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    Digi International Introduces Connect Sensor+ for Intelligent Communication in Remote Locations

    Cellular Gateway Disrupts the Landscape for Remote Location Monitoring with New Bidirectional Sensor Communication Capabilities

    http://www.truepr.co.uk/news/digi/24/_300.jpgMINNETONKA, Minn., March 28, 2017 - Digi International®, a leading global provider of machine-to-machine (M2M) and Internet of Things (IoT) connectivity products and services, today introduced Digi Connect Sensor+, an enterprise-ready, battery powered cellular gateway solution for connecting to a wide range of external sensors.
    Digi Connect Sensor+ builds upon the Connect Sensor legacy of providing a solution for remote sensor monitoring to be deployed in low or no power environments previously considered too harsh, remote or not economically viable. Digi Connect Sensor+ adds bidirectional sensor communication, remote diagnostics for sensor networks, increased internal data storage and continuous monitor mode for installations with access to wired power for use in applications where alarms must be reported immediately.
    Digi Connect Sensor+ utilizes cellular networks and is ideal for energy, water, industrial and government installations that need to expand monitoring capabilities to meet oversight requirements, or to increase operational efficiencies. This eliminates the need for additional infrastructure, power supplies and third party applications.
    With a flexible interface and no programming or scripting required, Digi Connect Sensor+ can connect with and transform the capabilities of current sensor networks by enabling bidirectional communication with existing sensors. With bidirectional communication and multi-variable inputs, Digi Connect Sensor+ helps organizations gather complex information for remote diagnostic capabilities over a cellular network. Users will know when a sensor has an issue in the field, what the fault is, whether the sensor needs to be replaced or repaired, and whether a site visit is needed and the parts required.
    The affordable Digi Connect Sensor+ expands the market viability and capabilities of remote monitoring. The self-powered Digi Connect Sensor+, with internal data storage and Digi Connect Wizard, can eliminate the need for data loggers, solar panels, RTUs and LED displays used for existing remote monitoring solutions resulting in extreme cost savings.
    “Digi Connect Sensor+ changes the dynamics of remote sensor monitoring,” said Joel Young, chief technology officer, Digi International. “Through new diagnostic capabilities, organizations with remote deployments can be made immediately aware of any issues, and take action without having to physically deploy resources unless they are necessary.”
    By incorporating the Wired HART protocol, Digi Connect Sensor+ can communicate with any HART-enabled sensor over the standard 4-20mA wiring used for analog communications, creating a 4-20mA “smart-loop.” Additionally, through adoption of the Modbus messaging protocol, Digi Connect Sensor+ can conduct bidirectional communication with devices connected through the serial RS-485 protocol.
    Digi Connect Sensor+ continuous monitor mode can constantly sample data from up to five inputs. With these capabilities, Digi Connect Sensor+ can be deployed in highly sensitive environments where alarms must be reported immediately, such as valve monitoring and gas detection.
    Digi Connect Sensor+ has immediate availability. For additional information, including cellular specifications, sensor adaptability, security, environmental capabilities and customization and reporting, visit http://www.digi.com/connectsensor.

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    Matrix to Showcase its Enterprise Grade, Well-engineered Security Solutions at SECUTECH 2017, Mumbai

    Matrix, a leading manufacturer and provider of Telecom and Security solutions, is participating in SECUTECH 2017, Mumbai from 6th to 8th April 2017. Matrix will be showcasing its Video Surveillance, Time-Attendance and Access Control solutions at the event.

    Matrix offers an Enterprise-grade Video Management System designed, engineered and built specifically for growing multi-location organizations. The entire solution is focused on automating processes and enhancing efficiency of your organisation. Matrix Video Surveillance aims to provide centralized control over all the locations with well-crafted User defined Roles and Rights, to fulfil complex needs of multi-hierarchy organizations. Furthermore, moving away from traditional reactive security, advanced video analytics with real-time notifications provide organizations with preventive security, protecting your premises from all vulnerabilities. In addition to that, Matrix Video Surveillance is an open platform system, which integrates with all third party software, increasing an organization’s capabilities manifold.

    Under the Time-Attendance and Access Control domains, Matrix will be launching its cutting edge multispectral fingerprint based door controller - COSEC DOOR FMX. This advanced multispectral technology reads surface and subsurface of a live fingerprint. It gives very clear and strong image even if the surface layer is not available due to dirty, dry or oily finger, poor ridge image or other environmental problems.This unique identification process outperforms all other fingerprint sensors and offers robust and reliable biometric information of a user.

    Matrix will also launch its Elevator Access Control solution, which workswith the help of advanced our Eight Port Input-Output Controller that can control an elevator up to 32 floors. Solutions like QR Code based Access Control, Bluetooth based Access Control and Auto Attendance Marking using GPS/Wi-Fi would be showcased as breakthrough under ‘Mobile as a Credential’ technology.

    “During this exhibition, we will demonstrate our enterprise grade Access Control solution with real-time features such as Auto-push events to Server, Instant Notifications, Automatic Device Identification, Mobile as User Credential and along with features of Time-Attendance, Shift Management and Leave Management.” said Jatin Desai –Product Manager, Access Control and Time-Attendance

    Matrix looks forward to meeting customers and prospective system integrators at SECUTECH 2017, Mumbai (Stall numberC08, Hall - 1), Bombay Exhibition Centre, Goregaon(E) from 6thto 8th April 2017to discuss their requirements and offer better solutions.

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    Svante Littmarck of COMSOL to Give Plenary Lecture at 2nd Thermal and Fluids Engineering Conference


    BURLINGTON, MA (March 28, 2017) — COMSOL, Inc. the leading provider of software solutions for multiphysics modeling, simulation, app design and deployment,will be featured at the 2ndThermal and Fluids Engineering Conference (TFEC). With a focus on “Engineering Challenges for the Betterment of Society”, this year’s conference will provide an international forum for discussing the latest research and development achievements in the thermal and fluid sciences and the impact on numerical simulation. Svante Littmarck, President and CEO of COMSOL, Inc., will give a plenary lecture on the latest achievements of multiphysics simulation. COMSOL will also offer the attendees a course on “Multiphysics Simulation of Thermal and Fluid Systems”.

    A-local-installation-of-COMSOL-ServerCustom simulation apps bring new opportunities

    “Thanks to custom simulation apps, powerful computational tools are able to reach a wider group of users than ever before,” says Svante Littmarck. “During the lecture I will discuss use cases and show how state-of-the-art multiphysics software can be used to benefit simulation specialists, their colleagues, and customers alike.” The adoption of apps is spreading quickly across industry and academia supported by the ease of use of the Application Builder in the COMSOL Multiphysics® software and cost-effective deployment through a local installation of the COMSOL Server™ product.Cornell University is an example where large scale deployment of apps through COMSOL Server™ benefits students and teachers nationwide without them having to directly invest in the software or hardware. “Simulation apps bring new opportunities to education,” says Prof. Ashim Datta, Department of Biological & Environmental Engineering,Cornell University. “In a food safety class, apps enable multidisciplinary learning where students of biological science can simulate many what-if scenarios realistically.” Littmarck concludes, “Engineers can benefit from powerful mathematical modeling tools andsolver technology in COMSOL Multiphysics® and deliver custom apps with COMSOL Server™. Deploying apps to their organization and customers worldwide has never been more straightforward.”

    Conjugate-heat-transfer-siMultiphysics Simulation of Thermal and Fluid Systems

    COMSOL will offer a course on “Multiphysics Simulation of Thermal and Fluid Systems”.David Kan, vice president of sales for the southwestern region of the US, and Nicolas Huc, Technical Product Manager, Heat Transfer, will introduce the participants to multiphysics simulation using the COMSOL® software. The course will focus onthe design of a heat sink to demonstrate how to model conjugate heat transferstep-by-step. Engineers and scientists are turning to the accuracy of multiphysics modeling software to optimize their designs and for deeper understanding of processes involving fluid flow and heat transfer.The ability to model conjugate heat transfer,alongside other physics, with high-fidelity is of the essence as it’s the main physics phenomena driving ubiquitous processes and components such as heat exchangers, thermoelectric coolers, bioheating devices, laser heating, thermal lensing, electronic cooling, induction heating, and RF heating.

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    Bidirectional TVS Diode Arrays from Littelfuse Protect High-Speed Interfaces from Damaging ESD

    Ideal for protecting high-speed interfaces like HDMI, USB2.0, USB3.0 and eSATA

    Beijing, China, March 28, 2017 Littelfuse, Inc.,  the global leader in circuit protection, today introduced a series of TVS Diode Arrays (SPA® Diodes) designed to protect electronic equipment from destructive electrostatic discharges (ESD). SP3042 Series Bidirectional Discrete TVS Diode Arrays include robust back-to-back TVS diodes fabricated using a proprietary silicon avalanche technology that can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC 61000-4-2 international standard (±30kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present in a space-efficient 01005 footprint. The series’ low loading capacitance (0.35pF @ VR=0V, typ.) makes them ideal for protecting high-speed interfaces such as HDMI2.0, USB2.0, USB3.0 and eSATA.

    Typical applications for the SP3042 Series include ESD protection for high-speed interfaces used in MIPI cameras and displays, DisplayPort1.3, eSATA, Internet of Things (IoT) modules, smartphones, external storage devices, ultrabook/notebook computers, tablets/eReaders and security modules.
    “The small footprint of SP3042 Series TVS Diode Arrays allows them to protect high-speed interfaces while occupying minimal space on a printed circuit board,” said Tim Micun, global product manager/TVS Diode Arrays (SPA® Diodes) at Littelfuse. “Their low dynamic resistance enables them to respond quickly to prevent ESD damage.”

    SP3042 Series TVS Diodes offer these key benefits:

    • Bidirectional design ensures flexibility in assembly when placing parts on a printed circuit board (PCB).
    • Provide linear frequency response performance across the working voltage, which is an important consideration for protecting high-speed interfaces.
    • Lowdynamic resistance (just 0.5Ω) allows them to respond quickly to ESD events.
    • Provide robust ESD protectionfor high speed interfaces for voltages up to 30kV and current surges of up to 2A (8/20µs).
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    Mouser-Backed Formula E Team Readies for Tough Race in Mexico

    TTI, Molex and Panasonic Join to Sponsor High-Tech Sport, Paving the Way for Technology

    March 27, 2017 – The Mouser Electronics-sponsored Faraday Future Dragon Racing team is excitedly preparing for the fourth leg of the 2017 Formula E championship series set for April 1 in Mexico City. Lead driver Jerome D'Ambrosio won the Mexico City ePrix last year, and hopes are high for an exciting finish at the very challenging Autódromo Hermanos Rodríguez, which features a circuit sitting at 2,285 meters above sea level — one of the highest-altitude tracks in the world.

    The team took a technological leap into the future this season with an innovative drive train. Drivers D’Ambrosio and Loic Duval worked out some kinks in the first three outings this season in Hong Kong, Marrakesh and Buenos Aires, tweaking the car to prepare it for the 2.1-kilometer Mexico City course that features 18 tough turns.

    Mouser is a proud sponsor of the 2016–2017 Dragon Racing team in collaboration with TTI, Inc. and valued supplier partners Molex and Panasonic. This is the third straight year that Mouser Electronics is sponsoring Formula E racing, a high-tech sport that is paving the way for future automotive technologies. Formula E features cars powered exclusively by electric power and represents a vision for the future of the motor sports industry, serving as a framework for research and development around the electric vehicle.

    “Mouser’s commitment to technological innovation meshes perfectly with the team’s dedication to taking the lead in electric car technology,” said Todd McAtee, Vice President, Americas’ Business Development for Mouser Electronics. “With our sponsorship, Mouser is aligning with the pioneers of this new technology. We have high hopes for another exciting year and welcome the opportunity to team up with Molex, Panasonic and TTI.”

    “It’s incredible to watch these amazing drivers and their leading-edge cars,” commented Mike Morton, President of TTI Global Sales and Marketing. “TTI proudly supports this high-tech sport that is paving the way for future automotive technologies.”

    “Molex is pleased to once again partner with Mouser Electronics to sponsor this exciting racing venture,” said Fred Bell, Vice President of Global Distribution for Molex. “We look forward to watching innovative electric automotive technology in the hands of truly talented drivers.”

    “At Panasonic, we are pleased that we can be part of a forward-thinking technology that could determine the future of our automotive industry,” said Jeff Howell, President of Panasonic Industrial Devices Sales Company of America.

    After Mexico City, the team travels to Monaco on May 13 and then Paris on May 20. The remaining schedule includes six races in three venues: Berlin on June 10 and 11 (with the latter replacing the scheduled July 1 race in Brussels), New York City on July 15 and 16 and Montreal on July 29 and 30.

    With its broad product line and unsurpassed customer service, Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Mouser stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

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    ROHM Semiconductor partners with Renesas for GR Peach Design Contest

    Bangalore, March 28, 2017:ROHM Semiconductors India was a proud partner of the annual GR Peach Design Contest organized by Renesas. The contest which commenced in July last year, concluded successfully with the Grand Finale organized on March 2nd 2017, at The Leela Palace, Bangalore. ROHM Semiconductor has always encouraged young aspiring engineers by supporting such events.This contest invites students, hobbyists and buddying engineers to design and build innovative embedded systems, which attracted participation of more than 100 teams.

    partner-felicitation ROHM25 best projects from the top 50 were awarded by ROHM with their Sensor Shield Evaluation Kit which the young engineers can utilize in their various projects, including IoT solutions.

    ROHM Sensor kit is an efficient way to quickly evaluate and test sensor products which is compatible with the Arduino Uno platform, and the kit contains the base board, with 6 Sensor Breakout Boards (Analog and Digital Ambient Light Sensors, Accelerometer + Magnetometer Combo Sensor, alongwith Hall, Tempr.& UV Sensors). For more details on the Sensor EVK, please visit http://www.rohm.com/web/eu/sensor-platform-kit

    The Grand Finale witnessed 20 teams contesting against each other for top prize. Hyderabad-based NEO Innovations won the First Prize for their ‘Mini Gateway for Automation and Security’ Project. The Second Prize was bagged by the team from MBCET, Trichy for their Project PEACHSAT and the 3rd prize was awarded to the team from Sri Eshwar College of Engineering, Coimbatore for their project- ‘IoT Based Vehicle Parameters and Security System’.

    Winners-with-Partners,-Co-sponsors-and-Renesas-TeamMr. Britto Edwards Victor, Head, India Design Centre, ROHM Semiconductor India was on the jury of this contest. Mr. Daisuke Nakamura, Managing Director, ROHM Semiconductor India also presented prizes to the winners.

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    TDK-Micronas to acquire ASIC specialist ICsense to further grow its sensor business

    • With this acquisition TDK has made another decisive step forward to further grow its sensor business.
    • ASICs perform processes essential to sensor products by reading the values detected by sensors and conducting signal processing.

    March 28, 2017 - TDK Corporation (“TDK”, TSE: 6762) announced today that TDK’s wholly-owned subsidiary TDK-Micronas GmbH (“TDK-Micronas”), a leading supplier of Hall-effect sensors based in Freiburg, Germany, and ICsense NV have signed an agreement of acquisition of shares, to which TDK-Micronas will make ICsense NV a wholly-owned subsidiary.

    Through the acquisition TDK will further boost its sensor and actuator business. TDK is expanding its sensor business by completing a lineup of various sensors, in addition to its own pressure, temperature, current and magnetic sensors. Recently, TDK acquired TDK-Micronas, a leading supplier with the world’s broadest range of Hall-effect sensors and embedded motor controllers for the Automotive and Industrial markets. Furthermore TDK announced the acquisition of the US-based InvenSense, Inc., a global inertial sensor company, and became the majority shareholder of Tronics Microsystems SA, a French MEMS and inertial sensor specialist.

    ICsense, Europe’s premier IC design company, is headquartered in Leuven, Belgium. It’s core business is ASIC development and the supply and custom IC design services. ICsense has the largest fab-independent European design group with world-class expertise in analog, digital, mixed-signal and high-voltage IC design. The company develops and supplies customer exclusive ASIC solutions for the automotive, medical, industrial and consumer market. ICsense’s core expertise is sensor and MEMS interfacing, high-voltage IC design, power and battery management. After becoming a TDK group company, ICsense will continue to develop innovative ASICs for its existing and new customers worldwide.

    ASICs perform processes essential to sensor products by reading the values detected by sensors and conducting signal processing. ASICs can be used not only in magnetic sensors but also in other sensor products and even in non-sensor products. For these reasons, TDK has decided to acquire ICsense, which has an extensive track record as a manufacturer of ASICs for TDK’s magnetic sensors. The ICsense management team will remain unchanged. “With this acquisition we have taken another decisive step forward in our sensor business, strengthening our position in the automotive and industrial market and providing increased value and services for our customers,” says Matthias Bopp, General Manager of TDK’s Magnetic Sensors Business Group and CEO of TDK-Micronas. ”Our existing strength in magnetic sensor technology, combined with the expertise gained with this acquisition, puts us in the excellent position to shape the era of all kind of applications for the automotive and industrial industry.”

    “As a trusted analog, mixed-signal and high-voltage ASIC development partner, we will be the perfect fit for TDK” says Dr. Bram de Muer, CEO of ICsense. “Our innovative ASICs will further support TDK in implementing its product roadmap and enhance the global strategy for sensors. Having TDK as a strong back-end partner will further enhance ICsense’s ASIC development and supply capabilities for new and existing customers.”.

    Going forward, TDK will be able to provide a more detailed response to customers and aims to increase its competitiveness in the global market by offering a diverse range of sensor solutions and services.

    Corporate Outline of ICsense

    1. Name: ICsense NV

    2. Location: Leuven, Belgium

    3. Representative: Dr.Bram De Muer

    4. Established: 2004

    5. Main businesses: Development and supply of ASICs, as well as the design of custom ICs

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    Research on lighting systems of the future

    Light intelligence for everyone: Research on lighting systems of the future, for Smart Home, Smart City, Smart Factory, and Smart Art
    Joint press release by the partners in the “OpenLicht” research project

    Munich, Germany – March 28, 2017 – Nearly 20 percent of all the electricity consumed in the world is for lighting. And about 80 percent of that lighting is attributed to professional applications such as building, office, industry or street lighting, and about 20 percent to private residential lighting. Today, individually adjustable lighting applications are rather the exception than the rule. No matter the time of day or season, whether inside or outside, at home, school, the factory or at the office: there usually is only one continuous brightness level or lighting color to be set.

    With the project “OpenLicht”, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and its three research partners, Bernitz Electronics GmbH, the Deggendorf Institute of Technology, and the Technische Universität Dresden, want to change all that. The OpenLicht project aims to make the creative use of light a possibility for everyone: just as much for small and medium-sized enterprises (SMEs) from the lighting industry as for design studios, interior designers, artists, and electronics hobbyists – also known as “makers”. The result would be innovative, flexible, and individually adjustable light solutions for a wide range of applications.

    Lighting development made easy: Open source platform for intelligent lighting

    The three-year OpenLicht research project is dedicated to creating an open development platform for smart lights and lighting systems that can be used intuitively. This will include the self-learning networking of light sources with sensor data in the network and with the profiles of individual users. In a smart home, for instance, one could individually adjust the light settings (such as brightness, warmer or colder light, etc.) for every single light source and for every single room in the house – adapted to the particular time of day. Due to self-learning components, brightness and light color will automatically adapt to current temperature and weather data and the personal preferences. The open source platform of the four project partners will help develop creative light solutions faster and at less cost than today, even for small-scale production and single installations.

    Complex, electronically-controlled lighting systems with OpenLicht

    The OpenLicht project is exploring three particular application scenarios: “professional lighting”, for the industrial users target group, “mood lighting”, for the home, and “light modeling” for designers, architects, artists, and makers. By project end, the partners will present one demo for each of these scenarios.

    The four research partners are dedicated to making complex, electronically-controlled lighting systems usable for the largest possible user group. To that end, their research will focus on developing an open source platform consisting of hardware and software on the one hand, and creating a smart, intuitive, self-learning light control system on the other. Another key element of OpenLicht will be the establishment of a simple networking technology for sensors and actuators using man-machine interfaces for a smart building infrastructure.

    The OpenLicht research project will run until August 2019. It amounts for around Euro 4.5 million. The German Ministry of Education and Research (BMBF) is funding it as part of its program “Optical Technologies – Made in Germany”, at a funding rate of 63 percent.

    OpenLicht is one of ten research projects the BMBF is supporting as part of its “Open Photonics” development program. The Open Photonics projects are pursuing a wide range of goals, including open innovation approaches for improving the use of photonic components and systems, and open source approaches for promoting their broader use. They also include approaches that will enable the public to be more directly involved in scientific projects.

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