Electronics news & updates

• 24 leading technology companies and universities from 11 EU countries are joining efforts, driven by STMicroelectronics, to establish Europe as a technology leader in 300mm silicon photonics (SiPho) technology
• First silicon photonics applications-based innovations expected for datacenters and AI clusters, telecommunications, and automotive markets

The STARLight project brings together a consortium of leading industrial and academic partners to position Europe as a technology leader in 300mm silicon photonics (SiPho) technology by establishing a high-volume manufacturing line, developing leading-edge optical modules, and fostering a complete value chain.  From now until 2028, STARLight aims to develop application-driven solutions focusing on key industry sectors such as datacenters, AI clusters, telecommunications, and automotive markets.

Led by STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the STARLight consortium has been selected by the European Commission under the EU CHIPS Joint Undertaking initiative.

“Silicon Photonics technology is critical to put Europe at the crossroads to the AI factory of the future and the STARLight project represents a significant step for the entire value chain in Europe, driving innovation and collaboration among leading technology companies. By focusing on application-based results, the project aims to deliver cutting-edge solutions for datacenters, AI clusters, telecommunications, and automotive markets. With well-recognized pan-European partners, the STARLight consortium is set to lead the next generation of silicon photonics technologies and applications,” said Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group at STMicroelectronics.

 
Silicon photonics is a preferred technology to support datacenters and AI clusters optical interconnects for scale-out and scale-up growth, as well as for other technologies such as LIDAR, space applications and AI photonic processors that require better energy-efficiency and power efficient data transfer. It combines the high-yield manufacturing capabilities of CMOS silicon, commonly used in electronic circuits, with the benefits of photonics, which transmits data using light.

Addressing key challenges
The development of advanced Photonic Integrated Circuits (PICs) will tackle several challenges:

• High-speed modulation: creating highly efficient modulators capable of operating at speeds exceeding 200 Gbps per lane is a key focus
• Laser integration: developing efficient and reliable on-chip lasers is critical for integrated systems
• New materials: various advanced materials will be explored with actors like SOITEC, CEA-LETI, imec, UNIVERSITE PARIS-SACLAY, III-V LAB, LUMIPHASE, and integrated on a single innovative silicon photonics platform, such as Silicon-on-Insulator (SOI), Lithium Niobate (LNOI), and Barium Titanate (BTO)
• Packaging and integration: optimizing the packaging and integration of PICs with electronic circuits is essential to optimize signal integrity and minimize power consumption.

Applications-based innovations
Datacenters / Datacom
The STARLight project has an initial focus to build datacom demonstrators for datacenters, based on PIC100 technology, capable of handling up to 200Gb/s with key actors including ST, SICOYA and THALES. It will also develop prototypes for free-space optical transmission systems, designed for both space and terrestrial communication.

Additionally, the project will leverage the multidisciplinary experience of major contributors to shape the research effort towards a 400Gbps per lane optical demonstrator using new materials, targeting the next generation of pluggable optics.

Artificial Intelligence (AI)
The STARLight project aims to develop a cutting-edge photonic processor optimized for tensor operations, such as matrix vector multiplication and multiply-accumulate, with superior characteristics in terms of size, data processing speed, and energy consumption compared to existing technologies. Since neural networks – the core algorithms behind AI – rely heavily on tensor operations, enhancing their efficiency is critical for AI processing performance.

Telecommunication
The STARLight project plans to develop and showcase innovative silicon photonic devices specifically designed for the telecommunications industry. Ericsson will focus on two concepts to improve mobile network efficiency. The first involves the development of an integrated switch to enable optical offload within Radio Access Networks, allowing for more efficient handling of data traffic. The second concept explores Radio over Fiber technology to relocate power-intensive processing ASICs away from antenna units, thus providing enhanced capacity and savings in embodied CO2. Additionally, MBRYONICS will develop a free space to fiber interface at the reception of Free Space Optical (FSO) communication, which is a key element in the design of an optical communication system.

Automotive/ Sensing
The STARLight project will also demonstrate how it performs in sensing applications, and the close relationships of STEERLIGHT, a LiDAR sensors maker, with leading car manufacturers will help make this an industrial reality.

Within the project, THALES will develop sensors that accurately generate, distribute, detect, and process signals with intricate waveforms to demonstrate key functionalities. More broadly, the outcomes of this project are also intended to benefit the wider ecosystem of indoor and outdoor autonomous robot manufacturers.

STARLight partners quotes
CEA-Leti
“At CEA, we are thrilled to contribute to the STARLight project by accelerating the development of innovative photonic technologies and components. Our expertise in heterogeneous III-V on Silicon integration will help overcome current limitations and meet future application needs. We are enthusiastic about collaborating with key partners such as STMicroelectronics to quickly promote our innovations and address industry constraints, ensuring Europe’s competitiveness in photonics.” – Sébastien Dauvé, CEO, CEA-Leti.

imec
“STARLight offers imec the opportunity to further explore alternative material options to scale its silicon photonics platform to higher transceivers data rates. Imec will leverage its expertise in advanced process development and photonics device research to identify the most suitable technology for the next generations of PIC for optical interconnects.” – Philippe Absil, Vice President R&D at imec.

NVIDIA
“With its contribution to STARLight consortium, NVIDIA continues to support the  advancement of the optical European industry.”

University Paris Saclay
“At University Paris Saclay, the centre for nanoscience and nanotechnology (C2N), a joint unit with also CNRS and University Paris Cité is more specifically involved to demonstrate advanced devices based on the use of new materials and new approaches compatible with STMicroelectronics PIC technology. The collaboration with the main EU players in silicon photonics is an opportunity to have accessed to state-of-the-art technology, to develop innovative devices addressing challenges for applications in silicon photonics and to interact with key industrial partners.” – Laurent Vivien, CNRS director at C2N

Sicoya
“STARLight brings together Sicoya’s long expertise in silicon photonics design and packaging with the transformative capabilities of ST’s PIC technology which allows for superior RF performance by cointegrating advanced photonics and high-speed electronics. The STARLight consortium stands as a strong example of European collaboration, providing the technological foundation for sustainable value creation in a rapidly evolving global market. At a moment where photonics, and especially silicon photonics, is getting widely recognized as a key driving technology for datacenter and AI networks, as well as numerous other critical high-volume applications, Sicoya has now the opportunity to leverage ST’s highly scalable and reliable platform for its future product lineup.” – Hanjo Rhee, CTO at Sicoya GmbH.

 Soitec
“We are proud to take part in the STARLight initiative, a key milestone in strengthening Europe’s leadership in advanced photonics. At Soitec, we are deeply committed to driving innovation at the substrate level—enhancing SOI technology and advancing novel materials to meet the evolving demands of next-generation photonic applications. Through this collaboration, we aim to raise the bar in manufacturing quality, improve scalability, and reduce the environmental footprint of substrate production. Together with our partners, we are laying the technological groundwork for a more competitive and sustainable photonics ecosystem in Europe.” – René Jonker, Executive Vice President, Edge and cloud AI division at SOITEC.

SteerLight
“STEERLIGHT is developing a new generation of 3D vision sensors—non-mechanical FMCW LiDARs—powered by groundbreaking silicon photonics technology that enables the entire system to be integrated onto a microchip. In the coming years, the light-vehicle components market will undergo a significant transformation driven by the rise of advanced driver-assistance systems (ADAS), which require compact, cost-effective, and high-performance LiDAR solutions. Securing sovereign sources of microelectronic components is a strategic priority for STEERLIGHT to enable large-scale production of this next generation of LiDAR systems. This is essential for European players to maintain a leading position in the global value chain and to ensure technological sovereignty in a highly competitive and rapidly evolving sector. The STARLight project will support this goal with ST’s proprietary advanced silicon photonics platform, bringing the capability to industrial maturity.” – François Simoens, CEO and co-founder of SteerLight.

STMicroelectronics
“ST has the technology leadership and the collaborative mindset to support this EU initiative that pushes the boundaries of technology. ST’s new proprietary silicon photonics technology will bring to the consortium the ability to integrate multiple complex components into one single chip, while our unique integrated device manufacturer (IDM) model will enhance silicon photonics innovations within ST 300mm platform for high-volume manufacturing.” – Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group at STMicroelectronics.  

Thales
“Integrated photonics is set to bring major breakthroughs in the critical system architectures developed by THALES, for sensing, communications, and signal processing. A drastic reduction in size and power consumption offers numerous operational benefits, especially for remote systems. The STARLight project offers a unique opportunity to build upon the STMicroelectronics platform a sovereign EU supply chain for silicon photonics technology.” – Bertrand Demotes-Mainard, VP, CTO Hardware of THALES.

Complete list of participants
AIXSCALE PHOTONICS; ALMAE TECHNOLOGIES; ANSYS; ARISTOTELIO PANEPISTIMIO AUTH EL Y THESSALONIKIS; COMMISSARIAT A L’ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ; DESIGN AND REUSE; ERICSSON; HELIC ANSYS ELLAS MONOPROSOPH AE; III-V LAB; INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM; KEYSIGHT TECHNOLOGIES; KNOWLEDGE DEVELOPMENT FOR POF SL; LUMIPHASE; MBRYONICS; NVIDIA; NCODIN; RHEINISCH-WESTFAELISCHE HOCHSCHULE AACHEN TECHNISCHE; SICOYA; SOITEC; STEERLIGHT; STMICROELECTRONICS; THALES; UNIVERSITA DEGLI STUDI DI PAVIA; UNIVERSITE PARIS-SACLAY.

In recent years, predictive technologies have revolutionized the healthcare landscape by shifting the focus from reactive treatment to proactive and personalized care. These advancements rely on data analytics, artificial intelligence, and machine learning to anticipate individual health needs, allowing for earlier interventions and more tailored treatment strategies. 

As the healthcare system faces rising costs and increasing demand, predictive technology offers a vital tool to improve outcomes, reduce expenses, and empower individuals to take greater control over their health. By identifying risks before they become crises, predictive solutions are transforming how we approach medical care at both the individual and population levels.

Improving Outcomes Through Early Detection

One of the most impactful benefits of predictive technologies is the ability to detect health issues before they become severe or life-altering. For instance, traumatic brain injuries (TBIs) can have profound and long-lasting effects, both physically and financially. According to Northwestern Now, the lifetime medical costs of a TBI can range from $85,000 to over $3 million. 

With predictive tools analyzing data from wearables, electronic health records, and imaging, physicians can identify early warning signs or high-risk behaviors that may lead to such injuries. In high-risk populations—like athletes, military personnel, and the elderly—these technologies help implement preventative measures that can dramatically reduce the severity or occurrence of TBIs.

Beyond injury prevention, early detection also applies to chronic diseases such as diabetes, hypertension, and heart disease. Predictive analytics can assess risk factors based on genetics, lifestyle, and environmental influences, prompting earlier lifestyle interventions or clinical screenings. This kind of foresight not only enhances patient outcomes but also significantly lowers the financial burden on healthcare systems.

Enhancing Accessibility and Responsiveness

Predictive technologies also play a critical role in making healthcare more accessible and responsive. Healthcare providers increasingly use real-time data to anticipate patient volume, allocate resources, and streamline urgent care services. According to the Urgent Care Association, 26.5% of adults have visited an urgent care facility within the past year, highlighting the growing reliance on immediate and convenient care options.

With predictive systems in place, urgent care centers can better prepare for spikes in demand due to seasonal illnesses, community events, or local outbreaks. Moreover, integrated technology platforms can flag patients who are likely to need urgent care based on their health history and current data trends. This allows for preemptive care coordination and helps reduce wait times, overcrowding, and unnecessary emergency room visits. For patients, this means quicker, more efficient care tailored to their needs—delivered at the right time and place.

Addressing Preventable Health Issues

A major strength of predictive technology is its potential to mitigate preventable health issues through education, monitoring, and timely intervention. For example, untreated dental conditions remain a widespread and often overlooked public health problem. According to Gitnux, around 19% of Americans have untreated cavities—an issue that can lead to more serious health complications if left unaddressed.

Predictive tools can track oral health data and habits, alerting users and healthcare providers about potential problems before they escalate. For patients who may lack regular dental access, mobile health applications and AI-powered virtual consultations can serve as critical touchpoints for prevention and education. In broader public health settings, these technologies allow organizations to identify high-risk groups and deploy targeted outreach programs to improve community health outcomes.

Furthermore, the use of predictive modeling in health insurance, wellness apps, and telemedicine platforms contributes to a more holistic and proactive approach to care. Personalized recommendations based on predictive insights help users make informed decisions about diet, exercise, and medication adherence—ultimately promoting long-term wellness and reducing avoidable complications.

Conclusion

Predictive technologies are reshaping the future of healthcare by enabling personalized, preventative, and data-driven approaches to health management. Whether it’s reducing the risk of costly injuries, improving the efficiency of urgent care services, or addressing preventable conditions like untreated cavities, the application of these tools leads to more effective and individualized care. 

As these technologies continue to evolve and integrate into our daily lives, they offer unprecedented potential to anticipate health needs, reduce systemic strain, and empower individuals to take control of their well-being. The path forward in healthcare is not just about treatment—it’s about prediction, prevention, and personalization powered by technology.

Bangalore - September 26, 2025 – VIAVI Solutions has expanded the functionality of its award-winning ONE LabPro testing and validation platform. Following the launches of the ONE-1600 and second generation ONE-1600IE solutions, the new ONE-1600ER module delivers enhanced features and enables comprehensive testing on a single platform for next-generation 1.6Tb optical components.

With AI and ML now firmly embedded in the fabric of computing and communications, infrastructure operators have begun deploying 1.6Tb optical transceivers alongside other enabling technologies throughout the network. The ONE LabPro platform supports high-capacity testing of infrastructure elements that are driving 1.6Tb speeds.

“Over the past year, we’ve been deeply engaged across the ecosystem, supporting the industry’s rollout of 1.6Tb and 200G SERDES technologies,” said Tom Fawcett, Senior Vice President and General Manager, Lab and Production, VIAVI. “VIAVI was first to market with a 1.6Tb solution, and over the past year, the ONE-1600 has remained the only test tool to successfully complete interoperability test against all known 200G/lane gearboxes and more than ten module vendors. Powered by the latest silicon and enhanced applications, the ONE-1600 is fully equipped to meet the demands of the accelerating 1.6Tb wave.”

The ONE-1600ER module extends the capabilities of the ONE LabPro platform with full Ethernet support based on the latest 802.3dj specification, including 1.6Tb, 8x200G testing essential for exercising and analyzing 200G lanes at 224G SERDES. It offers native support for Riding Heat Sink (RHS) OSFP 1600G modules and delivers comprehensive RFC2544 for full performance testing.

The solution includes full electrical and optical support (DAC – AOC, AEC, ACC), along with robust power and cooling management properties designed for the next generation of 1.6Tb coherent modules such as 1600ZR and 1600LR/ER. The ONE-1600 also offers inter-sublayer link training (ILT), and symbol muxing to full interoperability, both of which are new features in 802.3dj. 

AI-driven demand is also creating unprecedented scaling challenges for manufacturers of transceivers, VSFF/MPO connectors, and co-packaged optics (CPO). To help customers meet these challenges and accelerate time to market, VIAVI continues to advance its MAP-300 platform and inspection and cleaning portfolios with powerful new enhancements such as:

• High Density Variable Attenuator (mVOA-C2B) – A new 12 channel, single slot VOA module with millisecond time response and embedded power control optimized for parallel optic applications like DR8 and CPO. 
• PM-Fiber Optical Switching (mOSW-C1) – New low loss / high extinction ratio polarization maintaining fiber switches to support ELSFP and silicon photonics test applications.
• FiberChek ULTRA Connector Inspection – Enhancements to support volume manufacture of new connector and fiber types for high-density AI fiber deployments, including support for 80um core, non-contact and lensed connectors, as well as the ELSFP form factors.

The ONE-1600 and MAP-300 platforms will be on display at VIAVI’s stand C3313 at ECOC 2025 from September 29 – October 1 in Copenhagen, Denmark. In addition, VIAVI will be showcasing its comprehensive testing solutions for monitoring and certification of data center cabling, as well as performance monitoring solutions for high-capacity networks up to 800G.

In collaboration with Alphawave Semi, VIAVI will also demonstrate seamless PCIe 6.0 interoperability over an optical link at Alpha wave’s stand 1428. This collaboration includes the VIAVI Xgig 6P4 Exerciser and highlights the advancement of next-generation PCIe 6.0 deployments, leveraging cutting-edge optical interconnects to address growing demands for bandwidth, scalability, and energy efficiency.

Pune – September 25th, 2025: Tech Mahindra (NSE: TECHM), a leading global provider of technology consulting and digital solutions to enterprises across industries, announced an agreement with AMD, the leader in high-performance and adaptive computing, to accelerate enterprise transformation through next-generation infrastructure, hybrid cloud, and AI adoption. The collaboration aims to empower enterprises across key sectors, including manufacturing, finance, telecommunications, and healthcare, to harness the full potential of AI-driven infrastructure.

Through this collaboration, Tech Mahindra will integrate AMD’s compute engines and infrastructure with its Cloud BlazeTech solution to drive AI adoption across enterprise workloads. It plans to develop new solutions to enable enterprises to optimize workloads across end-user devices, servers, and cloud infrastructure, including public, private, and hybrid environments.

Mohit Joshi, CEO and Managing Director, Tech Mahindra, said, “Enterprises worldwide are scrambling to maximize ROI while navigating the complexity of hybrid and cloud-native ecosystems. Our strategic agreement with AMD is a step towards delivering next-generation hyper scalable solutions that seamlessly bridge on-site infrastructure with cloud-native capabilities. Through these solutions, we aim to enable customers to optimize performance across distributed environments without compromising speed, security, or control.”

Dr. Lisa Su, Chair and CEO, AMD said, “Together, AMD and Tech Mahindra will help enterprises accelerate their cloud transformation and AI adoption with the performance and efficiency they need to scale. By combining our EPYC processors and AMD Instinct accelerators with Tech Mahindra, we can create solutions that enable customers to deploy AI on compute infrastructure across hybrid and multi-cloud environments.” Tech Mahindra and AMD are embarking on a multi-year collaboration with a comprehensive roadmap focused on infrastructure optimization and AI enablement. Leveraging leadership in compute and software capabilities from AMD, and Tech Mahindra's deep industry experience, this collaboration will empower customers to harness AI-driven innovation, delivering critical business value and operational outcomes.

New Delhi, September 24, 2025: India Cellular & Electronics Association (ICEA), India’s premier industry body for mobile phones, electronics, and semiconductors manufacturing, regularly publishes production and export data, which corresponds with the government data on electronics production, especially smartphones. Recently however, some commentary has drawn improper conclusions related to smartphone exports by cherry-picking data, leading to wrong inferences and without proper context. The record needs to be set straight.

As prudent practice, trade data is usually compared across similar periods of different fiscals, and rarely across months in a single fiscal, to conclude meaningful trends. Month-over-month comparison which ignores sector-specific nuances, can be misleading for stakeholders. This is avoidable. The facts:

Smartphone exports in August and September 2025:

• Smartphone exports in August 2025, in contrast to the claims made, have increased by 39% from $1.09 bn in August 2024 to ~$1.53 bn in August 2025. Further, exports to the U.S. more than doubled, increasing by 148%, from USD 388 mn in August 2024 to USD 965 mn in August 2025.

• Smartphone exports to the U.S. in the first five months of FY26 reached USD 8.43 bn, compared to USD 2.88 bn during the same period in FY25, a 193% increase. In fact, the U.S. figure for April-August 2025 has already reached nearly 80% of the entire FY25 U.S. exports total of USD 10.56 bn. 

So contrary to the claims, there has been a massive increase - not decline - in smartphone exports to the US, both for the month of August and the five-month period across the current and previous fiscals.

• Overall, for the first five months of FY’26, overall smartphone exports reached a record breaking Rs.1 lakh cr or approx. $11.7 bn – a 55% increase over the $7.6 bn exports for the corresponding period in the previous fiscal.

 “Every export sector has its particular nuances based on multiple factors. Oversimplification of trade data - and worse - inferences based on monthly comparisons is misleading and avoidable. It’s important that subject matter experts are consulted before drawing sector-specific conclusions”, said Mr. Pankaj Mohindroo, Chairman, ICEA.

August and September are usually lowest smartphone export months, and for good reason, according to ICEA:

• Export data over the last five years shows that exports of smartphones are usually lowest during August and first half of September

• Firstly, companies launch new models in end-September and October ahead of festival season. As a result, global customers who are awaiting launch of new models, sharply reduce their purchase of smartphones during August. This leads to a drop in exports. Even customers who buy older models wait for the launch of new models since such launches are accompanied by deep discounts on older models. As a result, exports of older models also drop sharply. They pick up in October

• August and early September also sees large-scale retrofitting of plant and machinery to prepare for new models which leads to reduction in output, and in turn, exports. This is carefully planned to coordinate with demand.

• Finally, during September and early October, depending on Diwali and dates of festivals in India, exports drop till early to mid-October since companies divert production to serve the peak in domestic festival-led consumption. Post Diwali, global exports pick up since international demand increases for all models propelled by Thanksgiving holidays, Black Friday, Christmas and New Year sales in Western countries. It’s also worth noting that the smartphone sector has been the best performing export sector in India over the last five years since the launch of the PLI scheme, increasing its position from 167th in FY '15 to India’s largest export by HS code by FY’25. ICEA emphasised that India’s electronics manufacturing is at an inflection point, powered by government initiatives such as the PLI scheme, electronics manufacturing clusters, and efforts to rationalise tariffs and reduce cost disabilities. These measures, combined with geopolitical realignment and the trust placed by global brands, are transforming India into a manufacturing powerhouse.

Global software-solutions and digital engineering services provider, Hughes Systique Corporation (HSC) announces the opening of a new office facility in the capital city of Uttarakhand, Dehradun.

This expansion reflects HSC’s core commitment to customer-centricity, aiming to deliver personalized services to clients in the defense sector, in this region. With its expansion to Dehradun, HSC aims to celebrate and empower the region’s exceptional local talent—much of which remains undiscovered—while reinforcing its core commitment to Diversity by embracing the unique perspectives and innovative ideas that such talent brings.

Marking HSC’s fourth office in India, the new facility is nestled within IKSANA Workspaces at the Chrysler Tech Centre on Sahastradhara Road. The modern facility also offers breathtaking views of the Himalayan green landscapes from every corner of the workspace.

The office features dynamic, ergonomic environments that foster creativity and collaboration, allowing teams to ideate and innovate seamlessly. Employees can recharge in lush outdoor green zones overlooking the panoramic hills or unwind at the state-of-the-art cafeteria—an ideal setting for both productivity and relaxation.

The facility was inaugurated in the presence of Mr. Ajay Gupta, SVP – Global Sales & Marketing, Mr. Manoj Misra, AVP – Engineering, Mr. Prabhat Kumar Sahoo, AVP – Engineering, Mr. Sanjeev Dosajh, AVP – Administration, Mr. Sanjoy Sarkar, Sr. Director – Sales & BD and Mr. Vinod Sood, MD, Hughes Systique. Talking about the importance of this campus, Mr. Sood noted that, “The inauguration of Dehradun facility is not just a proud moment for us but is also testament to the value of customer centricity that we hold so dear since our inception days. This will allow us to work in complete cohesion with our customers in the defence space and also contribute towards making Bharat truly Atmanirbhar with the aspirational engineers of Uttarakhand and the northern region powering it”.

Munich, Germany – 23 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides CoolGaN™ power transistors to Universal Microelectronics Co., Ltd. (UMEC) for the company’s new 250 W adapter for networking Power over Ethernet (PoE) applications. Infineon´s CoolGaN transistors enable reliable, high-performance solutions and help UMEC develop safer and energy-efficient technology to address modern power system challenges. These solutions are ideal for power electronics across various industries, including telecommunications, industrial electronics, medical technology, and consumer electronics.

GaN-based power devices provide higher efficiency, reducing heat generation and energy consumption. They can operate at higher frequencies and power densities, enabling more compact designs, maximizing rack space utilization, and improving cooling in AI data centers, for example. Furthermore, reducing system size allows for more hardware content and improved air flow, which results in less wasted heat and ultimately decreases operational costs and the overall carbon footprint.

"We are excited to see our CoolGaN technology powering UMEC’s new 250 W adapter for networking applications. This collaboration demonstrates the potential of GaN to revolutionize the data center industry, enabling smaller, more efficient, and reliable power solutions," says Johannes Schoiswohl, Head of GaN Business Line at Infineon.

“Partnering with Infineon and utilizing their CoolGaN power transistors in our new 250 W adapter has allowed us to create a product that delivers exceptional efficiency and reliability,” says Richard Lin, Power Supply Product Manager at Universal Microelectronics. “This innovation aligns with our commitment to developing cutting-edge electronic solutions that meet the evolving demands of the networking industry.”

UMEC’s 250 W adapter offers excellent efficiency of 95 percent, a power density increase of around 39 percent. The CoolGaN transistors reduce power losses, enable switching at frequencies above 200 kHz, and improve thermal behavior, which is critical for compact and high-density power supplies. These are critical performance improvements in the global virtual networking market, which is expected to grow from $48.6 billion in 2024 to approximately $200 billion by 2030, at a CAGR of 26.5 percent .

Infineon's gallium nitride power transistors are driving digitalization and decarbonization, while enabling high-frequency operation, increasing efficiency and reducing system size in a wide range of applications. They are available in voltage classes from 60 V to 700 V and in a broad variety of packages.

Availability

For more information on CoolGaN™ products, visit the official product website.

Munich, Germany, and Amsterdam, The Netherlands – 22 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides its OPTIGA™ Trust M security solution to Thistle Technologies for its new cryptographic protection for on-device AI models to its security software platform for embedded computing products based on the Linux® operating system (OS) or on a microcontroller. The new capabilities in the Thistle Security Platform for Devices, along with Infineon OPTIGA Trust M security solution as tamper-resistant hardware-based root-of-trust, protect the valuable intellectual property (IP) in the AI models deployed in edge AI applications, and in the training data sets on which they are based.

The Thistle Security Platform for Devices that includes the Infineon OPTIGA Trust M security solution, provides ready-made, cloud-managed security components which integrate seamlessly into Linux OS-based devices and microcontrollers. Instead of building and maintaining a one-off cybersecurity stack, OEMs can deploy a proven, continuously updated foundation in hours, and scale it across large, heterogeneous fleets of devices. The Security Platform enables both secured boot and over-the-air (OTA) updating, and is compatible with a broad range of microprocessors, systems-on-chip (SoCs) and microcontrollers. Infineon OPTIGA Trust M security controller enables secured key provisioning, tamper-resistant key storage, and efficient cryptographic operations for encryption and decryption, taking care that only trusted, authenticated, and verified AI models are deployed in edge AI applications.

Thistle has extended its solution to include built-in protection for on-device AI models and data, using cryptographic keys stored in Infineon's tamper-resistant security controllers, OPTIGA Trust M. The three key features of the new Thistle Secure Edge AI solution are:

•  Hardware-backed model encryption – AI model encryption key is secured by OPTIGA Trust M security solution. Each device has a unique AES 256-bit key securely stored in OPTIGA Trust M, which is used to secure the AI Model encryption key. This means that the AES key is used for encryption and decryption inside the OPTIGA Trust M only. Even if a device is lost, decommissioned, or disassembled, the manufacturer’s IP embedded in the model is still efficiently protected. At launch, this feature is enabled on the Infineon OPTIGA Trust M security solution.

•  Secured model provenance – in OTA updates, the Thistle platform enables cryptographically signed, tamper-evident delivery of AI models and firmware directly from the training platform to the device, taking care that every installed instance of a model can be traced and verified.

•  Signed data and data lineage - device-generated or collected data can be signed on-device and tagged with provenance metadata. This means that downstream systems which might use the data to train or refine AI models can check the provenance of the data, and of the version of the model that the device was running when it generated the data.

Animesh Ranjan, Head of Partnerships & Ecosystem at Infineon says: “At Infineon, we are pleased to expand our collaboration with Thistle Technologies to deliver stronger protection for AI models running at the edge. By combining the OPTIGA Trust M security solution with the Thistle Security Platform, we enable device makers to safeguard their AI with hardware-anchored security that is both practical and scalable.”

Window Snyder, Chief Executive Officer of Thistle Technologies, says: “It is always our goal to make robust security capabilities accessible for device makers. With Infineon’s OPTIGA Trust M and the Thistle Security Platform, manufacturers can protect AI models and data with proven cryptography and deploy at scale quickly. Together we give customers a straightforward way to ship devices that can securely verify, encrypt, and update AI models."

The new Secure Edge AI solution, part of the Thistle Security Platform for Devices backed by Infineon OPTIGA Trust M as hardware-based root-of-trust, is available now.

More information about Infineon OPTIGA Trust M can be found at https://www.infineon.com/OPTIGA-TRUST-M. Embedded device developers who want a demonstration of the Secure Edge AI Solution can contact Thistle Technologies.

Visitors to The Things Conference and exhibition (Amsterdam, The Netherlands, 23-24 September 2025) can see a demonstration of these new capabilities at the Thistle Technologies booth B6.