Electronics news & updates

ROHM (TSE: 6963) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company. The new multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million.

Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented “This expanded agreement with SiCrystal will bring additional volumes of 150mm SiC substrate wafers to support our devices manufacturing capacity ramp-up for automotive and industrial customers worldwide. It helps strengthen our supply chain resilience for future growth, with a balanced mix of in-house and commercial supply across regions”.

“SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC substrate wafers for many years. We are very pleased to extend this supply agreement with our longstanding customer ST. We will continue to support our partner to expand SiC business by ramping up 150mm SiC substrate wafer quantities continuously and by always providing reliable quality”.said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.

Energy-efficient SiC power semiconductors enable electrification in the automotive and industrial sectors in a more sustainable way. By facilitating more efficient energy generation, distribution and storage, SiC supports the transition to cleaner mobility solutions, lower emissions industrial processes and a greener energy future, as well as more reliable power supplies for resource-intensive infrastructure like data centers dedicated to AI applications. More information about the advantages of SiC is available on ST.com: https://www.st.com/content/st_com/en/about/innovation—technology/SiC.html

New MOTIX™ motor gate driver IC: enabling easy migration from 12 V to 48 V systems and full support of functional safety requirements

Munich, Germany – 19 April 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the MOTIX™ TLE9140EQW gate driver IC for brushless DC motors targeting the demanding 24/48 V market. The TLE9140 is tailored for automotive motor control applications featuring higher voltage requirements from 24 V up to a maximum of 72 V, where higher system reliability and faster switching behavior are necessary. The IC is the ideal complement to Infineon's MOTIX MCU TLE987x and TLE989x 32-bit motor control SoC solutions but also suitable as 48 V BLDC driver with common MCUs on the market. Typical applications include pumps and fans, windshield wipers, the HVAC module, or e-compressors. In addition, the TLE9140 is applied as 3-phase motor gate driver for applications in commercial, construction, and agricultural vehicles as well as in light electric vehicles such as eBikes, eScooters or eMotorcycles.

“Our new motor gate driver IC allows customers to easily scale their existing 12 V MOTIX TLE987x and TLE989x motor control designs to 24 V or 48 V systems”, says Andreas Doll, Senior Vice President, and General Manager Smart Power at Infineon. "The TLE9140EQW enables the reuse of hardware and software designs, allowing our customers to shorten their time-to-market and optimize their development costs when moving to 24/48 V systems.”

The gate driver IC offers functional safety according to ISO 26262 ASIL B. It is housed in a small TS-DSO-32 package. The IC offers a high voltage capability up to 110 V, a gate driver capability of ~230 nC/MOSFET up to 20 kHz as well as SPI communication. It has an active low-side (LS) freewheeling function during V SM overvoltage (OV) and a wide range of important diagnostic and protection functions such as timeout-watchdog, drain-source monitoring, overvoltage, undervoltage, cross-current and over-temperature protection as well as off-state diagnostics.

In addition, the TLE9140 includes Infineon's patented gate shaping function, an adaptive MOSFET control that can compensate for fluctuations in the MOSFET parameters in the system. It automatically adjusts the gate current to achieve the desired switching behavior. This allows the system to be optimized in terms of electromagnetic emissions (EMI) by slower slew rates, while minimizing power dissipation through shorter dead times and shorter rise/fall times.

To accelerate the evaluation and design-in process, Infineon's MOTIX motor control ICs are accompanied by a wide range of software and tools. The TLE9140 evaluation board is user-friendly and enables rapid evaluation and prototyping. In addition, Infineon provides a configuration wizard and a device driver for the TLE9140 that provides a simple API for generating the control frames for the external bridge driver via SPI. Both are available free of charge.

Availability

The MOTIX™ TLE9140 motor gate driver is available now. More information is available at http://www.infineon.com/TLE9140.

• New STM32MP2 MPUs with 64-bit processing and edge AI acceleration

• Built for speed, security, and reliability

• Leverage STM32 ecosystem for rapid development and secure provisioning

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Digital transformation is happening everywhere, driving improvements including greater business productivity, better healthcare, and enhanced safety and energy management throughout buildings, utilities, and transport networks. Critical enabling technologies include cloud computing, data analytics, artificial intelligence (AI), and the Internet of Things (IoT). ST’s new STM32MP2 MPUs will power the next generations of equipment that create the fabric of this evolving digital world. These include industrial controllers and machine-vision systems, scanners, medical wearables, data aggregators, network gateways, smart appliances, and industrial and domestic robots.

 “Our embedded MPUs address the trend that’s pushing more workloads and greater demands to smart devices, often deployed at the IoT edge, for faster response and increased efficiency,” said Stephane Henry, General Purpose MPU Division General Manager, STMicroelectronics. “The new STM32MP2 devices we are announcing today extend the performance trajectory, introducing our most powerful processing engine, now adding edge AI, and supported by the STM32 ecosystem to accelerate product development.”

Architected for demanding and time-sensitive workloads, AI inferencing, and communication, and featuring state-of-the-art cyber security, the STM32MP2 MPUs are built to withstand up to 10-years’ continuous operation.

State-of-the-art security of the new STM32MP2 devices leverages ST’s proprietary secure hardware, anti-tamper controls, protected firmware, and secure provisioning, working with Arm®’s TrustZone® architecture, to keep sensitive data and keys secret. Certification to SESIP Level 3, the leading security test methodology for IoT devices and compliance, is ongoing for STM32MP2 MPUs to satisfy forthcoming tougher cyber-protection requirements in key territories worldwide. These include the US CyberTrust mark and stipulations in the EU’s Radio Equipment Directive that are due to become mandatory in 2025.

 “Together with ST, we tackled the challenge of connecting our devices to the cloud. From opening locks remotely to granting new access rights, our products are shaping the future of access management,” said Marco Temporiti, R&D Software Manager, ISEO. “Thanks to the STM32MP2 microprocessor with its strong encryption capabilities, we are able to build an industrial-grade gateway with unmatched reliability and security. The seamless integration with Yocto Linux has streamlined our development process, allowing us to innovate with ease. And, ST’s 10-year longevity program also ensures a long product lifecycle at reduced cost, setting a new standard in the industry.”

 “We worked with ST to build a 2-channel network audio adapter, leveraging the STM32MP1 series microprocessors to handle tasks like converting network digital audio signals for transmission and reception. The robust processing power, Ethernet connectivity and adaptable audio output interfaces were key considerations in choosing the STM32MP1 series for integration into our products,” said Yue XIONG, CEO, S-TRACK. “Now, we’re enthusiastic about the possibilities presented by ST’s latest MPUs, particularly the STM32MP2 series, which deliver improved power efficiency, enabling us to minimize cooling requirements in our enclosed casings. Additionally, the integrated Cortex-M co-processor eliminates the need for a separate microcontroller, and support for Gigabit Ethernet with precision time protocol (PTP) enables accurate data transfer and synchronization among devices. With this advanced technology, our goal is to broaden our product range to include 16-channel offerings.”

The first STM32MP2 MPUs are scheduled to enter volume production in June 2024. Sample requests and pricing information are available from local ST sales offices.

Technical notes for editors:

These are ST’s first MPUs to contain a 64-bit central processing unit (CPU), the Arm Cortex®-A35, which runs up to 1.5GHz to raise the main processing capability compared to the first-generation STM32MP1 devices.

The CPU is the center of a true heterogeneous processing engine that also contains a Cortex-M33 core. In addition, there is a graphics processor (GPU), neural processor (NPU), and a video processor (VPU). AI workloads can run on the CPU, GPU, or NPU depending on processor loading and application demands, for optimal performance and energy efficiency. In fact, the high efficiency of these MPUs permits system designs to go without active cooling, gaining advantages such as smaller size, silent operation, greater reliability, and reduced power consumption.

The 3D GPU supports up to 1080p displays and the powerful multimedia features also include a full-HD video pipeline with parallel LVDS and DSI interfaces. Together with a MIPI CSI-2 camera interface with ISP, these enhance support for cutting-edge machine-vision applications.

There are further powerful industrial interfaces, including up to three Gigabit Ethernet ports with a 2-port switch and support for Ethernet time-sensitive networking (TSN). There are also PCIe Gen2, USB 3.0, and three CAN-FD interfaces that ease integration in a wide variety of communication and control applications.

The devices are fully supported with STM32 development resources that are familiar to engineers working with ST’s STM32 microcontrollers (MCUs) and STM32 microprocessors. The STM32Cube ecosystem provides tools and dedicated MPU software packs including OpenSTLinux and OpenSTDroid for Android support. There are also evaluation boards that provide further help to simplify development and accelerate project completion.

For more information, please go to https://www.st.com/en/microcontrollers-microprocessors/stm32-arm-cortex-mpus.html. * STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.

Avnet Silica celebrated innovative start-ups alongside BayStartUP and Renesas

Brussels, Belgium, 19th April 2024 – Avnet Silica, an Avnet company (NASDAQ: AVT), announced GasVisor as the winner of the Advanced Electronics Challenge, an initiative which champions start-ups and young, innovative companies with hardware-based product ideas. The award ceremony took place during embedded world, 10th April, in Munich, Germany.

The shortlist consisted of a diverse range of start-up companies, namely enna systems, FLOW eye, GasVisor, HIVE Systems, HOREICH, Lemvos, MoxyByte, Smokebusters, and Alexx Energy Technologies. GasVisor’s solution automates the level measurement and ordering process of CO2 gas cylinders, allowing customers to use resources with increased efficiency while significantly reducing their CO2 footprint. Companies HOREICH and MoxyByte were awarded second and third place for their IoT sensor solution and natural language processing solutions, respectively.

The Advanced Electronics Challenge was held by BayStartUP, the Bavarian network for start-up financing, in partnership with leading European distributor Avnet Silica and trusted semiconductor manufacturer Renesas. The challenge began in October 2023 and welcomed submissions from companies servicing a range of sectors, such as automotive, Internet of Things (IoT), medical technology (MedTech), and energy. Over the course of six months, the initiative allowed start-ups and young companies to have their product ideas validated by industry experts, receiving professional advice and forming a market-ready solution. To celebrate this journey, a jury of technology, venture capital, and marketing strategy experts awarded the best-performing company.

“Oftentimes, entrepreneurs just entering the market have brilliant ideas but lack the guidance and adequate support to succeed. We are delighted to make a positive contribution to the journey of such companies through offering support at a technical and strategic level, as well as offering them a clear roadmap to market,” said Frank Stephan, Regional Vice President Sales DACH & Netherlands, Avnet Silica. “GasVisor has impressed us through its automation innovation and commitment to building a sustainable future. We look forward to their continued success.” More information about the Advanced Electronics Challenge can be accessed here.

HONOLULU, HI (APRIL 19, 2024) – For the last 44 years, the IEEE Symposium on VLSI Technology & Circuits has delivered a unique convergence of technology and circuits for the microelectronics industry, with maximum synergy between both domains. The 2024 IEEE Symposium on VLSI Technology & Circuits is organized around the theme: “Bridging the Digital & Physical Worlds with Efficiency & Intelligence.” The five-day event will be fully in-person with live sessions at the Hilton Hawaiian Village, Honolulu, HI, from June 16 to 20, 2024, and on-demand access to technical sessions starting the following week. The Symposium will feature the latest VLSI technology developments, innovative circuit design, and the applications they enable, such as artificial intelligence, machine learning, IoT, wearable/implantable biomedical applications, big data, cloud/edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles.

The Symposium continues to be the microelectronics industry’s premiere international conference integrating technology, circuits, and systems with a range and scope like no other conference. In addition to the technical presentations, the Symposium program will feature a demonstration session, an evening panel discussion, joint focus sessions, short courses and workshops that provide technical content relevant to the Symposium theme.

Plenary Sessions

“Making Sense At The Edge,” by Dr. Ahmad Bahai, Senior VP & Chief Technical Officer, Texas Instruments – Semiconductor technology provides advanced embedded sensing and actuating technologies that enable data-driven intelligent systems. Advances in nanotechnology, analog and digital signal processing, embedded/edge machine learning algorithms, connectivity, and battery technology have enabled high performance sensing and actuation which was inaccessible a decade ago. Yet in many sensing and actuating modalities, nature offers a significantly more efficient edge computing sensory solution leveraging the hierarchical physical, analog and digital signal processing to optimize performance and energy consumption.

“Mobility Evolution: Electrification & Automation,” by Dr. Kazuoki Matsugatani, Senior Director, R&D Center, DENSO Corporation – The automotive industry faces two challenges: environmental impact reduction and safety enhancement. Efforts to achieve zero CO2 emissions and zero traffic fatalities are urgent issues for the coming decade. Electrification profoundly alters vehicle mechanics while automation integrates software and information technologies into the vehicle system. In both electrification and automation, the evolution of semiconductor devices is key. For electrification, power devices and analog sensing devices managing current to and from the battery to the motor are both essential for vehicle operation. In automation, sensors (including camera, radar, lidar and sonar) to monitor the vehicle are required, together with high-performance computers and wireless communication to process this sensor data.

“Wireless and the Future Hyperconnected World,” by Dr. Maryam Rofougaran, CEO & Co-Founder, Movandi Corporation – Wireless networks will be the backbone of a hyperconnected world by providing high-speed, low-latency data transmission. Through a fusion of terrestrial cellular networks, satellite communication, and local wireless area networks, this infrastructure will seamlessly support continuous connectivity for billions of devices providing essential needs such as emergency response, remote work, automation, and operational efficiency. The integration of sensing technologies enriches wireless networks with contextual awareness and environmental intelligence. With billions of sensors capturing real-time data, these networks empower AI-driven algorithms to optimize performance, anticipate user requirements, and overcome potential obstacles. Semiconductor breakthroughs are pivotal in realizing intelligent wireless connectivity. Advanced chipsets, featuring embedded AI accelerators, empower AI algorithms to process data locally and make informed decisions in near real-time. Energy-efficient semiconductor designs also extend device battery life.

 “Photonics-Electronics Convergence Devices Accelerate IOWN,” by Mr. Hidehiro Tsukano, Senior VP of R&D, NTT Corporation – IOWN (Innovative Optical Wireless Network) is an initiative to create a sustainable society that cannot be achieved with current network infrastructure. By taking advantage of optical technology for across-the-board network communications and computing, NTT is aiming to provide a new information &communications technology (ICT) platform that features high-capacity, high-quality, low-latency, and low-power consumption. The primary requirements for device technology are ultra-fine semiconductor manufacturing processes, ultra-high-density assembly, and photonics-electronics convergence. Thus, NTT is promoting research and development in accordance with the roadmap to incorporate optical communications technology into the details of computing components step by step. This challenge could lead to the ultimate computing capacity that extends Moore’s Law, and we believe it can resolve the ever-increasing power consumption problem of information processing and contribute to the realization of carbon neutrality.  

Focus Sessions

The Symposium program integrates technology & circuit topics with a series of four joint focus sessions to present papers with both areas, including: 1) Memory-centric computing for large language models; 2) Thermal management & power delivery in 3D integration; 3) Processors & Compute; 4) Next-generation wireless technologies. In addition, there are two Technology focus sessions on: 1) Backside silicon power delivery & signaling; 2) Oxide semiconductor applications in BEOL.

Short Courses on Key VLSI topics

Two full-day short courses will be featured:

Technology Short Course “Advanced VLSI Technologies for Next Generation Computing” is focused on Transistor Scaling; BEOL Interconnects; Memory Technology Evolution; Backside Power Delivery; Process Technologies, Metrology & Inspection for Logic; In-memory computing and Si Photonics

Circuits Short Course “Circuits & Systems for Heterogeneous Integration” examines subjects including Die-to-Die Connectivity; Memory Co-Integration; Wafer-scale Integration; and Heterogeneous Integration for Automotive Applications.

In addition, the joint Evening Panel Session has been announced: “Impact of Generative AI on the Semiconductor Industry – Technology, Circuits, & EDA”

How can we make sure the thousands of newly explored materials in academic, government, and industry labs are relevant to manufacturing technologies?   What are the fundamental factors to convert a success story to a technology transfer? Is there anything to be learned from history? Dr. Masato Motomura from Tokyo Institute of Technology will moderate a panel of distinguished guests from across industry and academia to offer their insights and thoughts to share their experience on this important topic. In addition, there will be an audience-engaging “game show” segment.

Demonstration Session

Introduced in 2017, the popular in-person demonstration session will again be part of the Symposium program, providing participants an opportunity for in-depth interaction with authors of selected papers from both Technology and Circuits sessions. Approximately 15–20 table-top presentations will demonstrate device characterization, chip operational results, and potential applications for circuit-level innovations. The best demo will be selected by Symposium attendees.

Workshops

A series of workshop sessions will be held during the Symposium program to provide additional learning opportunities on topics adjacent to the Symposium program. This year, there are five workshops:

Standing Workshop

• This four-hour workshop covers open-source design, including EDA and chiplets.

Parallel Workshops

These two-hour workshop sessions are held in parallel:

• RF and Analog 3D integration

• Novel metals for advanced interconnect

• Recent art in balancing analog vs. digital in mixed-signal circuits

• Interfacing chips with biology

Special events at the Symposium include mentoring events for Women in Engineering and Young Professionals, sponsored by the IEEE Electron Devices Society and the Solid-State Circuits Society.

Best Student Paper Awards for each track Symposium are chosen based on the quality of the papers and presentations. The recipients will receive a monetary award, travel cost support, and a certificate. For a paper to be reviewed for this award, the lead author and presenter of the paper must be enrolled as a full-time student at the time of submission and must indicate on the web submission form that the paper is a student paper.

Further information about the Symposium is available at: http://www.vlsisymposium.org.

Sponsoring Organizations

The IEEE Symposium on VLSI Technology & Circuits is sponsored by the IEEE Electron Devices Society, in cooperation with the IEEE Solid-State Circuits Society and Japan Society of Applied Physics, in cooperation with the Institute of Electronics, Information and Communication Engineers.

Munich 19-Apr-2024

The European Open Testing and Integration Centre (OTIC) in Berlin, located at the Deutsche Telekom innovation campus facilitated by i14y Lab, provides high-quality and comprehensive testing for O-RAN-based products and solutions as well as validation and integration services to a supply chain of open radio access network vendors. In their first successful certification of an O-RAN radio unit (O-RU) according to O-RAN ALLIANCE (O-RAN) as part of the O-RAN Certification and Badging Program, i14y Lab has relied on the integrated solution for O-RU conformance testing by Rohde & Schwarz and VIAVI.

Rohde & Schwarz and VIAVI Solutions, Inc. have supported the European OTIC in Berlin in the process of awarding O-RAN conformance certification for international markets. The certification of an indoor O-RU of the LPRU-series from VVDN Technologies was completed according to O-RAN specified processes and procedures as defined by the O-RAN ALLIANCE. This marks the first certification accomplished by a European test lab.

The i14y Lab is an open lab for interoperability testing of disaggregated telco systems, such as open RAN, led by Deutsche Telekom together with consortium partners. The test and measurement expert Rohde & Schwarz is one of the consortium members and offers an integrated solution for conformance testing of O-RAN Radio Units together with VIAVI Solutions. Both companies are active in specifications development in the O-RAN ALLIANCE and have combined their industry-leading capabilities: The solution consists of the VIAVI TM500 O-RU Tester and the R&S SMBV100A vector signal generator (VSG), R&S FSVA3000 signal and spectrum analyzer and Vector Signal Explorer (R&S VSE) software from VIAVI TM500, with the O-RU Test Manager from VIAVI as single point of control, providing a seamless user experience.

All approved Open Testing and Integration Centers (OTIC) worldwide cooperate with the O-RAN ALLIANCE in the O-RAN Certification and Badging Program, which represents a comprehensive mechanism to ensure confidence in O-RAN solutions within the industry. O-RAN is making radio access networks more open, disaggregated and flexible. Opening the network architecture can foster innovation, accommodate individual needs and enhance network efficiency. Therefore, O-RAN is experiencing rapid advancement and growth in the technology ecosystem.

VVDN Technologies has developed the LPRU-series 5G NR Radio Units (O-RU) to be fully compliant to O-RAN ALLIANCE standards. The VVDN 4T/4R Split 7.2 radios are covering 5G NR TDD bands n77, N78 and n79. They are compact, lightweight, easy to install, and provide optimal coverage for indoor applications. The design has completed the extensive 3GPP and O-RAN compliance testing.

The O-RU verification followed the O-RAN fronthaul conformance test specification defined by O-RAN WG4, including the Control, User, and Synchronization plane (CUS-Plane) and the Management-plane (M-Plane). WG4’s objective is to deliver open fronthaul interfaces, in which interoperability between Distributed Unit (DU) and Radio Unit (RU) from multiple vendors can be realized.

For general information on O-RAN testing solutions from Rohde & Schwarz, visit: http://www.rohde-schwarz.com/wireless/O-RAN

India – April 18, 2024: LTIMindtree [NSE: LTIM, BSE: 540005], a global technology consulting and digital solutions company, has collaborated  with Vodafone, a global leader in managed Internet of Things (IoT), with over 175 million connections worldwide, supporting a wide range of business-critical applications. Through this partnership, LTIMindtree will offer connected and smart IoT solutions, powered by its Insight NXT platform (iNXT) and Vodafone’s IoT Managed Connectivity, that will enable Industry X.0 and digital transformation across multiple vertical sectors. 

LTIMindtree’s iNXT Business Unit brings Technical and Functional components, and together with Vodafone’s IoT Managed Connectivity solutions it will deliver to solve complex business challenges. By drawing on a best-in-class ecosystem of partners, LTIMindtree will empower clients to maximize their efforts across revenue acceleration through newer business models, cost efficiency and sustainability, leveraging Smart IoT and Industry X.0. LTIMindtree, enabled by Vodafone will provide solutions that deliver advance capabilities in AI, machine learning, predictive maintenance, digital twin, supply chain visibility, sustainability, energy management, worker safety, sensorization of assets, augmented reality, and virtual reality training.

Gemma Barsby, UK Head of IoT, Vodafone, said, “Our partnership with LTIMindtree means Vodafone can support the real-time delivery of IoT managed services to their clients and empower them in driving cost efficiencies and greater productivity. As a global IoT provider we look forward to collaborating with LTIMindtree to mutually grow our market share in the Industrial 4.0 and Digital Transformation domain.”

Through this partnership, LTIMindtree will design highly scalable, end-to-end solutions by leveraging the power of IoT, Metaverse, Artificial Intelligence and Machine Learning and deliver secure, connected ecosystems and outcomes over Vodafone’s “Managed IoT Connectivity” Network. Monish Mishra, Chief Business Officer- iNXT, LTIMindtree, said, "In today’s highly distributed yet interdependent economy, continuous innovation and access to connected ecosystems to deliver immersive experiences, is vital for growth and differentiation. We are excited to collaborate with Vodafone and enhance our proposition on Industry X.0 and Industrial Digital transformation. We remain committed to working with customers across industries within UK & Europe and getting them to the future, faster.”

SANTA CLARA, CA – April 16, 2024 – Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced an enhanced partnership with Micron Technology, Inc. (Nasdaq: MU) (“Micron”), which includes:

•   Expanding the scope and extending the term of our software license and support services.

•  Securing a $5.0 million investment from Micron in the form of a senior subordinated convertible promissory note, reflecting our partnership with Micron for the development of Silvaco’s FTCO™ digital twin modeling tools.

Dr. Babak Taheri, Silvaco’s CEO, remarked, “We have combined our expertise in semiconductor technologies with machine learning and data analysis to develop an artificial intelligence-based solution named fab technology co-optimization, or FTCO™, for wafer-level fabrication facilities.” Dr. Taheri continued, “FTCO™ uses manufacturing data to perform statistical and physics-based machine learning software simulations to create a computer model or ‘digital twin’ of a wafer that can be used to simulate the fabrication process. Customers can utilize this model to run simulation experiments to understand and enhance wafer yield without the need to run physical wafers which can be time-consuming and expensive.” “Micron is excited to strengthen our partnership with Silvaco,” said Dr. Gurtej Sandhu, principal fellow of Technology Pathfinding at Micron Technology. “Silvaco’s AI and digital twin solution is enabling us to accelerate our groundbreaking advancements in memory and storage.”