Indium Corporation Technology Expert to Present at Laser Job Technology Forum

Indium Corporation’s Greg Wade, global technical support engineer, will share his expertise at the LaserJob Technology Forum on Nov. 6 in Furstenfeld, Germany. Wade’s presentation, How to Get the Absolute Most Out of Your Stencil Printing Process, discusses the latest techniques for creating a robust stencil…
Akrometrix LLC to Present PoP Reflow Assembly Findings at IEMT

ATLANTA, GA ― October 2014 ― Akrometrix LLC, the leader in elevated temperature surface characterization, will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT), scheduled to take place November 11-13, 2014 at the Renaissance Johor Bahru…
ViTrox Technologies to Present at Etek’s Technology Event in Romania

PENANG MALAYSIA – October 2014 –ViTrox Technologies, a solutions provider of innovative, advanced and cost-effective automated vision inspection systems and equipment for the semiconductor and electronics packaging industries, will participate in the Etek Technology Event, scheduled to take place Oct.…
ACME PCB Assembly Partners with Ersa for Reworking Large PCBs

Plymouth, WI — October 2014 — Kurtz Ersa North America, a leading supplier of electronics production equipment, announces that ACME PCB Assembly has purchased an IR/PL 650 XL Rework system. Reworking large PCBs can be extremely difficult, and Ersa has…
MicroCare Unveils New and Improved TidyPen® Sticky Stuff Remover

MicroCare Corp. unveiled today the new and improved TidyPen® ‘60-second sticky stuff remover’.  With thousands of the pocket-sized TidyPen® label removers sold monthly, the TidyPen® tool is a must-have time-saver for electronics manufacturing, repair shops, medical facilities, classrooms and any…