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NEPCON Vietnam 2017, scheduled during 13-15 September 2017 in Hanoi, will deliver the platform for technology demonstration. Heilind Asia will exhibit at I06 of Singapore Pavilion, together with TE Connectivity, a global technology leader in unmatched breadth of connectivity and…
TE Connectivity Introduces the Chip Connect Cable Assemblies

TE Connectivity Introduces the Chip Connect Cable Assemblies, the Chip Connect internal faceplate-to-processor cable assemblies enable Intel Omni-Path Architecture (OPA) by mating directly with LGA 3647 sockets at the processor and Intel Omni-Path Internal Faceplate Transition (IFT) connectors at the…