CyberOptics Demonstrates Industry-Leading Airborne Particle and Ultra High-Resolution MRS Sensors at SEMICON Taiwan

Cyberoptics 0114_APS3CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will demonstrate its next generation Airborne Particle Sensor™ technology (APS3) 300mm with new ParticleSpectrum™ software at SEMICON Taiwan, September 5-7at the Nangang Exhibition Center in Taipeiin booth #L312.CyberOptics’ WaferSense® APS3speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly detecting, identifying and monitoring airborne particles. Now in a thinner and lighter form factor to travel through semiconductor tools with ease, the APS3 offers

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IC Package Inspection

leading accuracy and sensitivity valued by equipment and process engineers.“Semiconductor fabs worldwide have adopted our Airborne Particle Sensors,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “We have further advanced the technology that they rely on to significantly improve their yields and tool uptime.” The APS3 solution incorporates ParticleSpectrum software – a completely new, touch-enabled interface with user-friendly functionality, making it simple to read, record and review small to large airborne particle data and see the effects of cleanings, adjustments and repairs in real-time.At SEMICON Taiwan, CyberOptics will also demonstrate the proprietary 3D Ultra High-Resolution Multi-Reflection Suppression (MRS) Sensor technology that meticulously identifies and rejects reflections caused by shiny components and surfaces. Effective

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Wafer Bump Inspection

suppression of multiple reflections is critical for highly accurate measurements. Offering an unmatched combination of accuracy and speed, MRS sensors are widely used for inspection and measurement in the SMT, metrology and in semiconductor markets. This best in class,ultra high-resolution technology used in back-end inspection applications, is

ideally suited for IC package, wafer bump inspection and mid-end semiconductor applications where the highest degree of precisionis required.For more information about the entire line of CyberOptics solutions please visit

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