Circuit Protection for Electric Drive Trains
By Carlos Castro, James Colby and Stefan Edenharter, Littelfuse Although Hybrid and Electric Vehicles are significantly more energy-efficient than conventional...
DuPont 3D Printing Filaments are Now Available for Purchase in China
SHANGHAI, Dec. 11, 2017 ─ DuPont is pleased to announce that customers can now purchase DuPont™ Hytrel® thermoplastic elastomer and DuPont™...
An Innovative Approach of Multispectral Sensor in Biometric Authentication
Time-Attendance and Access Control have grown into a mainstream product and it is gaining significant growth in the market. Security...
Silicon Labs Tackles High-Speed Transceiver Clocking with New High-Performance Oscillators
-- Si54x Ultra Series™ I2C-Programmable XOs Provide Superior Jitter Performance and Frequency Flexibility for 100/200/400G Applications -- -- Expands Portfolio...
Introducing an MCU Guy to FPGA
By JPaul Carpenter, Mouser Electronics I am a long-time microcontroller (MCU) person with a particular interest in using low-overhead modules...
Amphenol ICC USB 3.1 Type C connectors deliver 100W power in a reversible form factor – now available through TTI, Inc.
Data, power, audio and video in Gen 1 and Gen 2 versions with performance speeds up to 5Gb/s and 10Gb/s...
Lattice Diamond Software Receives Road Vehicles Functional Safety Qualification (ISO 26262)
TÜV-certified Design Methodology Enables Lattice Automotive Grade FPGAs to Meet Latest Safety Requirements, Accelerate Time-to-Market and Reduce Cost Expands safety...
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