Indium Corporation to Feature Ultra-Low Voiding Indium10.1HF Solder Paste at SMTAI 2017

Indium Corporation will feature its ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at the SMTA International Technical Conference, Sept. 17-21, in Rosemont, Ill.

Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.

The flux chemistry is specifically engineered to improve reliability with:

High ECM performance under low standoff components
Outstanding solder beading
Very low bridging, slump, and solder balling
Resistance to head-in-pillow
Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
High print transfer efficiency with low variation
Indium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN14582.

For more information about Indium Corporation’s low-voiding solder pastes, visit or see Indium Corporation at booth 517.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

Share this post