SOITEC (a world leader in designing and manufacturing innovative semiconductor materials); Max Mirgoli, Executive Vice President of World Wide Strategic Partnerships, IMEC; Thomas Piliszczuk, Executive Vice President of Marketing & Business Development, SOITEC and Dr. Ajit Manocha, Executive Chairman of the Board, POET Technologies. An intensive and exhaustive session with industry leaders delineating the newest technology in semiconductor manufacturing, i.e., fully depleted silicon on insulator (FDSOI). FDSOI is touted to be an alternative to bulk silicon as a substrate for building CMOS devices. The panelists will discuss and debate whether FDSOI gives major competitive advantages at 28 nm and 20 nm due to its lower power consumption and higher performance compared to planar bulk CMOS. Will the ultra-low voltage capability be a boon for IoT applications that get their energy perhaps from harvesting vibrations, solar, etc.? Be a part of this interesting workshop if you would like your doubts clarified on the suitability of FDSOI technology and architectural solutions for IoT applications.

    Vision Summit 2017 is aptly titled “Design-Led Manufacturing- Redefining the future of India’s ESDM” since ESDM has already been established as the sunrise sector where the next manufacturing boom is happening. At this conference, we bring you thought leaders from all verticals associated with this sector to discuss, debate and figure out ways to make IP creation happen in India. Let’s put our heads together to plan on solutions to make India the global manufacturing hub for ESDM.

    About the India Electronics and Semiconductor Association  

    IESA is the premier trade body representing the Indian Electronics System Design and Manufacturing ESDM industry and has represented it since 2005. It has over 260 members - both domestic and multinational enterprises. IESA is committed towards building global awareness for the Indian ESDM industry and supporting its growth through focused initiatives in developing the ecosystem. This is through publishing credible data, networking events and alliances with other international associations. IESA works closely with the Government as a knowledge partner on the sector, both at the centre and at the state level.

     

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